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At least 811 records · Page 45

Optical Coating Performance and Thermal Structure Design for Heat Reflectors of JWST Electronic Control Unit

The James Webb Space Telescope (JWST) consists of an infrared-optimized Optical Telescope Element (OTE) that is cooled down to 40 degrees Kelvin. A second adjacent component to the OTE is the Integrated Science Instrument Module, or ISIM. This module includes the electronic compartment, which provides the mounting surfaces and ambient thermally controlled environment for the instrument control electronics. Dissipating the 200 watts generated from the ISIM structure away from the OTE is of paramount importance so that the spacecraft's own heat does not interfere with the infrared light detected from distant cosmic sources. This technical challenge is overcome by a thermal subsystem unit that provides passive cooling to the ISIM control electronics. The proposed design of this thermal radiator consists of a lightweight structure made out of composite materials and low-emittance metal coatings. In this paper, we will present characterizations of the coating emittance, bidirectional reflectance, and mechanical structure design that will affect the performance of this passive cooling system.

Quijada, Manuel A.↗

Single-Phase Dielectric Fluid Thermal Management for Power-Dense Automotive Power Electronics

This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm 3 /s [1 L/min] to 68.3 cm 3 /s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm 3 total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm 2 K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.

30 DIRECT ENERGY CONVERSION↗

Electron beam charging of Space Shuttle thermal protection system tiles

Six space shuttle reusable surface insulation tiles were tested in the NASA Lewis Research Center's electron bombardment test facility. The 30-cm-square specimens were assembled by using the same materials and techniques used to apply the tiles to the space shuttle and were composed to 15-cm- and 20-cm-square tiles and pieces on 0.6-cm-thick aluminum substrates. There were two specimens of each of three thicknesses. One specimen of each thickness had gaps of less than 0.1 cm between tiles, and the other had gaps of approximately 0.15 cm. The specimens were exposed to monoenergetic electron beams (2 to 25 keV) with nominal fluxes of 0.1 and 1 nA/sq. cm. Tests were conducted with both grounded and floating substrates. The data presented include charging rates, equilibrium potentials, and substrate currents. There is evidence that discharging occurred.

Staskus, J. V.↗

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Abstract Electronic packaging for automotive applications are at particular risk of thermomechanical failure due to the naturally harsh conditions it is exposed to. With the rise of electric and hybrid electric vehicles (EVs and HEVs), combined with a desire to miniaturize, the challenge of removing enough heat from electronic devices in automotive vehicles is evolving. This paper closely examines the new challenges in thermal management in various driving environments and aims to classify each existing cooling method in terms of performance. Particular focus is placed upon emerging solutions regarded to hold great potential, such as phase-change materials (PCMs). PCMs have been regarded for some time as a means of transferring heat quickly away from the region with the electronic components and are widely regarded as a possible means of carrying out cooling in large scale from small areas, because of their high latent heat of fusion, high specific heat, temperature stability, and small volume change during phase change, etc. They have already been utilized as a method of passive cooling in electronics in various ways, but their adoption in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available power module used in automotive applications.

Engineering↗

Direct measurement of the thermal expansion coefficient of epitaxial WSe 2 by four-dimensional scanning transmission electron microscopy

Current reports of thermal expansion coefficients (TEC) of two-dimensional (2D) materials show large discrepancies that span orders of magnitude. Determining the TEC of any 2D material remains difficult due to approaches involving indirect measurement of samples that are atomically thin and optically transparent. We demonstrate a methodology to address this discrepancy and directly measure TEC of nominally monolayer epitaxial WSe 2 using four-dimensional scanning transmission electron microscopy (4D-STEM). Experimentally, WSe 2 from metal-organic chemical vapor deposition (MOCVD) was heated through a temperature range of 18- 564 °C using a barrel-style heating sample holder to observe temperature-induced structural changes without additional alterations or destruction of the sample. By combining 4D-STEM measurements with quantitative structural analysis, the thermal expansion coefficient of nominally monolayer polycrystalline epitaxial 2D WSe 2 was determined to be (3.5 ± 0.9) × 10 -6 K -1 and (5.7 ± 2) × 10 -5 K -1 for the in- and out-of-plane TEC, respectively, and (3.6 ± 0.2) × 10 -5 K -1 for the unit cell volume TEC, in good agreement with historically determined values for bulk crystals.

2D materials↗

Thermal control across a chain of electronic nanocavities

Here, we study a chain of alternating hot and cold electronic nanocavities—connected to one another via resonant-tunneling quantum dots—with the intent of achieving precise thermal control across the chain. This is accomplished by positioning the dots' energy levels such that a predetermined distribution of heat currents is realized across the chain in the steady state. The number of electrons in each cavity is conserved in the steady state which constrains the cavities' chemical potentials. We determine these chemical potentials analytically in the linear response regime where the energy differences between the dots' resonant levels and the neighboring chemical potentials are much smaller than the thermal energy. In this regime, the thermal control problem can be solved exactly, while, in the general case, thermal control can only be achieved in a relative sense, that is, when one only preassigns the ratios between different heat currents. We apply our results to two different cases: We first demonstrate that a “heat switch” can be easily realized with three coupled cavities, and then we show that our linear response results can provide accurate results in situations with a large number of cavities.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Thermal analysis of the ultraviolet imager camera and electronics

The Ultraviolet Imaging experiment has undergone design changes that necessiate updating the reduced thermal models (RTM's) for both the Camera and Electronics. In addition, there are several mission scenarios that need to be evaluated in terms of thermal response of the instruments. The impact of these design changes and mission scenarios on the thermal performance of the Camera and Electronics assemblies is discussed.

Dirks, Gregory J.↗

Status on the Recovery of Voyager Plasma Electron Observations at Jupiter

We give status report on the recovery of Voyager 1 and 2 plasma electron observations during their Jupiter flybys. The plan is to complete this analysis including new results never published before. The original summary data tapes and later datafiles were evidently permanently lost along with our past analysis results of the plasma electron observations except for that shown in previous publications. These summary data tapes included the plasma ion and electron raw datafiles, status words needed to convert data numbers to currents, SEDR data with trajectory and attitude information and magnetic field measurements. In addition to recovering the plasma electron plasma observations (electron intensities and fluid parameters of the thermal and suprathermal electron populations, respectively), the SEDR trajectory information during the out bound passes were lost but fortunately in the past the SEDR files were converted to Spice Kernals, so this unexpected problem was solved. In addition, we had to rewrite our read routines it looked like the previous read routines so the rest of the Fortran code could be used; the Fortran- code had to be modified to work with the latest compilers and computer platforms. We will report on the- status of our work- originally funded under the Planetary Data Archiving, Restoration, and Tools (PDART)program but now being funded by the Internal Scientist Funding Model (ISFM) Exosphere Ionosphere Magnetospheres Modeling (EIMM)program at NASA Goddard Space Flight Center.

E C Sittler Jr.↗

Recovery of Voyager Plasma Electron Observations at Jupiter

We will present our recovery of Voyager 1 and 2 plasma electron observations during their Jupiter flybys. The analysis is expected to be completed by the time of the Fall AGU 2023 Meeting and stored in Goddard’s Data Center and we will present new results never published before. The original summary data tapes and later data files at first appeared to be permanently lost but eventually located at the Massachusetts Institute of Technology, while data analysis results done at Goddard Space Flight Center, except for that published in journals, were permanently lost such as electron distribution functions, spacecraft trajectory and spacecraft attitude information. In addition to recovering the electron plasma observations (electron intensities and fluid parameters of the thermal and suprathermal electron populations, respectively), we use Spice Kernels for Voyager 1 and 2 trajectory and spacecraft attitude information, fortunately produced by NASA’s Jet Propulsion Laboratory. We will present new results of our work, originally funded under the Planetary Data Archiving, Restoration, and Tools (PDART) program but now being funded by the Internal Scientist Funding Model (ISFM) Exosphere Ionosphere Magnetospheres Modeling (EIMM) program at NASA Goddard Space Flight Center. If time permits, we will also present some of our recovery of the Voyager 2 Uranus plasma electron data and analysis similar to what was done for Jupiter.

E.C. Sittler Jr.↗

Recovery of Voyager Plasma Electron Observations at Jupiter

We will present our recovery of Voyager 1 and 2 plasma electron observations during their Jupiter flybys. The analysis is expected to be completed by the time of the Fall AGU 2023 Meeting and stored in Goddard’s Data Center and we will present new results never published before. The original summary data tapes and later data files at first appeared to be permanently lost but eventually located at the Massachusetts Institute of Technology, while data analysis results done at Goddard Space Flight Center, except for that published in journals, were permanently lost such as electron distribution functions, spacecraft trajectory and spacecraft attitude information. In addition to recovering the electron plasma observations (electron intensities and fluid parameters of the thermal and suprathermal electron populations, respectively), we use Spice Kernels for Voyager 1 and 2 trajectory and spacecraft attitude information, fortunately produced by NASA’s Jet Propulsion Laboratory. We will present new results of our work, originally funded under the Planetary Data Archiving, Restoration, and Tools (PDART) program but now being funded by the Internal Scientist Funding Model (ISFM) Exosphere Ionosphere Magnetospheres Modeling (EIMM) program at NASA Goddard Space Flight Center. If time permits, we will also present some of our recovery of the Voyager 2 Uranus plasma electron data and analysis similar to what was done for Jupiter.

E.C. Sittler Jr.↗

Two Phase Technology Development Initiatives

Three promising thermal technology development initiatives, vapor compression thermal control system, electronics cooling, and electrohydrodynamics applications are outlined herein. These technologies will provide thermal engineers with additional tools to meet the thermal challenges presented by increased power densities and reduced architectural options that will be available in future spacecraft. Goddard Space Flight Center and the University of Maryland are fabricating and testing a 'proto- flight' vapor compression based thermal control system for the Ultra Long Duration Balloon (ULDB) Program. The vapor compression system will be capable of transporting approximately 400 W of heat while providing a temperature lift of 60C. The system is constructed of 'commercial off-the-shelf' hardware that is modified to meet the unique environmental requirements of the ULDB. A demonstration flight is planned for 1999 or early 2000. Goddard Space Flight Center has embarked upon a multi-discipline effort to address a number of design issues regarding spacecraft electronics. The program addressed the high priority design issues concerning the total mass of standard spacecraft electronics enclosures and the impact of design changes on thermal performance. This presentation reviews the pertinent results of the Lightweight Electronics Enclosure Program. Electronics cooling is a growing challenge to thermal engineers due to increasing power densities and spacecraft architecture. The space-flight qualification program and preliminary results of thermal performance tests of copper-water heat pipes are presented. Electrohydrodynamics (EHD) is an emerging technology that uses the secondary forces that result from the application of an electric field to a flowing fluid to enhance heat transfer and manage fluid flow. A brief review of current EHD capabilities regarding heat transfer enhancement of commercial heat exchangers and capillary pumped loops is presented. Goddard Space Flight Center research efforts applying this technique to fluid management and fluid pumping are discussed.

Didion, Jeffrey R.↗

Holistic Thermal Management

This presentation, part of the 2019 Applied Power Electronics Conference (APEC), discusses holistic thermal management.

28 EE - Advanced Manufacturing Office (EE-5A)↗

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

Properties of the solar wind electrons between 1 and 3.3 AU from Ulysses thermal noise measurements

In order to describe the distribution function f(v) of the solar wind electrons, the simplest model which is commonly used consists of the sum of two Maxwellians representing two distinct populations: a core (density n(sub c), temperature T(sub c)) and a halo (density n(sub h), temperature T(sub h)). It is possible, with the latter assumptions on the electron f(v), to determine the quasi-thermal noise (QTN) induced on an antenna by the motion of the ambient electrons in the solar wind. Using this distribution and the spectroscopy of thermal noise measurements from the radio receiver on Ulysses in the ecliptic plane, we deduce the total electron density N(sub e), the core temperature T(sub c), and the core and halo kinetic pressures N(sub c)T(sub c) and N(sub h)T(sub h). From these electron parameters, we can define a 'global' electron temperature as T(sub e) = (N(sub c)T(sub c) + N(sub h)T(sub h))/N(sub e). Here we present different radial gradients of T(sub e), between 1 and 3.3 AU, as a function of three classes of N(sub e) at 1 AU: low, intermediate, and high densities. In general all these gradients are found to be positive with different polytrope power law indexes between N(sub e) and T(sub e), which are in general lower than unity. We also show different behaviors of the ratio N(sub h)T(sub h)/N(sub c)T(sub c) for each density class considered. Some possible interpretations for these observations are discussed.

Maksimovic, M.↗

In-situ transmission electron microscopy investigation on surface oxides thermal stability of niobium

Niobium is commonly used for superconducting quantum systems as readout resonators, capacitors, and interconnects. Structural defects at the Nb/Si and air/Nb interface may be a major source of two-level systems (TLS), which are detrimental to the device's coherence time. Thus, identifying and understanding the microscopic origin of possible TLS in Nb-based devices and their relationship to processing is key to superconducting qubit performance improvement. Here this work studied the structure and thermal stability of surface oxide on physical vapor deposited Nb films on Si wafers, using aberration-corrected (scanning) transmission electron microscopy and spectroscopy. Here, all Nb films exhibit columnar growth with strong [110] textures. After in-situ heating of the heterostructure at 360 °C inside the microscope, the initial amorphous niobium surface oxides decompose into face-centered cubic Nb nanograins in the amorphous Nb-O matrix, which may reduce microwave dissipation. Despite changes in the microstructure and chemistry of the niobium oxide surface layer due to heat treatment, the interface between the Nb and the surface oxide layer remains almost unchanged. Our comprehensive study of the Nb surface oxide decomposition mechanism may guide future superconducting qubit device optimization through interfacial scattering center and TLS minimization.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

On the thermal conductivity due to collisions between relativistic degenerate electrons

A numerical integration is undertaken of the integral expression for the thermal conductivity due to collisions of relativistic degenerate electrons and compared to the limiting-case analytic formula. The integration is designed to encompass all temperature/electron-plasma-frequency temperature ratios between the melting temperature and the Fermi temperature. High accuracy fits are demonstrated by interpolating the values of the integrals of the function and by using an asymptotic function by Urpin and Yakovlev (1980). The numerically integrated expression compares favorably to the limiting-case analytic asymptotic formula by Urpin and Yakovlev, and the results are valid for temperatures above and below the electron-plasma-frequency temperature. The present techniques can be used in stellar opacity calculations and in the study of the propagation of deflagration fronts of compact stellar remnants.

Timmes, F. X.↗