In-Operando Imaging of Field Spreading and Carrier Transport in GaN-Based pin Diodes.
Abstract not provided.
SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Abstract not provided.
Abstract not provided.
This test plan describes the requirements for sample preparation only. Metallography is also covered. Burnup and density exams will be performed in the Idaho National Laboratory (INL) Analytical Laboratory and planning will be done using the required paperwork of that facility; the retained fission gas work will be covered by a separate test plan.
Abstract not provided.
Explore the source record for details and available documents.
Abstract not provided.
Abstract not provided.
Abstract not provided.
Abstract not provided.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
A REBCO superconductor tape that can achieve a lift factor greater than or equal to approximately 3.0 or 4.0 in an approximately 3 T magnetic field applied perpendicular to a REBCO tape at approximately 30 K. In an embodiment, the REBCO superconductor tape can include a critical current density less than or equal to approximately 4.2 MA/cm2 at 77 K in the absence of an external magnetic field. In another embodiment, the REBCO superconductor tape can include a critical current density greater than or equal to approximately 12 MA/cm2 at approximately 30 K in a magnetic field of approximately 3 T having an orientation parallel to a c-axis.
Explore the source record for details and available documents.
Explore the source record for details and available documents.
Presentation to be presented during the Site-Directed Research and Development (SDRD) program FY 2021 review meeting (Webex), September 22–23, 2021.
Explore the source record for details and available documents.