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At least 757 records · Page 42

A Low SWaP-C prototype Ka-band Frequency Synthesizer for Atomic Clocks

We present a low size, weight, power and cost (SWaP-C) prototype circuit of a Ka-band frequency synthesizer. It takes advantage of a phase-locked loop single integrated circuit (IC) and harmonic generation with high speed CMOS gates. We use a direct digital synthesizer (DDS) IC to tune the final output with microHertz resolution. An ultra-low-power micro controller that could serve as the clock controller is used to control the PLL and the DDS. All components are commercial off the shelf (COTS) with acceptable industrial support. The total power consumption is about 1.6 Watt with -45 dBm useful output at 40.507347996 GHz. The short-term instability introduced by the prototype is 7.3E-14 at 1s. The prototyped subsystem uses COTS demonstration boards for the sake of agile prototyping. There is still significant margin for improvement of the size and weight.

Tjoelker, Robert L.↗

Pulse-Width Proportional-Controller Circuit

Proportional controller for motor speed provides full 0- to 100-percent linear control of durations of motor-driving pulses. Controller uses commercially available LM3900 integrated circuit, which requires only single supply voltage of 4 to 30 V. Control voltage provided by adjustable potentiometer or by external source of feedback information such as motor-speed sensing circuit.

Clukey, R. W.↗

Small, Optically-Driven Power Source

Power transmitted along fiber-optic cables. Transmitted as infrared light along fiber-optic cable, converted to electricity to supply small electronic circuit. Power source and circuit remains electrically isolated from each other for safety or reduces electromagnetic interference. Array of diodes made by standard integrated-circuit techniques and packaged for mounting at end of fiber-optic cable.

Cockrum, Richard H.↗

Solid State Circuits for Cryogenic Operation

Tests confirm operation of five commercial semiconductor devices at cryogenic temperatures. The five devices - one tunnel diode, one field-effect transistor, and three CMOS integrated circuits - all perform well in circuits immersed in liquid-helium bath. For some tests, bath temperature was reduced to 1,25K by pumping.

Petrac, D.↗

Miniature bioelectric device accurately measures and telemeters temperature

Miniature micropower solid-state circuit measures and telemeters the body temperature of laboratory animals over periods up to two years. The circuit employs a thermistor as a temperature sensing element and an fm transmitter. It is constructed from conventional discrete components or integrated circuits.

Fryer, T. B.↗

GaAs-based optoelectronic neurons

An integrated, optoelectronic, variable thresholding neuron implemented monolithically in GaAs integrated circuit and exhibiting high differential optical gain and low power consumption is presented. Two alternative embodiments each comprise an LED monolithically integrated with a detector and two transistors. One of the transistors is responsive to a bias voltage applied to its gate for varying the threshold of the neuron. One embodiment is implemented as an LED monolithically integrated with a double heterojunction bipolar phototransistor (detector) and two metal semiconductor field effect transistors (MESFET's) on a single GaAs substrate and another embodiment is implemented as an LED monolithically integrated with three MESFET's (one of which is an optical FET detector) on a single GaAs substrate. The first noted embodiment exhibits a differential optical gain of 6 and an optical switching energy of 10 pJ. The second embodiment has a differential optical gain of 80 and an optical switching energy of 38 pJ. Power consumption is 2.4 and 1.8 mW, respectively. Input 'light' power needed to turn on the LED is 2 micro-W and 54 nW, respectively. In both embodiments the detector is in series with a biasing MESFET and saturates the other MESFET upon detecting light above a threshold level. The saturated MESFET turns on the LED. Voltage applied to the biasing MESFET gate controls the threshold.

Lin, Steven H.↗

Micro-opto-mechanical devices and systems using epitaxial lift off

The integration of high quality, single crystal thin film gallium arsenide (GaAs) and indium phosphide (InP) based photonic and electronic materials and devices with host microstructures fabricated from materials such as silicon (Si), glass, and polymers will enable the fabrication of the next generation of micro-opto-mechanical systems (MOMS) and optoelectronic integrated circuits. Thin film semiconductor devices deposited onto arbitrary host substrates and structures create hybrid (more than one material) near-monolithic integrated systems which can be interconnected electrically using standard inexpensive microfabrication techniques such as vacuum metallization and photolithography. These integrated systems take advantage of the optical and electronic properties of compound semiconductor devices while still using host substrate materials such as silicon, polysilicon, glass and polymers in the microstructures. This type of materials optimization for specific tasks creates higher performance systems than those systems which must use trade-offs in device performance to integrate all of the function in a single material system. The low weight of these thin film devices also makes them attractive for integration with micromechanical devices which may have difficulty supporting and translating the full weight of a standard device. These thin film devices and integrated systems will be attractive for applications, however, only when the development of low cost, high yield fabrication and integration techniques makes their use economically feasible. In this paper, we discuss methods for alignment, selective deposition, and interconnection of thin film epitaxial GaAs and InP based devices onto host substrates and host microstructures.

Camperi-Ginestet, C.↗

Good Trellises for IC Implementation of Viterbi Decoders for Linear Block Codes

This paper investigates trellis structures of linear block codes for the integrated circuit (IC) implementation of Viterbi decoders capable of achieving high decoding speed while satisfying a constraint on the structural complexity of the trellis in terms of the maximum number of states at any particular depth. Only uniform sectionalizations of the code trellis diagram are considered. An upper-bound on the number of parallel and structurally identical (or isomorphic) subtrellises in a proper trellis for a code without exceeding the maximum state complexity of the minimal trellis of the code is first derived. Parallel structures of trellises with various section lengths for binary BCH and Reed-Muller (RM) codes of lengths 32 and 64 are analyzed. Next, the complexity of IC implementation of a Viterbi decoder based on an L-section trellis diagram for a code is investigated. A structural property of a Viterbi decoder called add-compare-select (ACS)-connectivity which is related to state connectivity is introduced. This parameter affects the complexity of wire-routing (interconnections within the IC). The effect of five parameters namely: (1) effective computational complexity; (2) complexity of the ACS-circuit; (3) traceback complexity; (4) ACS-connectivity; and (5) branch complexity of a trellis diagram on the very large scale integration (VISI) complexity of a Viterbi decoder is investigated. It is shown that an IC implementation of a Viterbi decoder based on a nonminimal trellis requires less area and is capable of operation at higher speed than one based on the minimal trellis when the commonly used ACS-array architecture is considered.

Moorthy, Hari T.↗

Analog bus driver and multiplexer

For a source-follower signal chain, the ohmic drop in the selection switch causes unacceptable voltage offset, non-linearity, and reduced small signal gain. For an op amp signal chain, the required bias current and the output noise rises rapidly with increasing the array format due to a rapid increase in the effective capacitance caused by the Miller effect boosting up the contribution of the bus capacitance. A new switched source-follower signal chain circuit overcomes limitations of existing op-amp based or source follower based circuits used in column multiplexers and data readout. This will improve performance of CMOS imagers, and focal plane read-out integrated circuits for detectors of infrared or ultraviolet light.

Pain, Bedabrata↗

FPGA-based hardware/software co-design instrument command-and-control solutions

Traditional design methodology dictates that an instrument electronics platform should consist of a printed circuit board (PCB)—often multiple boards—populated with many components and support electronics. More specifically, each subsystem is composed of numerous integrated circuits (ICs) spread across the board(s), connected with innumerable traces and wires. Additionally, it is often the case that the hardware and software design teams are quite separated—the hardware team designs a board and hands it to a software team, who must then deal with any hardware quirkiness and may need to rewrite software due to inadequately defined interfaces...

Allen, Mark A.↗

Stable Electrical Operation of 6H-SiC JFETs and ICs for Thousands of Hours at 500 C

The fabrication and testing of the first semiconductor transistors and small-scale integrated circuits (ICs) to achieve up to 3000 h of stable electrical operation at 500 C in air ambient is reported. These devices are based on an epitaxial 6H-SiC junction field-effect transistor process that successfully integrated high temperature ohmic contacts, dielectric passivation, and ceramic packaging. Important device and circuit parameters exhibited less than 10% of change over the course of the 500 C operational testing. These results establish a new technology foundation for realizing durable 500 C ICs for combustion-engine sensing and control, deep-well drilling, and other harsh-environment applications.

Neudeck, Philip G.↗

Solar cell system having alternating current output

A monolithic multijunction solar cell was modified by fabricating an integrated circuit inverter on the back of the cell to produce a device capable of generating an alternating current output. In another embodiment, integrated curcuit power conditioning electronics was incorporated in a module containing a solar cell power supply.

Evans, J. C., Jr.↗

SEU/SET Tolerant Phase-Locked Loops

The phase-locked loop (PLL) is an old and widely used circuit for frequency and phase demodulation, carrier and clock recovery, and frequency synthesis [1]. Its implementations range from discrete components to fully integrated circuits and even to firmware or software. Often the PLL is a highly critical component of a system, as for example when it is used to derive the on-chip clock, but as of this writing no definitive single-event upset (SET)/single-event transient (SET) tolerant PLL circuit has been described. This chapter hopes to rectify that situation, at least in regard to PLLs that are used to generate clocks. Older literature on fault-tolerant PLLs deals with detection of a hard failure, which is recovered by replacement, repair, or manual restart of discrete component systems. Several patents exist along these lines (6349391, 6272647, and 7089442). A newer approach is to harden the parts of a PLL system, to one degree or another, such as by using a voltage-based charge pump or a triple modular redundant (TMR) voted voltage-controlled oscillator (VCO). A more comprehensive approach is to harden by triplication and voting (TMR) all the digital pieces (primarily the divider) of a frequency synthesis PLL, but this still leaves room for errors in the VCO and the loop filter. Instead of hardening or voting pieces of a system, such as a frequency synthesis system (i.e., clock multiplier), we will show how the entire system can be voted. There are two main ways of doing this, each with advantages and drawbacks. We will show how each has advantages in certain areas, depending on the lock acquisition and tracking characteristics of the PLL. Because of this dependency on PLL characteristics, we will briefly revisit the theory of PLLs. But first we will describe the characteristics of voters and their correct application, as some literature does not follow the voting procedure that guarantees elimination of errors. Additionally, we will find that voting clocks is a bit trickier than voting data where an infallible clock is assumed. It is our job here to produce (or recover) that assumed infallible clock!

Shuler, Robert L., Jr.↗

Arc spraying solderable tabs to glass

Tabs suitable for electrical or mechanical connections in solar cells and integrated circuits are made by spraying technique. Solder wets copper, copper bonds to aluminum, and aluminum adheres to glass. Arc spraying is automated and integrated with encapsulation, eliminating hand tabbing, improving reliability, and reducing cost.

Lindmayer, J.↗

Tester for Multiple-Conductor Cables

Portable testing circuit enables technician to determine quickly wiring errors in multiple-conductor electrical cable or terminal connectors. Active unit tester made of inexpensive integrated circuits and other readily available components. Timer and one-shot generate pulses counted by shift registers. Shift-register output terminals wired to connector pins so voltage applied to each pin in sequence.

Wirth, Manfred N.↗

GaAs microwave devices and circuits with submicron electron-beam defined features

This paper describes the fabrication and application of GaAs FET's, both as discrete microwave devices and as the key active components in monolithic microwave integrated circuits. The performance of these devices and circuits is discussed for frequencies ranging from 3 to 25 GHz. The crucial fabrication step is the formation of the submicron gate by electron-beam lithography.

Wisseman, W. R.↗

Radiation-Hard Parallel Readout Circuit for Low-Frequency Voltage Signal Measurements

NASA Goddard Space Flight Center (GSFC) has successfully developed and tested a custom-designed low-noise multi-channel digitizer (MCD) application specific integrated circuit (ASIC) for operation in harsh radiation environments. The MCD-ASIC is optimized for low-frequency and low-voltage signal measurements from sensors and transducers. It has 20 input channels where each channel is comprised of auto-zeroed chopper variable-gain amplifier, post amplifier, and a second order ∑∆ modulator. ∑∆ analog-to-digital converter (ADC) relies on oversampling and noise shaping to achieve high-resolution conversion. However, the MCD-ASIC requires digital filtering and decimation to convert the output single bit streams from the ADC to useful data words. A parallel digital platform such as a field-programmable-gate-array (FPGA) is highly suitable to fully leverage the capabilities of the MCD-ASIC. The FPGA controls the MCD-ASIC via serial peripheral interface (SPI) protocol and acquires data from it. A Python-script communicates with the FPGA board through a USB interface on a cross operating platform. Using this architecture, the system is capable of monitoring up to 20 voltage readout channels simultaneously in a real-time manner. Each channel’s parameters can be programmed independently allowing maximum user versatility. In this paper, we present analysis of the analog front-end, the implementation of the digital processing unit on the FPGA, and provide noise performance results from the MCD-ASIC readout.

ASIC↗

Piezoresistive stress sensors on (110) silicon wafers

Structural reliability of electronic packages has become an increasing concern for a variety of reasons including the advent of higher integrated circuit densities, power density levels, and operating temperatures. A powerful method for experimental evaluation of die stress distributions is the use of test chips incorporating integral piezoresistive sensors. In this paper, the basic equations needed for the design of stress sensors fabricated on the surface of (110) oriented silicon wafers have been presented. Several sensor rosette configurations have been explored, including the familiar three-element 0-45-90 rosette. Rosette designs have been found which minimize the necessary calibration procedures and permit more stress components to be measured. It has been established that stress sensors on the surface of (110) test chips are sensitive to four out of the six stress components at a point.

Kang, Y. L.↗