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At least 775 records · Page 43
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Reliability processing of remote direct memory access

Methods and systems for monitoring remote transmissions of messages among a plurality of nodes are described. A processing element in a first node may allocate a sequence number to a request to read and/or update data in a second node. The processing element may be different from main processors of the first node. The processing element may send the message and the sequence number to the second node. The processing element may modify a status of the sequence number to an active state, indicating a transmission of the message is pending. The processing element may, in response to a response from the second node, modify the status of the sequence number to an inactive state, indicating a completed transmission of the message. The processing element may, in response to no response from the second node within a time period, resend the message and the sequence number to the second node.

Kumar, Sameer↗
DOE OSTI2021

Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading: Preprint

Two generations of multiwire modules were studied under dynamic mechanical loading (DML). The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the state-of-the-art module did not demonstrate degradation under DML. The degradation in the earlier module was attributed to damage at the solder-gridline interfaces. Atomic force microscopy scratch testing estimated the wear resistance of each solder alloy to assess susceptibility to degradation. Bi-based alloys appear to be more wear resistant than In-based alloys, consistent with the DML results. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.

41 EE - Solar Energy Technologies Office (EE-4S)↗