Flight packaged onboard checkout systems development unit Final report
Flight-packaged computer-controlled checkout system for manned spacecraft
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Flight-packaged computer-controlled checkout system for manned spacecraft
Electronic packaging techniques and design criteria for preventing corona discharges in high-voltage circuitry
Maintainability design criteria for packaging of spacecraft replaceable electronic equipment
Thermal evaluation of early Apollo scientific experiment package isotope heater models in MSC 1.5 megawatt arc heated facility
Simulation test reports for multiple docking adapter package-fastening devices
Versatile, low cost packaging technique for spacecraft electronics
Improvements in silicon solar cell cover glass assembly and packaging using FEP Teflon
Electronic packaging and cabling on Capsule System Advanced Development Lander for Mars rough landing
Strap-on ferry package for reusable spacecraft and launch vehicles subsonic lift/drag increase
ATS attitude stabilization boom packages, describing torque transmission, drum synchronization, electrical isolation, lubrication, etc
LSI packaging effects on systems design, discussing physical integration
Strap-on ferry package for reusable spacecraft and launch vehicles subsonic lift/drag increase
General Optimization Software Package for Electrical network and system design, noting application to engineering problems and education
High density packaging of micrologic flatpacks using high interconnection method for two-side use of double-sided card in space flight applications
Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.
Flight control software package for digital flight control and landing system of CH-46C helicopter
Guidance software package for digital flight control and landing system of CH-46C helicopter
System packaging of LSI circuits