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At least 811 records · Page 45
All sourcesNASA NTRSDOE OSTI
NASA NTRS2022

SpaceVPX Interoperability Assessment

The existing VMEbus (VersaModular Eurocard bus) International Trade Association (VITA)-78 industry standard, also known as SpaceVPX, is an avionics board- and chassis-level standard derived from the OpenVPX standard as defined in VITA-65. While VITA-65 defines backplane and board-level profiles from COTS vendors to ensure interoperability of products used in developing systems and subsystems, the VITA-78 standard defines SpaceVPX to incorporate fault tolerance features that are required by many spaceflight systems. However, VITA-78 allows so much flexibility that interoperability between modules cannot be assured. This assessment provides guidelines on the use of, and extensions to, the VITA-78 standard to enable avionics interoperability for future NASA missions. The assessment team was comprised of subject matter experts (SMEs) from Goddard Space Flight Center (GSFC), the Jet Propulsion Laboratory (JPL), Johnson Space Center (JSC), and Langley Research Center (LaRC). The team included valuable external consulting support from a SME who was a key participant in the development of the VITA-78 standard. The team had extensive collaboration with the NASA Space Technology Mission Directorate (STMD) High Performance Spaceflight Computing (HPSC) project, specifically in the development of SpaceVPX interconnect findings, observations, and NESC recommendations. To provide an understanding of the breadth of implementations that SpaceVPX must accommodate, multiple NASA use cases were analyzed to assess the requirements for SpaceVPX implementations across a wide range of NASA missions (Appendix C). Applications included crewed missions, science missions, and orbital and surface robotic systems. Product surveys were conducted to assess the level of industry support for SpaceVPX, applications, and the variations in their implementations (Appendix D). In-depth analysis was conducted in the areas of: (a) power management and distribution, (b) form factors and daughtercards, (c) interconnect, and (d) fault tolerance. Leveraging the use cases, product surveys, and SMEs from multiple NASA Centers, these areas were analyzed to determine the range of implementations permitted by the VITA-78 standard and potential interoperability issues. Applicable findings and NESC recommendations were provided for each area. During this assessment, there were multiple opportunities to engage with other agencies to learn about their interest in SpaceVPX, their strategies for implementing SpaceVPX-based systems, and their internal development efforts. These engagements also generated findings and NESC recommendations. Based on this assessment analysis, NESC recommendations were made regarding the feature set and module profiles to support NASA SpaceVPX implementations. This feature set includes restrictions on features in VITA-78, and extensions to the standard. Key recommendations in this area include the use of 10 Gigabit Ethernet and Peripheral Component Interconnect Express (PCIe) as high bandwidth interconnect on the backplane, the retention of SpaceWire interconnect for control functions, and support for 3U (unit) and 6U, form factors for NASA systems. Restrictions were proposed on the usage of user-defined signals to promote interoperability, and specific power managements and distribution schemes for 3U systems. Beyond the technical implementation of SpaceVPX, recommendations were made on areas that warrant further investigation. Primary among these is the recommendation for NASA to collaborate with other space-going agencies and industry to incorporate recommendations into a future ‘dot spec’ of VITA-78. This would ensure wide adoption and availability of the modules that comply with the specification. The assessment includes appendices with candidate module profiles that can be considered as a starting point for this activity, and example systems based on the recommendations. Follow-on studies are recommended for architectures beyond SpaceVPX to address potential enhancements including condensed set of interconnect, software required to implement protocol layers on the interconnect (and other features), alternative power architectures, and system-level testability.

SpaceVPX↗
DOE OSTI2019

System and method for obfuscation of electronic circuits

A computer-implemented method of generating randomized electrical interconnects for an electronic circuit comprises steps of receiving a netlist of nodes of electronic components to be connected, each connection of nodes forming an electrical interconnect; determining a list of one or more path directions for each electrical interconnect; determining a plurality of path direction distances for each electrical interconnect; generating a plurality of segments for each electrical interconnect, each segment having one path direction and a length which are selected at random; calculating a sum of the lengths of all of the segments in each path direction each time a segment is generated for each electrical interconnect; removing one path direction from the list of path directions when a first condition is met; and stopping the generating a plurality of segments for each electrical interconnect when a second condition is met.

Trujillo, Joshua↗
DOE OSTI2021

System and method for obfuscation of electronic circuits

A computer-implemented method of generating randomized electrical interconnects for an electronic circuit comprises steps of receiving a netlist of nodes of electronic components to be connected, each connection between the nodes forming an electrical interconnect; determining a list of one or more path directions for each electrical interconnect; determining a plurality of path direction distances for each electrical interconnect; generating a plurality of segments for each electrical interconnect, each segment having one path direction and a length which are selected at random; calculating a sum of the lengths of all of the segments in each path direction each time a segment is generated for each electrical interconnect; removing one path direction from the list of path directions when a first condition is met; and stopping the generating a plurality of segments for each electrical interconnect when a second condition is met.

Trujillo, Joshua↗
DOE OSTI2022

System and method for obfuscation of electronic circuits

A computer-implemented method of generating randomized electrical interconnects for an electronic circuit comprises steps of receiving a netlist of nodes of electronic components to be connected, each connection between the nodes forming an electrical interconnect; determining a list of one or more path directions for each electrical interconnect; determining a plurality of path direction distances for each electrical interconnect; generating a plurality of segments for each electrical interconnect, each segment having one path direction and a length which are selected at random; calculating a sum of the lengths of all segments of the plurality of segments in each path direction each time a segment is generated for each electrical interconnect; removing one path direction from the list of path directions when a first condition is met; and stopping the generating a plurality of segments for each electrical interconnect when a second condition is met.

Trujillo, Joshua↗
DOE OSTI2018

Thermoreflectance imaging of electromigration evolution in asymmetric aluminum constrictions

Electromigration (EM) is a phenomenon whereby the flow of current in metal wires moves the underlying atoms, potentially inducing electronic interconnect failures. The continued decrease in commercial lithographically defined feature sizes means that EM presents an increasing risk to the reliability of modern electronics. To mitigate these risks, it is important to look for novel mechanisms to extend lifetime without forfeiting miniaturization. Typically, only the overall increase in the interconnect resistance and failure voltage are characterized. However, if the current flows non-uniformly, spatially resolving the resulting hot spots during electromigration aging experiments may provide better insights into the fundamental mechanisms of this process. Here in this study, we focus on aluminum interconnects containing asymmetric reservoir and void pairs with contact pads on each end. Such reservoirs are potential candidates for self-healing. Thermoreflectance imaging was used to detect hot spots in electrical interconnects at risk of failure as the voltage was gradually increased. It reveals differential heating with increasing voltage for each polarity. We find that while current flow going from a constriction to a reservoir causes a break at the void, the identical structure with the opposite polarity can sustain higher current (J = 21 × 10 6 A/cm 2 ) and more localized joule heating and yet is more stable. Ultimately, a break takes place at the contact pad where the current flows from narrow interconnect to larger pads. In summary, thermoreflectance imaging with submicron spatial resolution provides valuable information about localized electromigration evolution and the potential role of reservoirs to create more robust interconnects.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2017

High-Penetration Photovoltaic Planning Methodologies

The main objective of this report is to provide an overview of select U.S. utility methodologies for performing high-penetration photovoltaic (HPPV) system planning and impact studies. This report covers the Federal Energy Regulatory Commission's orders related to photovoltaic (PV) power system interconnection, particularly the interconnection processes for the Large Generation Interconnection Procedures and Small Generation Interconnection Procedures. In addition, it includes U.S. state interconnection standards and procedures. The procedures used by these regulatory bodies consider the impacts of HPPV power plants on the networks. Technical interconnection requirements for HPPV voltage regulation include aspects of power monitoring, grounding, synchronization, connection to the overall distribution system, back-feeds, disconnecting means, abnormal operating conditions, and power quality. This report provides a summary of mitigation strategies to minimize the impact of HPPV. Recommendations and revisions to the standards may take place as the penetration level of renewables on the grid increases and new technologies develop in future years.

14 SOLAR ENERGY↗
DOE OSTI2021

Informative Background on the Interoperability Requirements in IEEE Std 1547-2018

The intent of this document is to support local authorities governing interconnection requirements in adopting the most current requirements for interconnecting distributed energy resources (DERs) to the electric distribution system, as specified in the Institute of Electrical and Electronics Engineers Standard for Interconnection and Interoperability of Distributed Energy Resources with Associated Electric Power Systems Interfaces (IEEE Std 1547-2018 ). To create interconnection rules that successfully address policy goals, market trends, and technical requirements, electric service regulators need to be well informed of DER integration considerations. Interconnection processes and technical issues often overlap; the two are not easily segregated, and they are often considered and evaluated concurrently within the context of interconnection rulemaking. Accordingly, this document addresses both the technical issues and related process considerations.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2022

Energy Resilient Recovery in Puerto Rico: Hurricane Maria Recovery Support

This report covers microgrids as a special application of distributed energy resources (DERs) in Puerto Rico. This is one of a series of reports describing the U.S. Department of Energy (DOE) multi-laboratory efforts undertaken. To ensure the sustainable, long-term recovery of Puerto Rico's electric power grid from hurricanes Maria and Irma and to build capacity to manage future potential natural disasters in the most secure and resilient way, DOE convened experts from multiple national laboratories to develop a comprehensive set of data, models, analytic tools, and studies, considering inputs from a wide variety of stakeholder groups, to support technically sound recommendations for Puerto Rico's energy investment decisions. In Phase 1 of the multi-laboratory effort to support Puerto Rico's recovery, the National Renewable Energy Laboratory (NREL) provided the utility company Puerto Rico Electric Power Authority (PREPA) recommendations for a new framework of interconnection standards to accelerate the integration of utility-scale, transmission-connected, renewable electrical generation and energy storage that ensure cross-technology compatibility and enable high deployment levels without compromising grid reliability, safety, or security (https://www.nrel.gov/docs/fy19osti/73848.pdf). In Phase 2, NREL published a report focused on the interconnection of distributed energy resources (DERs) to the electric distribution system in Puerto Rico (https://www.nrel.gov/docs/fy21osti/77127.pdf). This report familiarized the reader with Puerto Rico's distribution infrastructure and operational practices and procedures that are relevant to DER interconnection. The report also provided considerations for streamlining the interconnection process given the expected increase in deployments resulting from Puerto Rico's renewable portfolio standard goal of 100% renewables by 2050. Accordingly, the report identifies considerations and concerns associated with the increase in intermittent generation, strategies for DER interconnection best practices, and the potential use of the latest technological solutions identified in the latest revision of the Institute of Electrical and Electronics Engineers 1547-2018 interconnection standard. Additionally, the report identified ways to improve the physical resiliency of installed DERs. This task describes how distributed energy systems may participate in and contribute to improving the resiliency of Puerto Rico's energy infrastructure in the future. This report presents an analysis of the Puerto Rico grid to illustrate the possible different microgrid and minigrid scenarios. The capability to form sustained microgrids and minigrids has the potential to provide a high level of resiliency during disturbances on the grid. DERs, on the other hand, have the capability to aid in the microgrid operation by providing grid support as well as grid-forming functionality. Other tasks in Phase 3 include voltage regulation in distribution networks using DERs and transmission-and-distribution co-simulation.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2024

Transmission Value in 2023: Market Data Shows the Value of Transmission Remained High in Certain Locations Despite Overall Low Wholesale Electricity Prices

In 2023 additional electricity transmission would have provided the most value for links that crossed between grid interconnection regions in the United States (the Western Interconnection, the Eastern Interconnection, the Texas Interconnection) or crossed between system operator regions within the same interconnection. Many multi-interconnection or multi-region links had values of greater than $\$20$/MWh, or up to $\$175$ million/yr per 1 GW expanded transmission (subject to limits to the depth of the market at each side of the link). In contrast, many links within regions, or between regions in the northeast, had relatively low values in 2023, following the overall decline in wholesale electricity prices in 2023 compared with 2021-2022. The most valuable link in 2023, at $\$61$ /MWh, was between Texas and the Southwest. Multiple events in 2023 (high natural gas prices in the western U.S., and high summer temperatures in Texas and the Southwest) were observed to have driven this high value. Of particular note, high prices in Texas occurred at a largely distinct set of hours from high prices in the Southwest, helping to drive up the value of transmission in total and demonstrating significant value to both regions. This example demonstrates the unique value of transmission (compared to other solutions, such as building local generation resources) in delivering benefits to multiple regions given its ability to connect areas of the country that inevitably face differing circumstances.

29 ENERGY PLANNING, POLICY, AND ECONOMY↗
DOE OSTI2025

Resilient Operation of Networked Community Microgrids with High Solar Penetration

This project, funded by the US Department of Energy’s Solar Energy Technologies Office (SETO), focused on the operation of microgrids as a coordinated network. The primary objective, which was successfully achieved, was to develop both control strategies and hardware solutions to support the resilient and efficient operation of networked microgrids with high solar penetration. The work was structured around the following four main tasks: • Development of distributed and scalable optimization algorithms for AC-coupled networked microgrids. • Design and implementation of a novel DC interconnection hardware to enable precise power exchange between microgrids. • Laboratory operational validation of the developed technologies using 480 V testbeds and commercially available hardware. • Field operational validation of the complete solution in Adjuntas, Puerto Rico, interconnecting two kW-scale, split-phase microgrids of Casa Pueblo’s microgrids. This project addressed multiple technical challenges across the domains of optimization, control, hardware interconnection, and protection. One of its key contributions was delivering tangible, real-world solutions for networking microgrids. In contrast to purely theoretical or simulation-based work, this project included full-scale hardware operational validation both in the lab and in the field. The work conducted as part of this project—in collaboration with the University of Puerto Rico; the University of Tennessee, Knoxville; the University of Central Florida; and Casa Pueblo—has advanced the state of the art in networked microgrids. Key contributions include the development of distributed control strategies, practical solutions for real-world implementation challenges, and the introduction of a novel DC interlink approach for microgrid interconnection. The project featured both laboratory and field validation using commercial off-the-shelf components. The field deployment successfully validated that a group of microgrids can operate in a coordinated manner, enabling precise power flow between systems and mutual support during extreme events. This project resulted in 15 journal publications and 15 conference papers; 5 graduate students and 15 undergraduate students were supported. The codes of distributed optimization and forecasting were made open-source through OSTI.gov for distributed optimization and forecasting. All the publications are available in the ORNL-hosted project landing page. The DC interlink with state-of-charge balancing control was operationally validated in Adjuntas by interconnecting two real-world, 240 V split-phase microgrids. To the best knowledge of the team, this represents the first operational validation of AC microgrids interconnected via DC-interlinks. As a culmination of this project, a follow-on grant was awarded to support the technology transfer of the distributed optimization framework to a commercial microgrid controller, Stellar Edge, developed by the California-based company New Sun Road.

14 SOLAR ENERGY↗
NASA NTRS1976

Flexible, FEP-Teflon covered solar cell module development

Techniques and equipment were developed for the large scale, low-cost fabrication of lightweight, roll-up and fold-up, FEP-Teflon encapsulated solar cell modules. Modules were fabricated by interconnecting solderless single-crystal silicon solar cells and heat laminating them at approximately 300 C between layers of optically clear FEP and to a loadbearing Kapton substrate sheet. Modules were fabricated from both conventional and wraparound contact solar cells. A heat seal technique was developed for mechanically interconnecting modules into an array. The electrical interconnections for both roll-up and fold-up arrays were also developed. The use of parallel-gap resistance welding, ultrasonic bonding, and thermocompression bonding processes for attaching interconnects to solar cells were investigated. Parallel-gap welding was found to be best suited for interconnecting the solderless solar cells into modules. Details of the fabrication equipment, fabrication processes, module and interconnect designs, environmental test equipment, and test results are presented.

Rauschenbach, H. S.↗
DOE OSTI2016

Planar high density sodium battery

A method of making a molten sodium battery is disclosed. A first metallic interconnect frame having a first interconnect vent hole is provided. A second metallic interconnect frame having a second interconnect vent hole is also provided. An electrolyte plate having a cathode vent hole and an anode vent hole is interposed between the metallic interconnect frames. The metallic interconnect frames and the electrolyte plate are sealed thereby forming gaseous communication between an anode chamber through the anode vent hole and gaseous communication between a cathode chamber through the cathode vent hole.

25 ENERGY STORAGE↗
DOE OSTI2023

Compact high temperature electrochemical cell stack architecture

An electrochemical cell unit comprises a first electrochemical cell comprising a first oxidant electrode and a first fuel electrode, and a second electrochemical cell comprising a second oxidant electrode and a second fuel electrode. An interconnect interposed between the first electrochemical cell and the second electrochemical cell. The interconnect comprises an interconnect main body defining a longitudinal channel along a longitudinal axis thereof. The interconnect main body includes a plurality of corrugations defining a plurality of fuel channels on a first surface of the interconnect main body facing the first electrochemical cell, and a plurality of oxidant channels on a second surface of the interconnect main body facing the second electrochemical cell. Each of the plurality of fuel channels and the plurality of oxidant channel positioned around the longitudinal channel.

Brown, Casy Cloudless↗
DOE OSTI2017

Cathode-side electrical contact and contact materials for solid oxide fuel cell stacking: A review

In a planar solid oxide fuel cell (SOFC) stack, a number of individual cells are stacked together to increase the voltage and power output. At both the cathode– and anode–interconnect interfaces, electrical contact layers are applied between the interconnect and electrodes during cell fabrication process or stack assembly to increase the electrode-interconnect contact area and to compensate for dimensional tolerance variation of the contacting components, thus minimizing ohmic contact resistance throughout the stack. As such, electrical contact is an essential component in SOFC stacks. In this paper, we review the cathode-side electrical contact design and contact materials for application in SOFC stacks. Following an introduction of the function and working principles of electrical contact, the material requirements for cathode-side contact layer in SOFC stacks are outlined. Additionally, the current materials for the cathode–interconnect contact are thoroughly reviewed, including noble metals, conductive ceramics (e.g. perovskites and spinels), composites, and other more complex structures. Several potential directions for cathode–interconnect contact material research and development are also highlighted.

08 HYDROGEN↗
DOE OSTI2018

Frequency Response Assessment and Enhancement of the U.S. Power Grids towards Extra-High Photovoltaic Generation Penetrations – an Industry Perspective

Nonsynchronous generations such as photovoltaics (PVs) are expected to undermine bulk power systems (BPSs)' frequency response at high penetration levels. Though the underlying mechanism has been relatively well understood, the accurate assessment and effective enhancement of the U.S. interconnections, frequency response under extra-high PV penetration conditions remains an issue. In this paper, the industry-provided full-detail interconnection models were further validated by synchrophasor frequency measurements and realistically-projected PV geographic distribution information were used to develop extra-high PV penetration scenarios and dynamic models for the three main U.S. interconnections, including Eastern Interconnection (EI), Western Electricity Coordinating Council (WECC), and Electric Reliability Council of Texas (ERCOT). Up to 65% instantaneous PV and 15% wind penetration were simulated and the frequency response change trend of each U.S. interconnection due to the increasing PV penetration level were examined. Most importantly, the practical solutions to address the declining frequency response were discussed. This paper will provide valuable guidance for policy makers, utility operators and academic researchers not only in the U.S. but also other countries in the world.

14 SOLAR ENERGY↗
DOE OSTI2020

Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies

Copper is a commonly used interconnect metal in microelectronic interconnects due to its exceptional electrical and thermal properties. Particularly in applications of the 2.5 and 3D integration, Cu is utilized in through-silicon-vias (TSVs) and flip chip interconnects between microelectronic chips for providing miniaturization, lower power and higher performance than current 2D packaging approaches. Furthermore, SnAg capped Cu pillars are a common high-density interconnect technology for flip chip bonding. For these interconnects, specific properties of the Cu surface, such as roughness and cleanliness, are an important factor in the process to ensure quality solder bumps. During electroplating, tight processing parameters must be met so that defects are avoided, and high bump uniformity is achieved. An understanding of the interactions at the solder and Cu pillar interface is needed, based on the electroplating parameters, to determine the best method for populating solder on the wafer surface. In this study, surface treatment techniques such as oxygen plasma cleaning were performed on the Cu surfaces and the SnAg plating chemistry for depositing the solder were evaluated through hull cell testing to qualitatively determine the range of current densities to investigate. It was observed that current density while plating played a large role in solder bump deposition morphology. At the higher current densities greater than 60 mA/cm 2 , bump height non-uniformity and dendritic growth are observed and at lower current densities, less than or equal to 60 mA/cm 2 , uniform, continuous bump height occurred.

36 MATERIALS SCIENCE↗
DOE OSTI2017

Final Technical Report for Automated Manufacturing of Innovative CPV/PV Modules

Cogenra’s Dense Cell Interconnect system was designed to use traditional front-contact cells and string them together into high efficiency and high reliability “supercells”. This novel stringer allows one to take advantage of the ~100 GW/year of existing cell production capacity and create a solar product for the customer that will produce more power and last longer than traditional PV products. The goal for this program was for Cogenra Solar to design and develop a first-of-kind automated solar manufacturing line that produces strings of overlapping cells or “supercells” based on Cogenra’s Dense Cell Interconnect (DCI) technology for their Low Concentration Photovoltaic (LCPV) systems. This will enable the commercialization of DCI technology to improve the efficiency, reliability and economics for their Low Concentration Photovoltaic systems. In this program, Cogenra Solar very successfully designed, developed, built, installed, and started up the ground-breaking manufacturing tools required to assemble supercells. Cogenra then successfully demonstrated operation of the integrated line at high yield and throughput far exceeding expectations. The development of a supercell production line represents a critical step toward a high volume and low cost Low Concentration Photovoltaic Module with Dense Cell Interconnect technology and has enabled the evaluation of the technology for reliability and yield. Unfortunately, performance and cost headwinds on Low Concentration Photovoltaics systems including lack of diffuse capture (10-15% hit) and more expensive tracker requirements resulted in a move away from LCPV technology. Fortunately, the versatility of Dense Cell Interconnect technology allows for application to flat plate module technology as well and Cogenra has worked with the DOE to utilize the learning from this grant to commercialize DCI technology for the solar market through the on-going grant: Catalyzing PV Manufacturing in the US With Cogenra Solar’s Next-Generation Dense Cell Interconnect PV Module Manufacturing Technology. This program is now very successfully building off of this work and commercializing the technology to enable increased solar adoption.

14 SOLAR ENERGY↗
DOE OSTI2020

HPC4Mfg with Samsung: Making semiconductor devices cool through HPC ab initio simulations

For decades, the semiconductor technology has followed the Moore’s law, making newer devices more powerful and energy efficient. Recently, however, it has reached a point where the performance and the energy efficiency of the device do not improve with the shrinking device size. One of the fundamental reasons of this deviation from the past trend is the interconnect resistance, which becomes larger with the shrinking size. The devices size is so small that the quantum mechanical effects can no longer be ignored and the traditional continuum simulation tools such as TCAD become inadequate. In this project, Samsung Semiconductor Inc. and Lawrence Berkeley National Laboratory has collaborated to perform first of kind device-scale ab initio simulations to optimize materials and interconnect morphology to minimize interconnect resistance. We have tested the use of LS3DF method and the PEtot_trans approach on top of the folded spectrum method (FSM) Escan code to calculate the scattering state, and to study various effects influence the interconnect conductivity. We found that, the LS3DF can be used to calculate such metallic system. On the other hand, the use of Escan code to solve the linear equation is not practical due to the slow convergence. We have implemented a Chebyshev filter technique to calculate a few hundred eigen states near the scattering state energy E, then use these eigen states as preconditioner to solve the linear equation. We have used this approach to study the different factors which affect the interconnect conductivity, including the shape, the point defect, the temperature, and the grain boundary.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗