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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 811 records · Page 45
All sourcesNASA NTRSDOE OSTI
DOE OSTI2015

Data-dependence Profiling to Enable Safe Thread Level Speculation

Data-dependence profling is a technique that enables a com- piler to judiciously decide when the execution of a loop | which the compiler could not prove to be dependence free | should be speculated through the use of Thread Level Spec- ulation (TLS). The data collected by a data-dependence pro- fler can be used to predict if may dependencies reported by a compiler static analysis are likely to materialize at runtime. A cost analysis can then be used to decide that some loops with a lower probability of dependence should be specula- tively parallelized. This paper addresses the question as to whether a loops' dependence behaviour changes when the in- put to the program changes | a study of 57 different bench- marks indicates that it usually does not change. Then the paper describes SpecEval, an automatic speculative paral- lelization framework that uses single-input data-dependence profles to find speculation candidates in the SPEC2006 and PolyBench/C benchmarks. This paper also presents a per- formance evaluation of TLS implementation in IBM's Blue- Gene/Q supercomputer and shows that the performance of TLS is affected by several factors, including the number of speculated loops, the execution-time coverage of speculated loops, the miss-speculation overhead, the L1 cache miss rate and the effect on dynamic instruction path length.

Bhattacharyya, Arnamoy↗
DOE OSTI2018

Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Stabach, Jennifer↗