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NASA NTRS2003

Fabrication And Evaluation Of Sic/Sic Tubes With Various Fiber Architectures

SiC/SiC composites are excellent material candidates for high temperature applications where the performance requirements are high strength, high creep-rupture resistance, high environmental durability, and high thermal conductivity. In the past, the NASA UEET program has demonstrated fabrication of high-performance SiC/SiC flat panels reinforced by Sylramic-iBN SiC fibers. Currently NASA UEET is scaling up this SiC/SiC system by fabrication of more complex shaped components using the same fiber type. This paper reports the effects of various fiber architectures on the processing, mechanical, and durability behavior of small-diameter 0.5" ID SiC/SiC tubes, which are potential sub-elements for leading edges and cooling channels in turbine vanes and blades. Nine different fiber architectures were utilized for construction of seamless tube preforms, from simple 2D jelly-rolling to complex braiding, pin-weaving, filament-winding and 3D orthogonal weaving with approximately 5% fibers in the thru-thickness direction. Using the BN interphase and Sic matrix processing steps established for the flat panels, SiC/SiC tubes were fabricated with wall thicknesses of approximately 60 mils and total fiber fractions of approximately 35%. The "D" split ring tests for hoop tensile properties, micro-structural examinations for relationship between fiber architecture formation and matrix infiltration, and the low-pressure burner rig tests for the high temperature durability under thru-thickness thermal gradient were conducted. The better matrix infiltration and higher hoop strength were achieved using the tri-axial braided and the three-float pin woven SiC/SiC tubes. In general, it needs not only higher hoop direction fibers but also axial direction fibers for the higher hoop strength and the better infiltration, respectively. These results are analyzed to offer general guidelines for selecting fiber pre-form architectures and SiC/SiC processes that maximize tube hoop strength, thru-thickness thermal conductivity, and burner-rig durability under a high thermal gradient.

Yun, H. M.↗

NASA NTRS2003

Advanced Packaging Technology Used in Fabricating a High-Temperature Silicon Carbide Pressure Sensor

The development of new aircraft engines requires the measurement of pressures in hot areas such as the combustor and the final stages of the compressor. The needs of the aircraft engine industry are not fully met by commercially available high-temperature pressure sensors, which are fabricated using silicon. Kulite Semiconductor Products and the NASA Glenn Research Center have been working together to develop silicon carbide (SiC) pressure sensors for use at high temperatures. At temperatures above 850 F, silicon begins to lose its nearly ideal elastic properties, so the output of a silicon pressure sensor will drift. SiC, however, maintains its nearly ideal mechanical properties to extremely high temperatures. Given a suitable sensor material, a key to the development of a practical high-temperature pressure sensor is the package. A SiC pressure sensor capable of operating at 930 F was fabricated using a newly developed package. The durability of this sensor was demonstrated in an on-engine test. The SiC pressure sensor uses a SiC diaphragm, which is fabricated using deep reactive ion etching. SiC strain gauges on the surface of the diaphragm sense the pressure difference across the diaphragm. Conventionally, the SiC chip is mounted to the package with the strain gauges outward, which exposes the sensitive metal contacts on the chip to the hostile measurement environment. In the new Kulite leadless package, the SiC chip is flipped over so that the metal contacts are protected from oxidation by a hermetic seal around the perimeter of the chip. In the leadless package, a conductive glass provides the electrical connection between the pins of the package and the chip, which eliminates the fragile gold wires used previously. The durability of the leadless SiC pressure sensor was demonstrated when two 930 F sensors were tested in the combustor of a Pratt & Whitney PW4000 series engine. Since the gas temperatures in these locations reach 1200 to 1300 F, the sensors were installed in water-cooled jackets, as shown. This was a severe test because the pressure-sensing chips were exposed to the hot combustion gases. Prior to the installation of the SiC pressure sensors, two high-temperature silicon sensors, installed in the same locations, did not survive a single engine run. The durability of the leadless SiC pressure sensor was demonstrated when both SiC sensors operated properly throughout the two runs that were conducted.

Beheim, Glenn M.↗

NASA NTRS2005

In Situ Fabrication Technologies: Meeting the Challenge for Exploration

A viewgraph presentation on Lunar and Martian in situ fabrication technologies meeting the challenges for exploration is shown. The topics include: 1) Exploration Vision; 2) Vision Requirements Early in the Program; 3) Vision Requirements Today; 4) Why is ISFR Technology Needed? 5) ISFR and In Situ Resource Utilization (ISRU); 6) Fabrication Feedstock Considerations; 7) Planetary Resource Primer; 8) Average Chemical Element Abundances in Lunar Soil; 9) Chemical Elements in Aerospace Engineering Materials; 10) Schematic of Raw Regolith Processing into Constituent Components; 11) Iron, Aluminum, and Basalt Processing from Separated Elements and Compounds; 12) Space Power Systems; 13) Power Source Applicability; 14) Fabrication Systems Technologies; 15) Repair and Nondestructive Evaluation (NDE); and 16) Habitat Structures. A development overview of Lunar and Martian repair and nondestructive evaluation is also presented.

Howard, Richard W.↗

NASA NTRS2005

Fabrication of GRCop-84 Rocket Thrust Chambers

GRCop-84, a copper alloy, Cu-8 at% Cr-4 at% Nb developed at NASA Glenn Research Center for regeneratively cooled rocket engine liners has excellent combinations of elevated temperature strength, creep resistance, thermal conductivity and low cycle fatigue. GRCop-84 is produced from prealloyed atomized powder and has been fabricated into plate, sheet and tube forms as well as near net shapes. Fabrication processes to produce demonstration rocket combustion chambers will be presented and includes powder production, extruding, rolling, forming, friction stir welding, and metal spinning. GRCop-84 has excellent workability and can be readily fabricated into complex components using conventional powder and wrought metallurgy processes. Rolling was examined in detail for process sensitivity at various levels of total reduction, rolling speed and rolling temperature representing extremes of commercial processing conditions. Results indicate that process conditions can range over reasonable levels without any negative impact to properties.

Loewenthal, William S.↗

NASA NTRS2002

Nano-fabricated size exclusion chromatograph

This paper describes the development of a nano-fabricated size exclusion chromatograph (nSEC) based on the principle that molecules traveling through amicrocolumn containing nano-fabricated features will have characteristic elution times that directly correlate to molecular weight. Compared to conventional size exclusion chromatography, the nSEC offers greater control over the size exclusion process; mass fabrication; integration of the separation column with associated valves, pumps, and detectors; and dramatic reductions in instrument mass and power requirements.

nanofluids lab-on-a-chip chromatograph separation↗

NASA NTRS2006

Metallurgical Mechanisms Controlling Mechanical Properties of Aluminum Alloy 2219 Produced by Electron Beam Freeform Fabrication

The electron beam freeform fabrication (EBF3) layer-additive manufacturing process has been developed to directly fabricate complex geometry components. EBF3 introduces metal wire into a molten pool created on the surface of a substrate by a focused electron beam. Part geometry is achieved by translating the substrate with respect to the beam to build the part one layer at a time. Tensile properties demonstrated for electron beam deposited aluminum and titanium alloys are comparable to wrought products, although the microstructures of the deposits exhibit cast features. Understanding the metallurgical mechanisms controlling mechanical properties is essential to maximizing application of the EBF3 process. Tensile mechanical properties and microstructures were examined for aluminum alloy 2219 fabricated over a range of EBF3 process variables. Unique microstructures were observed within the deposited layers and at interlayer boundaries, which varied within the deposit height due to microstructural evolution associated with the complex thermal history experienced during subsequent layer deposition. Microstructures exhibited irregularly shaped grains with interior dendritic structures, described based on overall grain size, morphology, distribution, and dendrite spacing, and were correlated with deposition parameters. Fracture features were compared with microstructural elements to define fracture paths and aid in definition of basic processing-microstructure-property correlations.

Domack, Marcia S.↗

NASA NTRS2006

Fabrication of GRCop-84 Rocket Thrust Chambers

GRCop-84, a copper alloy, Cu-8 at% Cr-4 at% Nb developed at NASA Glenn Research Center for regenerative1y cooled rocket engine liners has excellent combinations of elevated temperature strength, creep resistance, thermal conductivity and low cycle fatigue. GRCop-84 is produced from pre-alloyed atomized powder and has been fabricated into plate, sheet and tube forms as well as near net shapes. Fabrication processes to produce demonstration rocket combustion chambers will be presented and includes powder production, extruding, rolling, forming, friction stir welding, and metal spinning. GRCop-84 has excellent workability and can be readily fabricated into complex components using conventional powder and wrought metallurgy processes. Rolling was examined in detail for process sensitivity at various levels of total reduction, rolling speed and rolling temperature representing extremes of commercial processing conditions. Results indicate that process conditions can range over reasonable levels without any negative impact to properties.

Loewenthal, William↗

NASA NTRS2007

Electron Beam Freeform Fabrication in the Space Environment

The influence of reduced gravitational forces (in space and on the lunar or Martian surfaces) on manufacturing processes must be understood for effective fabrication and repair of structures and replacement parts during long duration space missions. The electron beam freeform fabrication (EBF3) process uses an electron beam and wire to fabricate metallic structures. The process efficiencies of the electron beam and the solid wire feedstock make the EBF3 process attractive for use in-space. This paper will describe the suitability of the EBF3 process in the space environment and will highlight preliminary testing of the EBF3 process in a zero-gravity environment.

Hafley, Robert A.↗

NASA NTRS2007

Design and Fabrication Highlights Enabling a 2 mm, 128 Element Bolometer Array for GISMO

The Backshort-Under-Grid (BUG) superconducting bolometer array architecture is intended to be highly versatile, operating in a large range of wavelengths and background conditions. We have undertaken a three-year program to develop key technologies and processes required to build kilopixel arrays. To validate the basic array design and to demonstrate its applicability for future kilopixel arrays, we have chosen to demonstrate a 128 element bolometer array optimized for 2 mm wavelength using a newly built Goddard instrument, GISMO (Goddard /RAM Superconducting 2-millimeter Observer). The arrays are fabricated using batch wafer processing developed and optimized for high pixel yield, low noise, and high uniformity. The molybdenum-gold superconducting transition edge sensors are fabricated using batch sputter deposition and are patterned using dry etch techniques developed at Goddard. With a detector pitch of 2 mm 8x16 array for GISMO occupies nearly one half of the processing area of a 100 mm silicon-on-insulator starting wafer. Two such arrays are produced from a single wafer along with witness samples for process characterization. To provide thermal isolation for the detector elements, at the end of the process over 90% of the silicon must be removed using deep reactive ion etching techniques. The electrical connections for each bolometer element are patterned on the top edge of the square grid supporting the array. The design considerations unique to GISMO, key fabrication challenges, and laboratory experimental results will be presented.

Allen, Christine↗

NASA NTRS2007

Micro Machining Enhances Precision Fabrication

Advanced thermal systems developed for the Space Station Freedom project are now in use on the International Space Station. These thermal systems employ evaporative ammonia as their coolant, and though they employ the same series of chemical reactions as terrestrial refrigerators, the space-bound coolers are significantly smaller. Two Small Business Innovation Research (SBIR) contracts between Creare Inc. of Hanover, NH and Johnson Space Center developed an ammonia evaporator for thermal management systems aboard Freedom. The principal investigator for Creare Inc., formed Mikros Technologies Inc. to commercialize the work. Mikros Technologies then developed an advanced form of micro-electrical discharge machining (micro-EDM) to make tiny holes in the ammonia evaporator. Mikros Technologies has had great success applying this method to the fabrication of micro-nozzle array systems for industrial ink jet printing systems. The company is currently the world leader in fabrication of stainless steel micro-nozzles for this market, and in 2001 the company was awarded two SBIR research contracts from Goddard Space Flight Center to advance micro-fabrication and high-performance thermal management technologies.

Source record↗

NASA NTRS1992

Method of fabricating lightweight honeycomb structures

A process is disclosed for fabricating lightweight honeycomb type structures out of material such as silicon carbide (SiC) and silicon (S). The lightweight structure consists of a core to define the shape and size of the structure. The core is coated with an appropriate deposit such as SiC or Si to give the lightweight structure strength and stiffness and for bonding the lightweight structure to another surface. The core is fabricated from extremely thin ribs of appropriately stiff and strong material such as graphite. First, a graphite core consisting of an outer hexagonal cell with six inner triangular cells is constructed from the graphite ribs. The graphite core may be placed on the back-up side of a SiC faceplate and then coated with SiC to produce a monolithic structure without the use of any bonding agent. Cores and methods for the fabrication thereof in which the six inner triangular cells are further divided into a plurality of cells are also disclosed.

Goela, Jitendra S.↗

NASA NTRS2001

Fabricating a hybrid imaging device having non-destructive sense nodes

A hybrid detector or imager includes two substrates fabricated under incompatible processes. An array of detectors, such as charged-coupled devices, are formed on the first substrate using a CCD fabrication process, such as a buried channel or peristaltic process. One or more charge-converting amplifiers are formed on a second substrate using a CMOS fabrication process. The two substrates are then bonded together to form a hybrid detector.

Wadsworth, Mark↗

NASA NTRS1995

Adjustable reed for weaving net-shaped tailored fabrics

An apparatus and method for forming woven fabrics through the use of an adjustable reed. The adjustable reed has multiple groups of reed wires that guide the warp yarns. The groups of reed wires move on reed rails parallel to the warp direction. In addition, rail expanders permit the space between the reed wires to be modified and telescoping rods attached to the rail sliders can be turned to permit the reed wires to be skewed to alter the fill yarn angle. These adjustments to the reed permit simultaneous variation of fill yarn angles and fabric widths and allow these variations to be made during fabrication, without the need to halt production.

Farley, Gary L.↗

NASA NTRS2003

Fabricating a hybrid imaging device

Wadsworth, Mark↗

NASA NTRS1995

Method for fabricating semiconductor devices

A process for fabricating gold/gallium arsenide structures, in situ, on molecular beam epitaxially grown gallium arsenide. The resulting interface proves to be Ohmic, an unexpected result which is interpreted in terms of increased electrode interdiffusion. More importantly, the present invention surprisingly permits the fabrication of Ohmic contacts in a III-V semiconductor material at room temperature. Although it may be desireable to heat the Ohmic contact to a temperature of, for example, 200 degrees Centigrade if one wishes to further decrease the resistance of the contact, such low temperature annealing is much less likely to have any deleterious affect on the underlying substrate. The use of the term in situ herein, contemplates continuously maintaining an ultra-high vacuum, that is a vacuum which is at least 10.sup.-8 Torr, until after the metallization has been completed. An alternative embodiment of the present invention comprising an additional step, namely the termination of the gallium arsenide by a two monolayer thickness of epitaxial aluminum arsenide as a diffusion barrier, enables the recovery of Schottky barrier behavior, namely a rectified I-V characteristic. The present invention provides a significant breakthrough in the fabrication of III-V semiconductor devices wherein excellent Ohmic contact and Schottky barrier interfaces to such devices can be achieved simply and inexpensively and without requiring the high temperature processing of the prior art and also without requiring the use of exotic high temperature refractory materials as substitutes for those preferred contact metals such as gold, aluminum and the like.

Kaiser, William J.↗

NASA NTRS2006

Evolution and Control of 2219 Aluminum Microstructural Features through Electron Beam Freeform Fabrication

Electron beam freeform fabrication (EBF3) is a new layer-additive process that has been developed for near-net shape fabrication of complex structures. EBF3 uses an electron beam to create a molten pool on the surface of a substrate. Wire is fed into the molten pool and the part translated with respect to the beam to build up a 3-dimensional structure one layer at a time. Unlike many other freeform fabrication processes, the energy coupling of the electron beam is extremely well suited to processing of aluminum alloys. The layer-additive nature of the EBF3 process results in a tortuous thermal path producing complex microstructures including: small homogeneous equiaxed grains; dendritic growth contained within larger grains; and/or pervasive dendritic formation in the interpass regions of the deposits. Several process control variables contribute to the formation of these different microstructures, including translation speed, wire feed rate, beam current and accelerating voltage. In electron beam processing, higher accelerating voltages embed the energy deeper below the surface of the substrate. Two EBF3 systems have been established at NASA Langley, one with a low-voltage (10-30kV) and the other a high-voltage (30-60 kV) electron beam gun. Aluminum alloy 2219 was processed over a range of different variables to explore the design space and correlate the resultant microstructures with the processing parameters. This report is specifically exploring the impact of accelerating voltage. Of particular interest is correlating energy to the resultant material characteristics to determine the potential of achieving microstructural control through precise management of the heat flux and cooling rates during deposition.

Taminger, Karen M.↗

NASA NTRS2006

Metallurgical Mechanisms Controlling Mechanical Properties of Aluminum Alloy 2219 Produced By Electron Beam Freeform Fabrication

The electron beam freeform fabrication (EBF3) layer-additive manufacturing process has been developed to directly fabricate complex geometry components. EBF3 introduces metal wire into a molten pool created on the surface of a substrate by a focused electron beam. Part geometry is achieved by translating the substrate with respect to the beam to build the part one layer at a time. Tensile properties have been demonstrated for electron beam deposited aluminum and titanium alloys that are comparable to wrought products, although the microstructures of the deposits exhibit features more typical of cast material. Understanding the metallurgical mechanisms controlling mechanical properties is essential to maximizing application of the EBF3 process. In the current study, mechanical properties and resulting microstructures were examined for aluminum alloy 2219 fabricated over a range of EBF3 process variables. Material performance was evaluated based on tensile properties and results were compared with properties of Al 2219 wrought products. Unique microstructures were observed within the deposited layers and at interlayer boundaries, which varied within the deposit height due to microstructural evolution associated with the complex thermal history experienced during subsequent layer deposition. Microstructures exhibited irregularly shaped grains, typically with interior dendritic structures, which were described based on overall grain size, morphology, distribution, and dendrite spacing, and were correlated with deposition parameters. Fracture features were compared with microstructural elements to define fracture paths and aid in definition of basic processing-microstructure-property correlations.

Domack, Marcia S.↗

NASA NTRS2008

Fabricating Nanodots using Lift-Off of a Nanopore Template

A process for fabricating a planar array of dots having characteristic dimensions of the order of several nanometers to several hundred nanometers involves the formation and use of a thin alumina nanopore template on a semiconductor substrate. The dot material is deposited in the nanopores, then the template is lifted off the substrate after the dots have been formed. This process is expected to be a basis for development of other, similar nanofabrication processes for relatively inexpensive mass production of nanometerscale optical, optoelectronic, electronic, and magnetic devices. Alumina nanopore templates are self-organized structures that result from anodization of aluminum under appropriate conditions. Alumina nanopore templates have been regarded as attractive for use in fabricating the devices mentioned above, but prior efforts to use alumina nanopore templates for this purpose have not been successful. One reason for the lack of success is that the aspect ratios (ratios between depth and diameter) of the pores have been too large: large aspect ratios can result in blockage of deposition and/or can prevent successful lift-off. The development of the present process was motivated partly by a requirement to reduce aspect ratios to values (of the order of 10) for which there is little or no blockage of deposition and attempts at lift-off are more likely to be successful. The fabrication process is outlined.

Yang, Eui-Hyeok↗