Data Management Study, Volume 5. Appendix H - Contractor Data Package Logistics and Support /LS/ Final Report
Contractor data package for Voyager logistics and support in transportation, communications, supply, and maintenance
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Contractor data package for Voyager logistics and support in transportation, communications, supply, and maintenance
Contractor data package for administration of procurement and contracting of Voyager spacecraft systems
Contractor data management package for Voyager spacecraft sterilization project
Objectives, constraints, and design of Voyager entry science package for Mars atmosphere probe
Design alternatives and systems analysis of Voyager entry science package for Mars atmosphere probe
Major equipment and subsystem descriptions of Voyager entry science package for Mars
Reliability, planetary quarantine, support equipment, and interface alternatives of Voyager entry science package for Mars atmosphere probe
Thermal control subsystem for Apollo lunar surface experiments package, noting construction and operation principles
Calibration procedures for earth albedo experimental package of Orbiting Solar Observatory
Apollo lunar surface experiments package /ALSEP/ OF scientific instruments and supporting subsystems
Thermal insulation technique permits low and high power electronic chips to operate in the same package without thermal cross-coupling. An alumina glass shield thermally isolates the low power chip from the high power chip while Kovar substrate acts as a heat sink to remove heat from the high power chip.
Prototype selection system for optimal spacecraft instrument package planning decision making
Prototype space flight experiment package for study of circadian periodicity in pocket mice
Packaging, shipping, and shielding procedures for electroexplosive devices
Safety instrumentation package for persons working inside space simulation chambers
High voltage design specifications for detector assembly /ultraviolet photon counters/ used in Goddard experimental package
Voltage breakdown phenomena - high voltage packaging techniques and test equipment
Analytical method for finding heat balance of insulated OGO experiment packages from thermal stability data and without solar simulation