Influence of Indium on Microstructure and Properties of Sn-Pb Binary Alloy Applied in Photovoltaic Ribbon
In this work, the conductivity, melting point, microstructure, spreading behavior, and mechanical properties of three types of Sn-Pb-In(indium) alloys are investigated along with Sn60Pb40 alloy as a reference. The results show that the In element improves the comprehensive properties of the Sn-Pb alloys. The maximum conductivity of the Sn-Pb-In alloys is 7.08 MS/m when the content of the In element is 3 wt.%. With an increasing content of the In element, the melting points of the Sn-Pb-In alloys gradually decrease from 183 to 166 °C. The microstructures of the alloys are refined with the addition of In. The intermetallic compound (IMC) InSn{sub 4} is only found in Sn60Pb34In6, except for the α-Pb and β-Sn phases. A spread test shows that only IMC Cu{sub 6}Sn{sub 5} is present at the Cu/solder interface of the solder joints. The Sn60Pb34In3 solder joint shows the highest ultimate tensile strength of 54 MPa. The microhardness of the alloys slightly increases from 12.76 HV{sub 0.05} to 13.56 HV{sub 0.05} with the In content increasing from 0 to 3 wt.%, while a sharp increase to 15.53 HV{sub 0.05} is observed when the amount of In exceeds 3 wt.%.