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At least 757 records · Page 42

HII regions in dwarf irregular galaxies of the local group

Deep, narrowband H alpha Charge Coupled Device (CCD) surveys of HII regions were carried out in several dwarf irregular galaxies in and near the local group. Data are now complete for these galaxies: NGC 6822, GR 8, IC 10, IC 1613, Sextans A, Sextans B, and Sag Irr. Observations are complete for DDO 47, 53, 167, 168 and 187. Details of some of the results for the surveys completed so far are discussed. For NGC 6822, CCD survey at H alpha resulted in the detection of 145 HII regions in the local group irregular galaxy NGC 6822. Most of them are newly detected, faint surface-brightness objects. Positions, maps and dimensions are being published elsewhere. For GR 8, a deep narrowband H alpha imaging of the nearby dwarf irregular galaxy GR 8 revealed a total of 32 HII regions. Positions, H alpha luminosities, and sizes of these objects were determined. The H alpha luminosity function has the same shape as that for more luminous galaxies, except for size of sample effects. Most HII regions detected are at the very low luminosity end of the general luminosity function. For IC 10, a deep CCD narrowband H alpha imaging of the local group dwarf irregular galaxy IC 10 revealed a total of 144 HII regions. Positions, H alpha luminosities, and sizes of these objects were determined. The H alpha luminosity function has the same shape as that for more luminous galaxies.

Hodge, Paul↗

CS in nearby galaxies: Distribution, kinematics, and multilevel studies

As a result of observations at the Institute for Radio Astronomy in the Millimeter Range (IRAM) 30-m telescope, maps of the distribution of the J = 2-1 transition of CS toward the galaxies IC 342 and NGC 253 are presented. The distribution of the CS emission from NGC 253 is consistent with the CO 1-0 line. The distribution of the CS emission from IC 342, however, resembles more that seen in the CO 3-2 line. For the first time, the detection of the isotopic substitution C-34S is reported toward an external galaxy: The C-34S 2-1 line has been detected toward NGC 253 and M 82 and the C-34S line has been detected tentatively toward M 82. Also for the first time, extragalactic CS has been observed in the 3-2 (toward NGC 253, IC 342 and M 82) and 5-4 (NGC 253 and IC 342) transitions.

Mauersberger, R.↗

Interstellar extinction toward the Cas OB6 association: Where is the dust?

We have completed a multiband (ultraviolet, optical, and near-infrared) study of the interstellar extinction properties of nine massive stars in IC 1805 and IC 1848, which are both part of Cas OB6 in the Perseus spiral arm. Our analysis includes determination of absolute extinction over the wavelength range from 3 micrometers to 1250 A. We have attempted to distinguish between foreground dust and dust local to Cas OB6. This is done by quantitatively comparing extinction laws of the least reddened sightlines (sampling mostly foreground dust) versus the most reddened sightlines (sampling a larger fraction of the dust in the Cas OB6 region). We have combined previous investigations to better understand the evolution of the interstellar medium in this active star forming region. We found no variation of extinction curve behavior between moderately reddend and heavily reddened Cas OB6 stars. None of the curves show any significant deviation from the Cardelli-Clayton-Mathis (CCM) R(sub upsilon)-dependent extinction. They are all consistent with that seen from diffuse dust. Most or all of the dust along the line of sight may be foreground to Cas OB6. Massive star forming regions can show significant deviations from CCM behavior which have been attributed to processing of the dust grains. Any dust local to the association must exist far from the hot stars in IC 1805 and IC 1848. A previous episode of star formation may have already cleared out the region of most of the gas and dust. Evidence for this can be seen in H I and IRAS data of the region.

Hanson, Margaret Murray↗

ISO Mid-Infrared Observations of Giant HII Regions in M33

We present Infrared Space Observatory Camera (ISOCAM) Circular Variable Filter scans of three giant HII regions in M33. IC 133, NGC 595, and CC 93 span a wide range of metallicity, luminosity, nebular excitation, and infrared excess; three other emission regions (CC 43, CC 99, and a region to the northeast of the core of NGC 595) are luminous enough in the mid-infrared to be detected in the observed fields. ISOCAM CVF observations provide spatially resolved observations (5'') of 151 wavelengths between 5.1 and 16.5 microns with a spectral resolution R = 35 to 50. We observe atomic emission lines ([Ne II], [Ne III], and [S IV]), several "unidentified infrared bands" (UIBs; 6.2, 7.7, 8.6, 11.3, 12.0, and 12.7 microns), and in some cases a continuum which rises steeply at longer wavelengths. We conclude that the spectra of these three GHRs are well explained by combinations of ionized gas, PAHs, and very small grains in various proportions and with different spatial distributions. Comparisons between observed ratios of the various UIBs with model ratios indicate that the PAHs in all three of the GHRs are dehydrogenated and that the small PAHs have been destroyed in IC 133 but have survived in NGC 595 and CC 93. The [Ne III]/[Ne II] ratios observed in IC 133 and NGC 595 are consistent with their ages of 5 and 4.5 Myr, respectively; the deduced ionization parameter is higher in IC 133, consistent with its more compact region of emission.

Skelton, B. P.↗

Estimation of the oxalate content of foods and daily oxalate intake

BACKGROUND: The amount of oxalate ingested may be an important risk factor in the development of idiopathic calcium oxalate nephrolithiasis. Reliable food tables listing the oxalate content of foods are currently not available. The aim of this research was to develop an accurate and reliable method to measure the food content of oxalate. METHODS: Capillary electrophoresis (CE) and ion chromatography (IC) were compared as direct techniques for the estimation of the oxalate content of foods. Foods were thoroughly homogenized in acid, heat extracted, and clarified by centrifugation and filtration before dilution in water for analysis. Five individuals consuming self-selected diets maintained food records for three days to determine their mean daily oxalate intakes. RESULTS: Both techniques were capable of adequately measuring the oxalate in foods with a significant oxalate content. With foods of very low oxalate content (<1.8 mg/100 g), IC was more reliable than CE. The mean daily intake of oxalate by the five individuals tested was 152 +/- 83 mg, ranging from 44 to 352 mg/day. CONCLUSIONS: CE appears to be the method of choice over IC for estimating the oxalate content of foods with a medium (>10 mg/100 g) to high oxalate content due to a faster analysis time and lower running costs, whereas IC may be better suited for the analysis of foods with a low oxalate content. Accurate estimates of the oxalate content of foods should permit the role of dietary oxalate in urinary oxalate excretion and stone formation to be clarified. Other factors, apart from the amount of oxalate ingested, appear to exert a major influence over the amount of oxalate excreted in the urine.

NASA Discipline Regulatory Physiology↗

Mid-IR interband cascade lasers

Efficient mid-IR interband cascade (IC) lasers are developed based on 111-V semiconductor materials to cover wavelength range from 2.7 to 5.6 (mu)m. These IC lasers reuse injected electrons in cascade stages for photon generation with high quantum efficiency to achieve high output powers. Also, IC lasers have low threshold current density with very efficient use of applied voltage, resulting in reduced power consumptions. Single-mode distributed feedback lasers have been made, and integrated into aircraft and balloon instrument which made measurements of CH4 and HCI. In this work, the characteristics of IC lasers and their recent development are reviewed.

mid - infrared↗

Effect of Embedded Piezoelectric Sensors on Fracture Toughness and Fatigue Resistance of Composite Laminates Under Mode I Loading

Double-cantilevered beam (DCB) specimens of a glass/epoxy composite material with embedded piezoelectric sensors were tested both statically and under fatigue loading to determine the effect of the embedded material on the Mode I fracture toughness and fatigue resistance compared to baseline data without the embedded elements. A material known as LaRC-Macrofiber Composite (LaRC-MFC (TradeMark)), or MFC, was embedded at the midplane of the specimen during the layup. Specimens were manufactured with the embedded MFC material either at the loaded end of the specimen to simulate an initial delamination; or with the MFC material located at the delaminating interface, with a Teflon film at the loaded end to simulate an initial delamination. There were three types of specimens with the embedded material at the delaminating interface: co-cured with no added adhesive; cured with a paste adhesive applied to the embedded element; or cured with a film adhesive added to the embedded material. Tests were conducted with the sensors in both the passive and active states. Results were compared to baseline data for the same material without embedded elements. Interlaminar fracture toughness values (G(sub Ic)) for the passive condition showed little change when the MFC was at the insert end. Passive results varied when the MFC was at the delaminating interface. For the co-cured case and with the paste adhesive, G(sub Ic) decreased compared to the baseline toughness, whereas, for the film adhesive case, G(sub Ic) was significantly greater than the baseline toughness, but the failure was always catastrophic. When the MFC was in the active state, G(sub Ic) was generally lower compared to the passive results. Fatigue tests showed little effect of the embedded material whether it was active or passive compared to baseline values.

Murri, Gretchen B.↗

Characterizing the LANDSAT Global Long-Term Data Record

The effects of global climate change are fast becoming politically, sociologically, and personally important: increasing storm frequency and intensity, lengthening cycles of drought and flood, expanding desertification and soil salinization. A vital asset in the analysis of climate change on a global basis is the 34-year record of Landsat imagery. In recognition of its increasing importance, a detailed analysis of the Landsat observation coverage within the US archive was commissioned. Results to date indicate some unexpected gaps in the US-held archive. Fortunately, throughout the Landsat program, data have been downlinked routinely to International Cooperator (IC) ground stations for archival, processing, and distribution. These IC data could be combined with the current US holdings to build a nearly global, annual observation record over this 34-year period. Today, we have inadequate information as to which scenes are available from which IC archives. Our best estimate is that there are over four million digital scenes in the IC archives, compared with the nearly two million scenes held in the US archive. This vast pool of Landsat observations needs to be accurately documented, via metadata, to determine the existence of complementary scenes and to characterize the potential scope of the global Landsat observation record. Of course, knowing the extent and completeness of the data record is but the first step. It will be necessary to assure that the data record is easy to use, internally consistent in terms of calibration and data format, and fully accessible in order to fully realize its potential.

Arvidson, T.↗

High-Speed Operation of Interband Cascade Lasers

Optical sources operating in the atmospheric window of 3-5 microns are of particular interest for the development of free-space optical communication link. It is more advantageous to operate the free-space optical communication link in 3-5-microns atmospheric transmission window than at the telecom wavelength of 1.5 m due to lower optical scattering, scintillation, and background radiation. However, the realization of optical communications at the longer wavelength has encountered significant difficulties due to lack of adequate optical sources and detectors operating in the desirable wavelength regions. Interband Cascade (IC) lasers are novel semiconductor lasers that have a great potential for the realization of high-power, room-temperature optical sources in the 3-5-microns wavelength region, yet no experimental work, until this one, was done on high-speed direct modulation of IC lasers. Here, highspeed interband cascade laser, operating at wavelength 3.0 m, has been developed and the first direct measurement of the laser modulation bandwidth has been performed using a unique, highspeed quantum well infrared photodetector (QWIP). The developed laser has modulation bandwidth exceeding 3 GHz. This constitutes a significant increase of the IC laser modulation bandwidth over currently existing devices. This result has demonstrated suitability of IC lasers as a mid-IR light source for multi-GHz free-space optical communications links

Soibel, Alexander↗

Multicolor Photometric Observation of Lightning from Space: Comparison with Radio Measurements

This study evaluates the effectiveness of spectrophotometric measurements from space in revealing properties of lightning flash. The multicolor optical waveform data obtained by FORMOSAT-2/Imager of Sprites and Upper Atmospheric Lightning (ISUAL) were analyzed in relation to National Lightning Detection Network (NLDN), North Alabama Lightning Mapping Array (LMA). As of July 2011, we found six lightning events which were observed by ISUAL and North Alabama LMA. In two of these events, NLDN showed clear positive cloud-to-ground (CG) discharges with peak current of +139.9 kA and +41.6 kA and, around that time, LMA showed continuous intra-cloud (IC) leader activities at 4-6 km altitudes. ISUAL also observed consistent optical waveforms of the IC and CG components and, interestingly, it was found that the blue/red spectral ratio clearly decreased by a factor of 1.5-2.5 at the time of CG discharges. Other four lightning events in which NLDN did not detect any CG discharges were also investigated, but such a feature was not found in any of these cases. These results suggest that the optical color of CG component is more reddish than that of IC component and we explain this as a result of more effective Rayleigh scattering in blue light emissions coming from lower-altitude light source. This finding suggests that spectral measurements could be a new useful technique to characterize ICs and CGs from space. In this talk, we will also present a result from lightning statistical analysis of ISUAL spectrophotometric data and ULF magnetic data.

Adachi, Toru↗

Delay Tolerant, Radio Frequency Identification (RFID )-enabled Sensing

Radio Frequency Identification (RFID) technology offers a completely passive method to transmit fixed data sequences from an RFID tag, which typically doesn’t have its own power supply, to an interrogator. Radio frequency (RF) energy harvested from the interrogator is rectified by the tag and used to charge an integrated circuit (IC). The IC then modulates the received signal with the data stored on the tag and reflects the energy back to the interrogator. RFID has seen great proliferation in terrestrial inventory management applications, and it has recently made the jump to spaceflight applications onboard the International Space Station, augmenting an existing optical bar‐code infrastructure for tracking supplies. A number of advanced automated logistics management (ALM) concepts employing RFID are currently being developed and evaluated, including so‐called “smart” shelves, cubbies, and trash receptacles using low‐power, embeddable RFID interrogators. An infrastructure where both crew members and robotic assistants, such as autonomous free flyers, are similarly equipped with small RFID interrogators seems likely. It therefore behooves us to consider extending this infrastructure beyond ALM to applications such as low power, embedded sensing. Typically, data on an RFID tag can only be written by an RFID interrogator, using interrogator energy. In recent years, however, a few efforts have focused on using that energy to drive data acquisition from the tag IC, allowing the tag to modify its stored data sequence with sensor data before replying to an interrogator. In this way, the tag can act as a completely passive sensing device. One problem exists with this approach, however: the tag cannot gather data when an interrogator is not present. Thus, strictly passive RFID sensing tags cannot gather data at regular intervals, in the manner of a typical wireless sensor network, without careful, and impractical, planning of mobile interrogator movements. To address this shortcoming, we look to a recent advance in RFID technology which allows an external microprocessor to power the tag IC and write directly into its RFID memory using a wired serial interface. In this paradigm, data gathering is driven by a small, on‐board power supply (using batteries or harvested energy), and data transfer is provided passively through the RFID interrogation service. Since communication typically consumes the lion’s share of power in WSNs, such a technique has the potential to enable extremely long‐lived, embedded wireless sensing when used with extremely low‐current microcontrollers. Since the communication channel is only open when an interrogator is present and actively interrogating the RFID sensing tag, transport of periodically‐sampled sensor data presents itself as a delay/disruption‐tolerant networking (DTN) problem. In this paper, we present the design of a DTN‐like overlay on the common EPC Global, Class 1, Generation 2 RFID standard. This overlay allows seamless, guaranteed data transfer using the EPC Global protocol, supporting extremely low‐power, embedded sensing using an infrastructure likely to be already in place for ALM applications. We evaluate a prototype implementation of a complete end‐to‐end system using a robotic RFID interrogation agent, and we present future directions for the development of this sensing technique.

Raymond S. Wagner↗

An Integrated Circuit for Radio Astronomy Correlators Supporting Large Arrays of Antennas

Radio telescopes that employ arrays of many antennas are in operation, and ever larger ones are being designed and proposed. Signals from the antennas are combined by cross-correlation. While the cost of most components of the telescope is proportional to the number of antennas N, the cost and power consumption of cross-correlationare proportional to N2 and dominate at sufficiently large N. Here we report the design of an integrated circuit (IC) that performs digital cross-correlations for arbitrarily many antennas in a power-efficient way. It uses an intrinsically low-power architecture in which the movement of data between devices is minimized. In a large system, each IC performs correlations for all pairs of antennas but for a portion of the telescope's bandwidth (the so-called "FX" structure). In our design, the correlations are performed in an array of 4096 complex multiply-accumulate (CMAC) units. This is sufficient to perform all correlations in parallel for 64 signals (N=32 antennas with 2 opposite-polarization signals per antenna). When N is larger, the input data are buffered in an on-chipmemory and the CMACs are re-used as many times as needed to compute all correlations. The design has been synthesized and simulated so as to obtain accurate estimates of the IC's size and power consumption. It isintended for fabrication in a 32 nm silicon-on-insulator process, where it will require less than 12mm2 of silicon area and achieve an energy efficiency of 1.76 to 3.3 pJ per CMAC operation, depending on the number of antennas. Operation has been analyzed in detail up to N = 4096. The system-level energy efficiency, including board-levelI/O, power supplies, and controls, is expected to be 5 to 7 pJ per CMAC operation. Existing correlators for the JVLA (N = 32) and ALMA (N = 64) telescopes achieve about 5000 pJ and 1000 pJ respectively usingapplication-specific ICs in older technologies. To our knowledge, the largest-N existing correlator is LEDA atN = 256; it uses GPUs built in 28 nm technology and achieves about 1000 pJ. Correlators being designed for the SKA telescopes (N = 128 and N = 512) using FPGAs in 16nm technology are predicted to achieve about 100 pJ.

ASIC↗

Yearlong 500 °C Operational Demonstration of Up-Scaled 4H-SiC JFET Integrated Circuits

This work describes recent progress in the design, processing, upscaling, and testing of 500°C durable two-level interconnect 4H-SiC JFET IC technology undergoing development at NASA Glenn Research Center. For the first time, stable electrical operation of semiconductor ICs for 1 year (8760 hours) at 500°C in air atmosphere is reported. These groundbreaking durability results were attained on two-level interconnect JFET demonstration ICs with 175 or more transistors on each chip. This corresponds to a more than 7-fold increase in 500°C-durable circuit complexity from the 24 transistor ring oscillator ICs reported at HiTEC 2016.

Neudeck, Philip G.↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Critical Current Stability of 2G REBCO Tape for Space-Flight HTS Leads

High reliability is an essential requirement for all spaceflight hardware. XRISM, a follow-on mission to the Hitomi x-ray observatory, also uses 2G REBCO tapes as current leads for the superconducting magnets that are a key component of the Adiabatic Demagnetization Refrigerator (ADR) that cools the detector array. While the Hitomi Soft X-ray Spectrometer (SXS) worked flawlessly in orbit, during its development there were indications that the critical current of its specialized REBCO tapes could degrade over time when exposed to normal-humidity air. To demonstrate that the updates to the XRISM HTS lead assemblies had mitigated this risk, a series of tests were carried out to measure the stability of Ic of dozens of samples over a period greater than the flight assemblies were exposed to air during integration and test. The test rig allowed not only the measurement of the sample Ic, but also the localization of the voltage rise as the current approached Ic. We will discuss the trends in the critical current of the samples, as well as localization of lower Ic regions.

Edgar R. Canavan↗

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

This work updates recent progress made by NASA Glenn Research Center on further advancement of its uniquely durable silicon carbide junction field effect transistor and resistor (SiC JFET-R) integrated circuit (IC) technology since HiTEC 2021. Key fabrication process improvements compared to earlier NASA Glenn IC prototype runs have been ascertained via extensive “back end of line” (BEOL) processing experiments conducted on practice wafers over the past two years. The resulting changes to the BEOL process flow employed in the fabrication of “Generation 12” SiC JFET-R wafers are described. The NASA Glenn SiC JFET-R IC prototype “Generation 12” chipset design realizes significantly higher complexity digital and analog integrated ICs aimed at flexibly implementing a broad variety of mission-enabling extreme-environment electronics demonstrations. SPICE simulations have verified circuit designs ranging from simple amplification of analog sensor signals up through long-duration Venus lander operations and microprocessor-based of electric motor drive.

Silicon Carbide↗

Design and Simulation of Greatly Improved Future Generation 4H-SiC JFET-R Integrated Circuits for Prolonged 500 °C Operation

This work compares design layouts and circuit simulations of the next two prototype NASA Glenn SiC JFET-R IC fabrication runs designated “IC Gen. 12” and “IC Gen. 13”. Even though both generations employ the same physical JFET gate length and chip size, SPICE simulations predict drastic improvements to IC capabilities and performance metrics for Gen. 13 over Gen. 12. The main factors behind simulated performance differences are thinner n-channel layer leading to reduced operating voltages and switch to stepper-based photolithography that enables roughly 4-fold layout area reductions for functionally identical circuit blocks.

Silicon Carbide↗