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At least 757 records · Page 42

Developments to the Ares Multi-Physics Framework

Increasingly challenging problems in Entry, Descent, and Landing (EDL) have motivated the development of a computational framework that encompasses the advances in high-fidelity modeling and a robust foundation for TPS design in a single software package. This is the objective of the Ares multi-physics solver which, to date, couples the US3D flow solver with Icarus (material response) and Nero (radiation), through detailed time-scale management, while also incorporating the physics of fluid-solid boundaries such as gas-surface interaction chemistry and shape change. Ares, which is currently in the development stage, is being assessed against a variety of EDL relevant problems such as arc-jet tests of varying geometries and materials (Figs. 1 and 2), the earth entry of MSR-EES and the Titan entry of Dragonfly. This presentation will focus on the findings to-date regarding development of the technology as well as its standing with respect to available experimental data and/or reference solutions.

CFD↗

Multi-Gbps Fiber-Optic Wavefront Sensing Coherent Optical Receiver

We report recent progress on technology developments at the NASA Glenn Research Center using photonic lanterns for coherent optical communications applications. In particular, the development of a spatial mode-diversity optical receiver using a photonic lantern combined with a photonic integrated circuit (PIC). The PIC is designed for compatibility with the NASA Laser Communication Relay Demonstration’s (LCRD) differential phase-shift keying signaling format. We report on the PIC design and future characterization and packaging efforts. Additionally, we report on the development of a 19-channel photonic lantern and provide updates on efforts to use the photonic lantern as a wavefront sensing device. The photonic lantern insertion loss, and spatial-mode transfer characteristics are detailed, as well as the development of a predictive framework in which the intensities in the 19 single-mode output channels are used to reconstruct the wavefront of the light entering the multi-moded input side of the lantern. Finally, we discuss concepts for potential future systems using photonic lanterns and PICs that combine both wavefront sensing and coherent communications onto a single integrated platform.

Optical Communications↗

Development of the Next Generation Gas Trap for the Space Station Internal Thermal Control System

The current dual-membrane gas trap is designed to remove non-condensed gases (NCG) from the Internal Thermal Control System (ITCS) coolant on board the International Space Station (ISS). To date it has successfully served its purpose of preventing depriming, overspeed, and shutdown of the ITCS pump. However, contamination in the ITCS coolant has adversely affected the gas venting rate and lifetime of the gas trap, warranting a development effort for a next-generation gas trap. Design goals are to meet or exceed the current requirements to (1) include greater operating ranges and conditions, (2) eliminate reliance on the current hydrophilic tube fabrication process, and (3) increase operational life and tolerance to particulate and microbial growth fouling. In addition, the next generation gas trap will essentially be a 'dropin" design such that no modifications to the ITCS pump package assembly (PPA) will be required, and the implementation of the new design will not affect changes to the ITCS operational conditions, interfaces, or software. This paper will present the initial membrane module design and development work which has included (1) a trade study among several conceptual designs, (2) performance modeling of a hydrophobic-only design, and (3) small-scale development test data for the hydrophobic-only design. Testing has shown that the hydrophobic-only design is capable of performing even better than the current dual-membrane design for both steady-state gas removal and gas slug removal.

Leimkuehler, Thomas O.↗

Non-Axisymmetric Inflatable Pressure Structure (NAIPS) Full-Scale Pressure Test

Inflatable space structures have the potential to significantly reduce the required launch volume for large pressure vessels required for exploration applications including habitats, airlocks and tankage. In addition, mass savings can be achieved via the use of high specific strength softgoods materials, and the reduced design penalty from launching the structure in a densely packaged state. Large inclusions however, such as hatches, induce a high mass penalty at the interfaces with the softgoods and in the added rigid structure while reducing the packaging efficiency. A novel, Non-Axisymmetric Inflatable Pressure Structure (NAIPS) was designed and recently tested at NASA Langley Research Center to demonstrate an elongated inflatable architecture that could provide areas of low stress along a principal axis in the surface. These low stress zones will allow the integration of a flexible linear seal that substantially reduces the added mass and volume of a heritage rigid hatch structure. This paper describes the test of the first full-scale engineering demonstration unit (EDU) of the NAIPS geometry and a comparison of the results to finite element analysis.

Jones, Thomas C.↗

Development of Submillimeter SIS Mixers and Broadband HEMT Amplifiers

This is the final technical report for NASA grant NAG5-9493. entitled "Development of Submillimeter SIS Mixers and Broadband HEMT Amplifiers". The goal of this project was to develop and demonstrate a new generation of superconducting tunnel junction (SIS) receivers with extremely wide instantaneous (intermediate-frequency, or IF) bandwidths. of order 12 GHz. along with the wideband low-noise microwave HEMT (high electron mobility transistor) amplifiers which follow the SIS mixer. These wideband SIS/HEMT receivers would allow rapid submillimeter wavelength spectral line surveys to be carried out, for instance with the NASA airborne observatory SOFIA. and could potentially be useful for future submillimeter space missions such as SAFIR. In addition, there are potential NASA earth science applications. such as the monitoring of the distribution of chemical species in the stratosphere and troposphere using the limb-sounding technique. The overall goals of this project have been achieved: a broadband 200-300 SIS receiver was designed and constructed, and was demonstrated in the field through a test run at the Caltech Submillimeter Observatory on Mauna Kea. HI. The technical details are described in the appendices. which are primarily conference publications. but Appendix A also includes an unpublished summary of the latest results. The work on the SIS mixer design are described in the conference publications (appendices B and C). The "Supermix" software package that was developed at Caltech and used for the SIS design is also described in two conference papers, but has been substantially revised, debugged. and extended as part of the work completed for this grant. The Supermix package is made available to the community at no charge. The electromagnetic design of a radial waveguide probe similar to the one used in this work is described in a journal publication. Details of the novel fabrication procedure used for producing the SIS devices at JPL are also given in an upcoming journal article. Finally, details on the wideband HEMT amplifier design and noise characterization techniques are described in two publications.

Zmuidzinas, J.↗

Solar extreme ultraviolet sensor and advanced langmuir probe

For more than two decades, the staff of the Space Physics Research Laboratory (SPRL) has collaborated with the Goddard Space Flight Center (GSFC) in the design and implementation of Langmuir probes (LP). This program of probe development under the direction of Larry Brace of GSFC has evolved methodically with innovations to: improve measurement precision, increase the speed of measurement, and reduce the weight, size, power consumption and data rate of the instrument. Under contract NAG5-419 these improvements were implemented and are what characterize the Advanced Langmuir Probe (ALP). Using data from the Langmuir Probe on the Pioneer Venus Orbiter, Brace and Walter Hoegy of GSFC demonstrated a novel method of monitoring the solar extreme ultraviolet (EUV) flux. This led to the idea of developing a sensor similar to a Langmuir probe specifically designed to measure solar EUV (SEUV) that uses a similar electronics package. Under this contract, a combined instrument package of the ALP and SEUV sensor was to be designed, constructed, and laboratory tested. Finally the instrument was to be flight tested as part of sounding rocket experiment to acquire the necessary data to validate this method for possible use in future earth and planetary aeronomy missions. The primary purpose of this contract was to develop the electronics hardware and software for this instrument, since the actual sensors were suppied by GSFC. Due to budget constraints, only a flight model was constructed. These electronics were tested and calibrated in the laboratory, and then the instrument was integrated into the rocket payload at Wallops Flight Facility where it underwent environmental testing. After instrument recalibration at SPRL, the payload was reintegrated and launched from the Poker Flat Research Range near Fairbanks Alaska. The payload was successfully recovered and after refurbishment underwent further testing and developing to improve its performance for future use.

Voronka, N. R.↗

Study of the available finite element software packages at KSC

The interaction among the three finite element software packages, SDRCI/I-DEAS, MSC/NASTRAN, and I/FEM, used at NASA, Kennedy Space Center is addressed. The procedures for using more than one of these application software packages to model and analyze a structure design are discussed. Design and stress analysis of a solid rocket booster fixture is illustrated by using four different combinations of the three software packages. Their results are compared and show small yet acceptable differences.

Lu, Chu-Ho↗

A Miniature Palladium-Iron Thermometer for Temperatures Down to 0.05 K

Magnetic thermometers are appealing at temperatures below about 0.1 Kelvin, because the avoid the noise self-heating problems associated with resistive thermometers. In practical, metallic dilute electronic thermometers add the advantages of chemical stability, high thermal conductivity, and easy in heat sinking work we describe a palladium-iron thermometer which was designed to be small and conveniently packaged and optimized for use at temperatures down to 0.05 Kelvin. The device showed Curie-Weiss behavior above about 0.06 Kelvin, and we achieve 41 nK/ square root of z temperature resolution at a temperature of 49 mK. We describe the design and operation of this thermometers and present the test results.

Tuttle, Jim↗

An Environment Monitoring Package for the International Space Station

The first elements of the International Space Station (ISS) will soon be launched into space and over the next few years ISS will be assembled on orbit into its final configuration. Experiments will be performed on a continuous basis both inside and outside the station. External experiments will be mounted on attached payload locations specifically designed to accommodate experiments, provide data and supply power from ISS. From the beginning of the space station program it has been recognized that experiments will require knowledge of the external local environment which can affect the science being performed and may impact lifetime and operations of the experiment hardware. Recently an effort was initiated to design and develop an Environment Monitoring Package (EMP). This paper describes the derivation of the requirements for the EMP package, the type of measurements that the EMP will make and types of instruments which will be employed to make these measurements.

Carruth, M. Ralph↗

Development of an Environmental Monitoring Package for the International Space Station

The first elements of the International Space Station (ISS) will soon be launched into space and over the next few years ISS will be assembled on orbit into its final configuration. Experiments will be performed on a continuous basis both inside and outside the station. External experiments will be mounted on attached payload locations specifically designed to accommodate experiments and provide data and power from ISS. From the beginning of the space station program it has been recognized that external experiments will require knowledge of the external environment because it can affect the science being performed and may impact lifetime and operations of the experiments. Recently an effort was initiated to design and develop an Environment Monitoring Package (EMP) was started. This paper describes the derivation of the requirements for the EMP package, the type of measurements that the EMP will make and types of instruments which will be employed to make these measurements.

Carruth, Ralph M., Jr.↗

Reduction and Analysis of Phosphor Thermography Data With the IHEAT Software Package

Detailed aeroheating information is critical to the successful design of a thermal protection system (TPS) for an aerospace vehicle. This report describes NASA Langley Research Center's (LaRC) two-color relative-intensity phosphor thermography method and the IHEAT software package which is used for the efficient data reduction and analysis of the phosphor image data. Development of theory is provided for a new weighted two-color relative-intensity fluorescence theory for quantitatively determining surface temperatures on hypersonic wind tunnel models; an improved application of the one-dimensional conduction theory for use in determining global heating mappings; and extrapolation of wind tunnel data to flight surface temperatures. The phosphor methodology at LaRC is presented including descriptions of phosphor model fabrication, test facilities and phosphor video acquisition systems. A discussion of the calibration procedures, data reduction and data analysis is given. Estimates of the total uncertainties (with a 95% confidence level) associated with the phosphor technique are shown to be approximately 8 to 10 percent in the Langley's 31-Inch Mach 10 Tunnel and 7 to 10 percent in the 20-Inch Mach 6 Tunnel. A comparison with thin-film measurements using two-inch radius hemispheres shows the phosphor data to be within 7 percent of thin-film measurements and to agree even better with predictions via a LATCH computational fluid dynamics solution (CFD). Good agreement between phosphor data and LAURA CFD computations on the forebody of a vertical takeoff/vertical lander configuration at four angles of attack is also shown. In addition, a comparison is given between Mach 6 phosphor data and laminar and turbulent solutions generated using the LAURA, GASP and LATCH CFD codes. Finally, the extrapolation method developed in this report is applied to the X-34 configuration with good agreement between the phosphor extrapolation and LAURA flight surface temperature predictions. The phosphor process outlined in the paper is believed to provide the aerothermodynamic community with a valuable capability for rapidly obtaining (4 to 5 weeks) detailed heating information needed in TPS design.

Merski, N. Ronald↗

Quantitative Evaluation of 3 DBMS: ORACLE, SEED AND INGRES

Characteristics required for NASA scientific data base management application are listed as well as performance testing objectives. Results obtained for the ORACLE, SEED, and INGRES packages are presented in charts. It is concluded that vendor packages can manage 130 megabytes of data at acceptable load and query rates. Performance tests varying data base designs and various data base management system parameters are valuable to applications for choosing packages and critical to designing effective data bases. An applications productivity increases with the use of data base management system because of enhanced capabilities such as a screen formatter, a reporter writer, and a data dictionary.

Sylto, R.↗

(abstract) Electronic Packaging for Microspacecraft Applications

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

technology multichip modules wafer scale integrati↗

Pressure control and analysis report: Hydrogen Thermal Test Article (HTTA)

Tasks accomplished during the HTTA Program study period included: (1) performance of a literature review to provide system guidelines; (2) development of analytical procedures needed to predict system performance; (3) design and analysis of the HTTA pressurization system considering (a) future utilization of results in the design of a spacecraft maneuvering system propellant package, (b) ease of control and operation, (c) system safety, and (d) hardware cost; and (4) making conclusions and recommendations for systems design.

Source record↗

Structural requirements and technology needs of geostationary platforms

To identify structural requirements and technology needs of the geostationary platforms, two design alternatives are analyzed with respect to utilities accommodation, interface, and strength and stiffness requirements. Alternative 1 is comprised of 6,800 kg (15,000 lb) platform modules, each delivered to low earth orbit (LEO) with an attached orbit transfer vehicle (OTV) in a single Shuttle flight, deployed, and transferred to a geostationary constellation of platforms. Alternative 2 is made up of 16,800 kg (37,000 lb) platform modules, each delivered to LEO, deployed, mated to a 2 stage OTV (delivered to LEO in two additional Shuttle flights) and transferred to GEO for docking with other modules to form a single large platform. The top candidates for deployable structure elements are the expandable truss beam and the Astromast. The beam, fabricated of graphite/epoxy with a designed coefficient of thermal expansion of zero, provides good packaging density and high strength and stiffness per unit weight. The Astromast provides the best packaging density, but lacks the strength and stiffness required for the platform payloads. A graphite/epoxy mast with the Astromast packaging density is an advancement in technology needed for optimizing the geostationary platform designs.

Stone, G. R.↗

Solid motor diagnostic instrumentation

A review of typical surveillance and monitoring practices followed during the flight phases of representative solid-propellant upper stages and apogee motors was conducted to evaluate the need for improved flight diagnostic instrumentation on future spacecraft. The capabilities of the flight instrumentation package were limited to the detection of whether or not the solid motor was the cause of failure and to the identification of probable primary failure modes. Conceptual designs of self-contained flight instrumentation packages capable of meeting these reqirements were generated and their performance, typical cost, and unit characteristics determined. Comparisons of a continuous real time and a thresholded hybrid design were made on the basis of performance, mass, power, cost, and expected life. The results of this analysis substantiated the feasibility of a self-contained independent flight instrumentation module as well as the existence of performance margins by which to exploit growth option applications.

Nakamura, Y.↗

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗