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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 829 records · Page 46
All sourcesNASA NTRSDOE OSTI
DOE OSTI2015

High- T c superconductivity at the interface between the CaCuO 2 and SrTiO 3 insulating oxides

At interfaces between complex oxides it is possible to generate electronic systems with unusual electronic properties, which are not present in the isolated oxides. One important example is the appearance of superconductivity at the interface between insulating oxides, although, until now, with very low T c . We report the occurrence of high T c superconductivity in the bilayer CaCuO 2 /SrTiO 3 , where both the constituent oxides are insulating. In order to obtain a superconducting state, the CaCuO 2 /SrTiO 3 interface must be realized between the Ca plane of CaCuO 2 and the TiO 2 plane of SrTiO 3 . Only in this case can oxygen ions be incorporated in the interface Ca plane, acting as apical oxygen for Cu and providing holes to the CuO 2 planes. In addition, a detailed hole doping spatial profile can be obtained by scanning transmission electron microscopy and electron-energy-loss spectroscopy at the O K edge, clearly showing that the (super)conductivity is confined to about 1–2 CaCuO 2 unit cells close to the interface with SrTiO 3 . The results obtained for the CaCuO 2 /SrTiO 3 interface can be extended to multilayered high T c cuprates, contributing to explaining the dependence of T c on the number of CuO 2 planes in these systems.

36 MATERIALS SCIENCE↗
DOE OSTI2023

First principles study of the electronic structure of the Ni 2 MnIn / InAs and Ti 2 MnIn / InSb interfaces

We present a first principles study of the electronic and magnetic properties of epitaxial interfaces between the Heusler compounds, Ti 2 MnIn and Ni 2 MnIn, and the III-V semiconductors, InSb and InAs, respectively. We use density functional theory (DFT) with a machine-learned Hubbard U correction determined by Bayesian optimization. Here, we evaluate these interfaces for prospective applications in Majorana-based quantum computing and spintronics. In both interfaces, states from the Heusler penetrate into the gap of the semiconductor, decaying within a few atomic layers. The magnetic interactions at the interface are weak and local in space and energy. Magnetic moments of less than 0.1 µB are induced in the two atomic layers closest to the interface. The induced spin polarization around the Fermi level of the semiconductor decays within a few atomic layers. The decisive factor for the induced spin polarization around the Fermi level of the semiconductor is the spin polarization around the Fermi level in the Heusler, rather than the overall magnetic moment. As a result, the ferrimagnetic narrow-gap semiconductor Ti 2 MnIn induces a more significant spin polarization in the InSb than the ferromagnetic metal Ni 2 MnIn induces in the InAs. This is explained by the position of the transition metal d states in the Heusler with respect to the Fermi level. Based on our results, these interfaces are unlikely to be useful for Majorana devices but could be of interest for spintronics.

36 MATERIALS SCIENCE↗
DOE OSTI2018

A Comparative Study of Interface Techniques for Transmission and Distribution Dynamic Co-Simulation

Transmission and distribution (T&D) dynamic co-simulation is a practical and effective approach to leverage existing simulation tools for transmission and distribution systems to simulate dynamic stability and performance of T&D systems in a systematic manner. Given that these tools are developed as stand-alone programs and there are inherent differences between them, interface techniques become critical to “bridge” them. Two important unsolved questions are: 1) which interface technique is better and should be used, and 2) how the modeling and simulation capabilities in these tools that are available and can be exploited for co-simulation should be considered when selecting an interface technique. This paper presents a comprehensive study for different interface techniques that can be employed for T&D dynamic co-simulation. The study provided insights to the pros and cons of each interface technique, and helped researchers make informed decisions on choosing a proper interface technique.

Huang, Qiuhua↗
DOE OSTI2019

Role of Caulobacter Cell Surface Structures in Colonization of the Air-Liquid Interface

In aquatic environments, Caulobacter spp. can be found at the boundary between liquid and air known as the neuston. I report an approach to study temporal features of Caulobacter crescentus colonization and pellicle biofilm development at the air-liquid interface and have defined the role of cell surface structures in this process. At this interface, C. crescentus initially forms a monolayer of cells bearing a surface adhesin known as the holdfast. When excised from the liquid surface, this monolayer strongly adheres to glass. The monolayer subsequently develops into a three-dimensional structure that is highly enriched in clusters of stalked cells known as rosettes. As this pellicle film matures, it becomes more cohesive and less adherent to a glass surface. A mutant strain lacking a flagellum does not efficiently reach the surface, and strains lacking type IV pili exhibit defects in organization of the three-dimensional pellicle. Strains unable to synthesize the holdfast fail to accumulate at the boundary between air and liquid and do not form a pellicle. Phase-contrast images support a model whereby the holdfast functions to trap C. crescentus cells at the air-liquid boundary. Unlike the holdfast, neither the flagellum nor type IV pili are required for C. crescentus to partition to the air-liquid interface. While it is well established that the holdfast enables adherence to solid surfaces, this study provides evidence that the holdfast has physicochemical properties that allow partitioning of nonmotile mother cells to the air-liquid interface and facilitate colonization of this microenvironment. In aquatic environments, the boundary at the air interface is often highly enriched with nutrients and oxygen. Colonization of this niche likely confers a significant fitness advantage in many cases. This study provides evidence that the cell surface adhesin known as a holdfast enables Caulobacter crescentus to partition to and colonize the air-liquid interface. Additional surface structures, including the flagellum and type IV pili, are important determinants of colonization and biofilm formation at this boundary. Considering that holdfast-like adhesins are broadly conserved in Caulobacter spp. and other members of the diverse class Alphaproteobacteria , these surface structures may function broadly to facilitate colonization of air-liquid boundaries in a range of ecological contexts, including freshwater, marine, and soil ecosystems

54 ENVIRONMENTAL SCIENCES↗
DOE OSTI2022

The Critical Stack Pressure to Alter Void Generation at Li/Solid-Electrolyte Interfaces during Stripping

The lithium stripping process generates vacancies, which may accumulate as voids and lead to uneven current distribution and dendrite growth in the following plating cycles. A stack pressure is typically required during stripping, but how to optimize the stack pressure is not clear. In this work, extremely lithiophilic Li/Li 2 O and lithiophobic Li/LiF interfaces were used to reveal the combining effect of interface interaction and stack pressure induced lithium creep on the stripping critical current density (CCD). A multiscale simulation scheme with Density Functional Theory (DFT), kinetic Monte Carlo (KMC) simulations, and an analytical model was developed. The analytical model predicted lithiophobic interfaces require a higher stack pressure than lithiophilic interfaces to reach the same CCD. The KMC simulations also showed higher stack pressure is needed at lithiophobic interfaces to accelerate Li vacancy diffusion into the bulk and maintain a flat surface. This stack pressure needs to be high enough to alter the Li forward-and-backward hopping barriers at the interface. This multiscale simulation scheme illustrates the importance to include the chemical-mechanical effects during Li stripping morphology evolution. It can be used to design ideal interlayer coating materials to maintain a flat Li surface during cycling.

25 ENERGY STORAGE↗
DOE OSTI2023

An implicit barotropic mode solver for MPAS-ocean using a modern Fortran solver interface

Here, we demonstrate use of a modern Fortran solver interface to manage solver algorithms for an implicit barotropic mode solver in the Model for Predictions Across Scales-Ocean (MPAS-O). ForTrilinos, a Fortran interface to Trilinos that contains a large collection of solver capabilities written in C++, has been implemented in MPAS-O to provide access to a suite of linear solver options. By virtue of the simplified wrapper and interface generator (SWIG) automation tool that generates modern Fortran interfaces to C++ code, we were able to implement the Fortran solver interface in MPAS-O using a familiar Fortran coding style while minimizing performance degradation. The ForTrilinos solver interface is written within MPAS-O’s time stepping modules as a subroutine in conjunction with MPAS-O code. Applied to an idealized ocean and a high-resolution realistic ocean test case, parallel performance of ForTrilinos solvers is examined. It is found that parallel scalability of the ForTrilinos solvers is highly dependent on the number of global synchronization points per solver iteration in each iterative solver algorithm. ForTrilinos solvers perform best compared to the Fortran hand-crafted (FHC) solver when the amount of work per processor is large enough. However, parallel scalability is better with the FHC solver and so when the work per core is modest FHC outperforms ForTrilinos. The intercomparison between the ForTrilinos and FHC solvers reveals that this performance hit in the ForTrilinos solver mostly comes from the global synchronization process, while suggesting that the matrix-vector multiplication process in the FHC solver needs to be optimized for better performance.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2014

Proposing an Abstracted Interface and Protocol for Computer Systems

While it made sense for historical reasons to develop different interfaces and protocols for memory channels, CPU to CPU interactions, and I/O devices, ongoing developments in the computer industry are leading to more converged requirements and physical implementations for these interconnects. As it becomes increasingly common for advanced components to contain a variety of computational devices as well as memory, the distinction between processors, memory, accelerators, and I/O devices becomes increasingly blurred. As a result, the interface requirements among such components are converging. There is also a wide range of new disruptive technologies that will impact the computer market in the coming years, including 3D integration and emerging NVRAM memory. Optimal exploitation of these technologies cannot be done with the existing memory, storage, and I/O interface standards. The computer industry has historically made major advances when industry players have been able to add innovation behind a standard interface. The standard interface provides a large market for their products and enables relatively quick and widespread adoption. To enable a new wave of innovation in the form of advanced memory products and accelerators, we need a new standard interface explicitly designed to provide both the performance and flexibility to support new system integration solutions

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2014

Proposing an Abstracted Interface and Protocol for Computer Systems

While it made sense for historical reasons to develop different interfaces and protocols for memory channels, CPU to CPU interactions, and I/O devices, ongoing developments in the computer industry are leading to more converged requirements and physical implementations for these interconnects. As it becomes increasingly common for advanced components to contain a variety of computational devices as well as memory, the distinction between processors, memory, accelerators, and I/O devices become s increasingly blurred. As a result, the interface requirements among such components are converging. There is also a wide range of new disruptive technologies that will impact the computer market in the coming years , including 3D integration and emerging NVRAM memory. Optimal exploitation of these technologies cannot be done with the existing memory, storage, and I/O interface standards. The computer industry has historically made major advances when industry players have been able to add innovation behind a standard interface. The standard interface provides a large market for their products and enables relatively quick and widespread adoption. To enable a new wave of innovation in the form of advanced memory products and accelerators, we need a new standard interface explicitly designed to provide both the performance and flexibility to support new system integration solutions.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2015

Probing the electronic structure of buried interfaces via resonant scattering methods

Devices such as next-generation magnetic read heads demand energy storage capabilities and switching times beyond what is met by current permanent magnets. Superlattices of soft and hard ferromagnets (FM) that exhibit exchange-spring coupling are well-suited to be optimized for this purpose. Because of perovskites’ tunable properties from competing charge and spin degrees of freedom, one such system of interest is (001)-oriented La 0.7 Sr 0.3 CoO 3 (LSCO) capped with La 0.7 Sr 0.3 MnO 3 (LSMO). In the interfacial layers, FM moments are exchange-coupled strongly to each other, increasing overall coercivity. However, this system has subtleties that cannot be teased out in simple spin orientation models. In particular, growth mechanisms lead to rough interfaces and interlayer diffusion, which may drive a poorly understood phenomenon. The LSCO interfaces exhibit distinct magnetic properties from the bulk, possibly owing to an unexpected Co 2+ oxidation state near the LSMO that could lead to superexchange with Mn 4+ or possibly antiferromagnetism. Therefore the characterization of the electronic structure of interfaces is crucial to our understanding of the magnetic structure, but this is impossible with surface techniques, since most interfaces are buried, as well as spectroscopy, because the layers are similar in density. Specular x-ray reflectivity (SXR) is one method that describes layer thickness, density, and out-of-plane interface roughness of surfaces and buried interfaces. To characterize further, we apply SXR over absorption edges to increase Co/Mn contrast. Back-conversion to x-ray absorption near-edge structure (XANES) provides spectroscopic information on oxidation states that considers each sublayer separately, thereby determining how the sublayers couple.

36 MATERIALS SCIENCE↗
DOE OSTI2024

A Scalable & Non-Destructive Characterization Strategy to Study Semiconductor/Dielectric Interfaces and Predict Wafer-Level Device Performance

The defect density present at the dielectric-semiconductor interface in an MOS structure directly influences the channel carrier characteristics in semiconductor devices, especially in wide bandgap material systems used in power devices. While these trap defects are typically quantified through electrical characterization of MOS-capacitor test structures, this treatment offers very little insight into the physical nature of interface defects. Such shortcomings demand a physical characterization strategy to guide fabrication optimization. X-ray photoelectron spectroscopy (XPS) is suggested as a viable technique to determine chemical data for dielectric interfaces formed using atomic layer deposition (ALD) on GaN substrates. Previously, 1-D XPS characterization has confirmed the presence of a Ga x O y interlayer between ALD dielectrics and the GaN substrate. In this work, XPS data is serially collected to form 2-D images of an ALD-Al 2 O 3 /GaN interface as a proof-of-concept experiment for in-situ XPS quality monitoring during ALD processing. The information provided by this work reveals some of the challenges for incorporating XPS characterization as an in-situ strategy during fabrication of GaN-based devices. Separately, electrical mapping of a 2-D array of ALD-Al 2 O 3 /GaN MOS-capacitor devices provide a means to quantify the spatial variations in interface quality across a single wafer. Physical characterization techniques, such as time-of-flight secondary ion mass spectroscopy, provide additional chemical information about the Al 2 O 3 /Ga x O y /GaN structure that complement the electrical mapping results. This analysis shows that a higher Ga x O y content correlates with higher interface state defects for trap energies deep in the band gap.

42 ENGINEERING↗
NASA NTRS1974

Interplanetary stream interfaces

At 1 AU there is a distinct boundary (the stream interface) in the interaction region of a stream in the solar wind, characterized by an abrupt drop in density, a similar increase in temperature, and a small increase in speed. In some cases, this is a tangential discontinuity, in others it is probably evolving into a tangential discontinuity. It is suggested that stream interfaces form in the interplanetary medium as a consequence of the nonlinear evolution of streams generated by an increase in temperature in the solar envelope. This evolution eventually leads to the formation of a reverse shock behind the interface and a forward shock ahead of it. Two instances in which both a stream interface and a reverse shock had developed at 1 AU are presented. Examples of flare-generated shocks that passed through a stream and were observed near a stream interface are also presented. It is shown that stream interfaces are definitely not the same structures that others have identified as piston boundaries.

Burlaga, L. F.↗
NASA NTRS1976

Free-interface methods of substructure coupling for dynamic analysis

Benfield, et al. (1972) showed that among fixed-interface, free-interface, and hybrid substructure coupling methods, the fixed-interface methods as the most accurate and the free-interface methods are the least accurate. In the present note, a substructure coupling method is proposed which employs free-interface substructure modes supplemented by 'reduced flexibility.' Substructure coupling based on the improved substructure model is discussed, and a numerical comparison with Hou's free-interface method is given. To simplify representation of the method proposed, the substructure equations are developed first for constrained substructures, and then the equations representing substructures with rigid-body modes are given. Finally, the equations for coupling of substructures are derived. Example calculations are included.

Craig, R. R., Jr.↗
NASA NTRS1978

Analysis of solidification interface shape during continuous casting of a slab

An analysis was made of the two-dimensional interface shape of a slab ingot being cast continuously by withdrawing it from a mold. The sides of the ingot are being cooled and the upper boundary of the ingot is in contact with a pool of molten metal. The solidification interface shape was determined from the analysis of the heat flow, utilizing the condition that the solidification interface is at constant temperature and must be normal to the lines of heat flow carrying away latent heat of fusion from the interface. The analysis includes the effect of interface curvature which, for a constant rate of withdrawing the cast ingot from the mold, causes the solidification to be nonuniform along the interface. The analysis was carried out by a conformal mapping procedure.

Siegel, R.↗
NASA NTRS1982

Analysis of solidification interface shape resulting from applied sinusoidal heating

Maintaining a flat solidification interface is important for forming desired crystal structures in certain types of metal casting processes. This has application in new manufacturing techniques for naturally strengthened composite components such as turbine blades. The solidification interface shape will adjust to be compatible with the spatial distribution of energy being transferred to it. The interface shape must be found that satisfies conditions of simultaneously being at the fusion temperature and having an imposed spatially varying heat flux. Specific results are obtained for the heat transfer from the liquid phase varying along the interface in a cosine fashion. Interface shapes are found as a function of the amplitude and wavelength of the imposed heat transfer variations, and the sensitivity of the interface shape to these variations is examined.

Siegel, R.↗
NASA NTRS1984

Orbiter middeck/payload standard interfaces control document

The interfaces which shall be provided by the baseline shuttle mid-deck for payload use within the mid-deck area are defined, as well as all constraints which shall be observed by all the users of the defined interfaces. Commonality was established with respect to analytical approaches, analytical models, technical data and definitions for integrated analyses by all the interfacing parties. Any payload interfaces that are out of scope with the standard interfaces defined shall be defined in a Payload Unique Interface Control Document (ICD) for a given payload. Each Payload Unique ICD will have comparable paragraphs to this ICD and will have a corresponding notation of A, for applicable; N/A, for not applicable; N, for note added for explanation; and E, for exception. On any flight, the STS reserves the right to assign locations to both payloads mounted on an adapter plate(s) and payloads stored within standard lockers. Specific locations requests and/or requirements exceeding standard mid-deck payload requirements may result in a reduction in manifesting opportunities.

Source record↗
NASA NTRS1985

The Control of Float Zone Interfaces by the Use of Selected Boundary Conditions

Since the float zone process involves two solid-melt interfaces, possible gas interfaces, heat and mass transfers, various driving forces and complex heating sources, an analysis of the entire process would be very complex. For an initial investigation, a more feasible approach is to examine each component of the process separately. The three principal components are: (1) the shapes of the melt and solid-melt interfaces, (2) the heat and mass transfers, and (3) the heating and cooling sources. This study combined facets of all three components. The purpose of this effort was to study and compute the surface boundary conditions required to give flat (float zone) FZ solid-melt interfaces. This study was undertaken in two phases. The first phase was to investigate the solid zones surface boundary conditions required for flat solid-melt interfaces when given the melt zone surface boundary conditions. The second phase complemented the first and was to investigate the melt zone surface boundary conditions required for flat solid-melt interfaces if given the solid zones surface boundary conditions. Dual integral transform methods were used in both phases; in addition, the use of various numerical methods for differential equations and linear systems of equations were required.

Foster, L. M.↗
NASA NTRS1987

Interface roughness effect on stresses in ceramic coatings

This paper presents an analysis of the interface stress in plasma-sprayed zirconia coatings. The stress distributions along smooth and rough interfaces were calculated for perfectly bonded materials. The effect of mechanial interlock along the interface was also calculated. The interface stresses for noninterlocking interfaces were consistently higher; the interlocking interfaces showed high stresses in small regions only.

Mullen, Robert L.↗
NASA NTRS1989

Numerical studies of the effects of jet-induced mixing on liquid-vapor interface condensation

Numerical solutions of jet-induced mixing in a partially full cryogenic tank are presented. An axisymmetric laminar jet is discharged from the central part of the tank bottom toward the liquid-vapor interface. Liquid is withdrawn at the same volume flow rate from the outer part of the tank. The jet is at a temperature lower than the interface, which is maintained at a certain saturation temperature. The interface is assumed to be flat and shear-free and the condensation-induced velocity is assumed to be negligibly small compared with radial interface velocity. Finite-difference method is used to solve the nondimensional form of steady state continuity, momentum, and energy equations. Calculations are conducted for jet Reynolds numbers ranging from 150 to 600 and Prandtl numbers ranging from 0.85 to 2.65. The effects of above stated parameters on the condensation Nusselt and Stanton numbers which characterize the steady-state interface condensation process are investigated. Detailed analysis to gain a better understanding of the fundamentals of fluid mixing and interface condensation is performed.

Lin, Chin-Shun↗