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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Ion plating deposits thin film on complex surface in one operation. The ionized materials follow electric lines of force to all points on the objects, uniformly plating the surface from all sides simultaneously.
Gold undercoat prevents blistering in the silver plating of Inconel 718 seals from steam at high temperatures. The undercoat is diffused into the surface of the parent metal by baking prior to silver plating.
Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.
Fresnel plate demonstrates diffraction phenomena simply and inexpensively. A large number of identical diffracting apertures are made in random orientation on photographic film. When a small source of light is viewed through the plate, the diffraction pattern typical of the diffracting aperture is readily seen.
Hypersensitization procedure for spectroscopic plates, minimizing nonuniformities of plate fog by use of stop bath
Multilayer plated wire memory system surpasses planar thin film memories because of its high speed, simplicity, and high output. The device consists of 5 mil Be-Cu wire plated with Ni-Fe alloy about 1 micron thick crossed orthogonally by word lines.
Helium and air flow tests over single flat plates to determine dynamic pressure limits of nuclear fuel element plates
Oscillation amplitude, oscillation frequencies, plate thickness and area as drag coefficients for flat, square plates oscillating normal to their planes in air
Plate thickness effect on bending stress near crack front for plates with through cracks
Computer program calculates the stresses and lateral deflections to a uniform thickness flat plate with a uniform pressure load. The plate to be analyzed may have several different boundary conditions. The program is written in FORTRAN 4 for use on the CDC 6600 computer.
Electroplating technique with acid pickling provides a method of applying nickel plating on Inconel X-750 tubing to serve as a wetting agent during brazing. Low-stress nickel-plating bath contains no organic wetting agents that cause the nickel to blister at high temperatures.
Very thin rhodium electro-deposit plating eliminates the need for corrosion-resistant protection on silver surfaces and has no effect on the pliability characteristics of the plated surface.
Bending of cracked plate with arbitrary stress distribution across plate thickness
Compatible triangular plate elements for normal and in-plane displacements, discussing nine degree of freedom element, strain energy, simply supported and clamped plates
Buckled plates flutter at zero dynamic pressure, considering initial plate imperfections, including aerodynamic damping in quasi-steady supersonic approximation
Method extends scope of ion plating technique to include deposition of alloy films without changing composition of plating alloy. Coatings flow with specimen material without chipping or peeling. Technique is most effective vacuum deposition method for depositing alloys for strong and lasting adherence.
Technique permits plating of primarily metallic substrates with either metals or nonmetals at normal temperature. Peening uses compressed air to apply concurrent streams of small glass beads and powdered plating material to the substrate.
Investigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate