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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Coefficient of thermal expansion of laminated graphite/epoxy composite panels altered after panels cured by postcuring heat treatment. Postcure decreases coefficient of thermal expansion by increasing crosslinking between molecules. Treatment makes it possible to reprocess costly panels for requisite thermal expansivity instead of discarding them.
The surface of a moderate band gap semiconductor such as p-type molybdenum sulfide is modified to contain an adherent film of charge mediating ionene polymer containing an electroactive unit such as bipyridimium. Electron transport between the electrode and the mediator film is favorable and photocorrosion and recombination processes are suppressed. Incorporation of particles of catalyst such as platinum within the film provides a reduction in overvoltage. The polymer film is readily deposited on the electrode surface and can be rendered stable by ionic or addition crosslinking. Catalyst can be predispersed in the polymer film or a salt can be impregnated into the film and reduced therein.
As part of an effort on tougher/solvent resistant matrix resins for composites, research was directed towards exploring methods to improve the solvent resistance of linear amorphous thermoplastics. Ethyl reactive groups were placed on the ends of oligomers and pendent along the polymer chain and subsequently thermally reacted to provide crosslinking and thus improvement in solvent resistance. This concept is extended to another thermoplastic, a phenoxy resin. A commercially available phenoxy resin (PKHH) was systematically modified by reaction of the pendent hydroxyl groups on the phenoxy resin with various amounts of 4-ethynylbenzoyl chloride. As the pendent ethynyl group content in the phenoxy resin increased, the cured resin exhibited a higher glass transition temperature, better solvent resistance and less flexibility. The solvent resistance was further improved by correcting a low molecular weight diethynyl compound, 2,2-bis(4-ethynylbenzoyloxy-4'-phenyl)propane, with a phenoxy resin containing pendent ethynyl groups.
Tracking and data acquisition system (TDAS) requirements, TDAS architectural goals, enhanced TDAS subsystems, constellation and networking options, TDAS spacecraft options, crosslink implementation, baseline TDAS space segment architecture, and treat model development/security analysis are addressed.
Current planning calls for the TDAS to support new user and crosslink services, in addition to TDRSS-compatible services. TDRSS-compatible services would operate in current S-band and K-band channels used by TDRSS. New services, however, can take advantage of technology advances at microwave and optical frequencies. For augmented space-to-space services, 60 GHz and GaAs laser systems offer technical advantages, relative freedom from RFI, and a benign regulatory environment (i.e., minimal congestion and, in the case of 60 GHz, maximum regulatory support for TDAS-type services). For TDAS Earth-to-space and space-to-Earth services, the 30/20 GHz band offers the best mix of technical and regulatory advantages. But use of these bands would have to be coordinated with the U.S. military.
The results of efforts to produce a nonsilver metallization system for silicon photovoltaic cells are given. The system uses a metallization system based on molybdenum, tin, and titanium hydride. The initial work in this system was done using the MIDFILM process. The MIDFILM process attains a line resolution comparable to photoresist methods with a process related to screen printing. The surface to be processed is first coated with a thin layer of photopolymer material. Upon exposure to ultraviolet light through a suitable mask, the polymer in the non-pattern area crosslinks and becomes hard. The unexposed pattern areas remain tacky. The conductor material is then applied in the form of a dry mixture of metal which adheres to the tacky pattern area. The assemblage is then fired to ash the photopolymer and sinter the conductor powder.
A method for preparing water insoluble asymmetric membranes from water soluble polymers is discussed. The process involves casting a film of the polymer, partially drying it, and then contacting it with a concentrated solution of a transition metal salt. The transition metal ions render the polymer insoluable and are believed to form a complex with it. Optionally, the polymer is crosslinked with heat or radiation. The most preferred polymer is poly(vinyl alcohol). The most preferred complexing salt is copper sulfate. The process and the metal ion linked membranes are discussed. The membranes are reverse osmosis membranes.
Sub-Tg annealing has been found to affect the properties of graphite/epoxy composites. The network epoxy studied was based on the chemistry of tetraglycidyl 4,4'-diamino-diphenyl methane (TGDDM) crosslinked by 4,4'-diamino-diphenyl sulfone (DDS). Differential scanning calorimetry, thermal mechanical analysis, and solid-state cross-polarized magic-angle-spinning nuclear magnetic resonance spectroscopy have been utilized in order to characterize this process of recovery towards thermodynamic equilibrium. The volume and enthalpy recovery as well as the 'thermoreversibility' aspects of the physical aging are discussed. This nonequilibrium and time-dependent behavior of network epoxies are considered in view of the increasingly wide applications of TGDDM-DDS epoxies as matrix materials of structural composites in the aerospace industry.
In order to improve solvent resistance of aromatic thermoplastic polymers, ethynyl-terminated aromatic sulfone polymers (ETS), sulfone/ester polymers (SEPE) containing pendent ethynyl groups, and phenoxy resin containing pendent ethynyl groups are synthesized. Cured polysulfones and phenoxy resins containing ethynyl groups on the ends or pendent on the molecules exhibited systematic behavior in solvent resistance, film flexibility, and toughness as a function of crosslink density. The film and composite properties of a cured solvent-resistant ETS were better than those of a commercially available solvent sensitive polysulfone. The study was part of a NASA program to better understand the trade-offs between solvent resistance, processability and mechanical properties which may be useful in designing composite structures for aerospace vehicles.
Addition polyimide oligomers have been synthesized from bis(gamma-aminopropyl) tetramethyldisiloxane and 3, 3', 4, 4'-benzophenonetetracarboxylic dianhydride using a variety of latent crosslinking groups as endcappers. The prepolymers were isolated and characterized for solubility (in amide, chlorinated and ether solvents), melt flow and cure properties. The most promising systems, maleimide and acetylene terminated prepolymers, were selected for detailed study. Graphite cloth reinforced composites were prepared and properties compared with those of graphite/Kerimid 601, a commercially available bismaleimide. Mixtures of the maleimide terminated system with Kerimid 601, in varying proportions, were also studied.
Epoxy with increased resistance to fire made by reacting any of three commercial epoxide monomers with curing agent consisting of mixture of isomers called "DCEPD". Curing agent incorporates phosphorus and chlorine directly into crosslinking part of polymer. DCEPD produced by nitrating precursor phosphonylmethyl benzene, then reducing resulting isomeric mixture of dinitro compounds.
A procedure to effectively screen and evaluate resins for aerospace structures and advanced composites is described. The following conclusions were advanced: (1) laminate damage tolerance correlates positively with neat resin G sub IC; (2) TGDDM/DDS resins can be toughened; (3) using butadiene-nitrile rubbers, neat resin G sub IC and ultimate strain increase with increasing nitrile content, with the number of chemically reactive groups per molecule, and with increasing molecular weight; (4) better balance of properties combined with high G sub IC may be achieved by using tough glassy thermoplastics instead of rubbers to modify TGDDM/DDS resins; (5) both toughening mechanisms require good phase separation with an effective interphase; (6) the kind and the amount of thermoplastic modifier remain to be selected; and (7) presently only about a fourfold increase in G sub IC was achieved, whereas a forty fold increase is sought; modification of the matrix backbone and of crosslinking is required.
A composition and method are disclosed for increasing the use temperature of polyamides based on the incorporation of a latent crosslinking agent into the polymer backbone, wherein high temperature performance is achieved without sacrificing solubility or processability.
Phenoxy resins containing pendent ethynyl groups, the process for preparing the same, and the cured resin products obtained therefrom are disclosed. Upon the application of heat, the ethynyl groups react to provide branching and crosslinking with the cure temperature being lowered by using a catalyst if desired but not required. The cured phenoxy resins containing pendent ethynyl groups have improved solvent resistance and higher use temperature than linear uncrosslinked phenoxy resins and are applicable for use as coatings, films, adhesives, composited matrices and molding compounds.
A nonporous membrane based on the polymerization of 2,3-dihydrofuran followed by crosslinking in situ was prepared. The material is compatible with rechargeable Li battery components and, when swollen with an appropriate solvent such as tetrahydrofuran, exhibits separator resistance and Li transport equivalent to Celgard.
In recent years the sensibility of CR-39 to nuclear tracks has been increased by doping the corresponding monomer with dioctyl phtalate. At this regard, two theoretical approaches are current managed to explain this phenomenon: either the doping react with the active radicals in the chain blocking them, stopping crosslinking between chains, or alternatively that the doping gets between them giving wider space between the crosslinkined chains.
An experiment, using 100-keV electrons and 10 to the 9th -rad doses, was conducted on Ultem polyetherimide film. Mechanical, electron paramagnetic resonance, and infrared spectroscopic data suggested that the radiation produced crosslinking and embrittlement of the material.
The effect on selected polyimide properties when pendant alkyl groups were attached to the polymer backbone was investigated. A series of polymers were prepared using benzophenone tetracarboxylic acid dianhydride (BTDA) and seven different p-alkyl-m,p'-diaminobenzophenone monomers. The alkyl groups varied in length from C(1) (methyl) to C(9) (nonyl). The polyimide prepared from BTDA and m,p'-diaminobenzophenone was included as a control. All polymers were characterized by various chromatographic, spectroscopic, thermal, and mechanical techniques. Increasing the length of the pendant alkyl group resulted in a systematic decrease in glass transition temperature (Tg) for vacuum cured films. A 70 C decrease in Tg to 193 C was observed for the nonyl polymer compared to the Tg for the control. A corresponding systematic increase in Tg indicative of crosslinking, was observed for air cured films. Thermogravimetric analysis revealed a slight sacrifice in thermal stability with increasing alkyl length. No improvement in film toughness was observed.