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At least 739 records · Page 41

Quantifying the Effect of Cosmic Ray Showers on the X-IFU Energy Resolution

The X-ray Integral Field Unit (X-IFU) will operate an array of more than 3000 Transition Edge Sensor pixels at 90 mK with an unprecedented energy resolution of 2.5 eV at 7 keV. In space, primary cosmic rays and secondary particles produced in the instrument structure will continuously deposit energy on the detector wafer and induce fluctuations on the pixels’ thermal bath. We have investigated through simulations of the X-IFU readout chain how these fluctuations eventually influence the energy measurement of X-ray photons. Realistic timelines of thermal bath fluctuations at different positions in the array are generated as a function of a thermal model and the expected distribution of the deposited energy of the charged particles. These are then used to model the TES response to these thermal perturbations and their influence on the onboard energy reconstruction process. Overall, we show that with adequate heatsinking, the main energy resolution degradation effect remains minimal and within the associated resolution allocation of 0.2 eV. We further study how a dedicated triggering algorithm could be put in place to flag the rarer large thermal events.

P. Peille↗

5,120 Superconducting Bolometers for the PIPER Balloon-Borne CMB Polarization Experiment

We are constructing the Primordial Inflation Polarization Explorer (PIPER) to measure the polarization of the cosmic microwave background (CMB) and search for the imprint of gravity waves produced during an inflationary epoch in the early universe. The signal is faint and lies behind confusing foregrounds, both astrophysical and cosmological, and so many detectors are required to complete the measurement in a limited time. We will use four of our matured 1,280 pixel, high-filling-factor backshort-under-grid bolometer arrays for efficient operation at the PIPER CMB wavelengths. All four arrays observe at a common wavelength set by passband filters in the optical path. PIPER will fly four times to observe at wavelengths of 1500, 1100, 850, and 500 microns in order to separate CMB from foreground emission. The arrays employ leg-isolated superconducting transition edge sensor bolometers operated at 145 mK; tuned resonant backshorts for efficient optical coupling; and a second-generation superconducting quantum interference device multiplexer readout. We describe the design, development, and performance of PIPER bolometer array technology to achieve background-limited sensitivity for a cryogenic balloon-borne telescope.

Benford, Dominic J.↗

Shear Stress Sensing using Elastomer Micropillar Arrays

The measurement of shear stress developed as a fluid moves around a solid body is difficult to measure. Stresses at the fluid-solid interface are very small and the nature of the fluid flow is easily disturbed by introducing sensor components to the interface. To address these challenges, an array of direct and indirect techniques have been investigated with various advantages and challenges. Hot wire sensors and other indirect sensors all protrude significantly into the fluid flow. Microelectromechanical systems (MEMS) devices, although facilitating very accurate measurements, are not durable, are prone to contamination, and are difficult to implement into existing model geometries. One promising approach is the use of engineered surfaces that interact with fluid flow in a detectable manner. To this end, standard lithographic techniques have been utilized to generate elastomeric micropillar arrays of various lengths and diameters. Micropillars of controlled length and width were generated in polydimethylsiloxane (PDMS) elastomer using a soft-lithography technique. The 3D mold for micropillar replication was fabricated using laser ablative micromachining and contact lithography. Micropillar dimensions and mechanical properties were characterized and compared to shear sensing requirements. The results of this characterization as well as shear stress detection techniques will be discussed.

Wohl, Christopher J.↗

Carrier Plus: A sensor payload for Living With a Star Space Environment Testbed (LWS/SET)

The Defense Threat Reduction Agency (DTR4) and National Aeronautics and Space Administration (NASA) Goddard Space Flight Center are collaborating to develop the Carrier Plus sensor experiment platform as a capability of the Space Environments Testbed (SET). The Space Environment Testbed (SET) provides flight opportunities for technology experiments as part of NASA's Living With a Star (LWS) program. The Carrier Plus will provide new capability to characterize sensor technologies such as state-of-the-art visible focal plane arrays (FPAs) in a natural space radiation environment. The technical objectives include on-orbit validation of recently developed FPA technologies and performance prediction methodologies, as well as characterization of the FPA radiation response to total ionizing dose damage, displacement damage and transients. It is expected that the sensor experiment will carry 4-6 FPAs and associated radiation correlative environment monitors (CEMs) for a 2006-2007 launch. Sensor technology candidates may include n- and p-charge coupled devices (CCDs), active pixel sensors (APS), and hybrid CMOS arrays. The presentation will describe the Carrier Plus goals and objectives, as well as provide details about the architecture and design. More information on the LWS program can be found at http://lws.gsfc.nasa.gov/. Business announcements for LWS/SET and program briefings are posted at http://lws-set.gsfc.nasa.gov

Marshall, Cheryl J.↗

5,120 Superconducting Bolometers for the PIPER Balloon-Borne CMB Polarization Experiment

We are constructing the Primordial Inflation Polarization Explorer (PIPER) to measure the polarization o[ the cosmic microwave background (CMB) and search for the imprint of gravity waves produced during an inflationary epoch in the early universe. The signal is faint and lies behind confusing foregrounds, both astrophysical and cosmological, and so many detectors are required to complete the measurement in a limited time. We will use four of our matured 1,280 pixel, high-filling-factor backshort-under-grid bolometer arrays for efficient operation at the PIPER CMB wavelengths. All four arrays observe at a common wavelength set by passband filters in the optical path. PIPER will fly four times to observe at wavelengths of 1500, 1100, 850, and 500 microns in order to separate CMB from foreground emission. The arrays employ leg-isolated superconducting transition edge sensor bolometers operated at 128mK; tuned resonant backshorts for efficient optical coupling; and a second-generation superconducting quantum interference device (SQUID) multiplexer readout. We describe the design, development, and performance of PIPER bo|ometer array technology to achieve background-limited sensitivity for a cryogenic balloon-borne telescope.

Benford, Dominic J.↗

Solid state imagers and their applications; Proceedings of the Meeting, Cannes, France, November 26, 27, 1985

Topics treated include the use of semiconductor imagers in high energy particle physics, an X-ray image sensor based on an optical TDI-CCD imager, and an electron-sensitive CCD readout array for a circular-scan streak tube. Papers are presented on the pan-imager, high resolution linear arrays, the reduction of reflection losses in solid-state image sensors, a high resolution CCD imager module with swing operation, large area CCD image sensors for scientific applications, and new readout techniques for frame transfer CCDs. Consideration is given to advanced optoelectronical sensors for autonomous rendezvous/docking and proximity operations in space, the testing and characterization of CCDs for the Rosat star sensors, an advanced radial camera for the Hubble Space Telescope, and scanning or staring infrared imagers.

Declerck, Gilbert J.↗

Survey of Experimental Results From One Year of PASP PLUS Orbital Operation

With PASP Plus as its primary payload, the APEX satellite was launched by a standard Pegasus rocket released from a NASA B-52 aircraft on 3 August 1994. A 70 deg inclination, 363 km X 2550 km orbit was achieved, allowing both investigation of space plasma effects on high-voltage operation in the perigee region and investigation of space radiation effects on array power output from passage through the inner radiation belt in the apogee region. Data gathering by PASP Plus was begun on 7 Aug 94 and ended on 11 Aug 95. In one year, PASP Plus collected an order of magnitude more data on environmental interactions on solar arrays than all previous space-borne photovoltaic experiments combined. The test arrays flown and the interactions-measuring and space-environment sensors of PASP Plus are described. The results of measurements of leakage current under test-array positive biasing and arc rates under negative biasing as a function of bias voltage, plasma density, array orientation, and other conditions are presented. The results of measurements of test-array power-output degradation caused by space radiation are also examined.

PHOTOVOLTAIC EFFECT↗

Development of a Self-calibrating Dissolved Oxygen Microsensor Array for the Monitoring and Control of Plant Growth in a Space Environment

Plant experiments in space will require active nutrient delivery concepts in which water and nutrients are replenished on a continuous basis for long-term growth. The goal of this study is to develop a novel microsensor array to provide information on the dissolved oxygen environment in the plant root zone for the optimum control of plant cultivation systems in the space environment. Control of water and oxygen is limited by the current state-of-the-art in sensor technology. Two capabilities of the new microsensor array were tested. First, a novel in situ self-diagnosis/self-calibration capability for the microsensor was explored by dynamically controlling the oxygen microenvironment in close proximity to an amperometric dissolved oxygen microsensors. A pair of integrated electrochemical actuator electrodes provided the microenvironments based on water electrolysis. Miniaturized thin film dissolved oxygen microsensors on a flexible polyimide (Kapton(Registered Trademark)? substrate were fabricated and their performances were tested. Secondly, measurements of dissolved oxygen in two representative plant growth systems were made, which had not been performed previously due to lack of proper sensing technology. The responses of the oxygen microsensor array on a flexible polymer substrate properly reflected the oxygen contents on the surface of a porous tube nutrient delivery system and within a particulate substrate system. Additionally, we demonstrated the feasibility of using a 4-point thin film microprobe for water contents measurements for both plant growth systems. mechanical flexibility, and self-diagnosis. The proposed technology is anticipated to provide a reliable sensor feedback plant growth nutrient delivery systems in both terrestrial environment and the microgravity environment during long term space missions. The unique features of the sensor include small size and volume, multiple-point sensing,

Kim, Chang-Soo↗

Flexible Microsensor Array for the Monitoring and Control of Plant Growth System

Testing for plant experiments in space has begun to explore active nutrient delivery concepts in which water and nutrients are replenished on a continuous basis for long-term growth. The goal of this study is to develop a novel microsensor array to provide information on the dissolved oxygen environment in the plant root zone for the optimum control of hydroponics and solid substrate plant cultivation systems in the space environment. Miniaturized polarographic dissolved oxygen sensors have been designed and fabricated on a flexible Kapton (trademark) (polyimide) substrate. Two capabilities of the new microsensor array were explored. First, measurements of dissolved oxygen in the plant root zone in hydroponics and solid substrate culture systems were made. The microsensor array was fabricated on a flexible substrate, and then cut out into a mesh type to make a suspended array that could be placed either in a hydroponics system or in a solid substrate cultivation system to measure the oxygen environments. Second, the in situ self-diagnostic and self-calibration capability (two-point for oxygen) was adopted by dynamically controlling the microenvironment in close proximity to the microsensors. With a built-in generating electrode that surrounds the microsensor, two kinds of microenvironments (oxygen-saturated and oxygen-depleted phases) could be established by water electrolysis depending on the polarity of the generating electrode. The unique features of the new microsensor array (small size, multiple sensors, flexibility and self-diagnosis) can have exceptional benefits for the study and optimization of plant cultivation systems in both terrestrial and microgravity environments. The in situ self-diagnostic and self-calibration features of the microsensor array will also enable continuous verification of the operability during entire plant growth cycles. This concept of automated control of a novel chemical monitoring system will minimize crew time required for maintenance, as well as reduce volume, mass, and power consumption by eliminating bulky diagnosis systems including calibrant (fluid and gas) reservoir and flow system hardware.

Kim, Chang-Soo↗

Heat Sinking, Cross Talk, and Temperature Stability for Large, Close-Packed Arrays of Microcalorimeters

We are developing large, close-packed arrays of x-ray transition-edge sensor (TES) microcalorimeters. In such a device, sufficient heat sinking is important to to minimize thermal cross talk between pixels and to stabilize the bath temperature for all pixels. We have measured cross talk on out 8 x 8 arrays and studied the shape and amount of thermal crosstalk as a function of pixel location and efficiency of electrothermal feedback. In this presentation, we will compare measurements made on arrays with and without a backside, heat-sinking copper layer, as well as results of devices on silicon-nitride membranes and on solid substrates, and we will discuss the implications for energy resolution and maximum count rate. We will also discuss the dependence of pulse height upon bath temperature, and the measured and required stability of the bath temperature.

Imoto, Naoko↗

The Design of Optical Sensor for the Pinhole/Occulter Facility

Three optical sight sensor systems were designed, built and tested. Two optical lines of sight sensor system are capable of measuring the absolute pointing angle to the sun. The system is for use with the Pinhole/Occulter Facility (P/OF), a solar hard x ray experiment to be flown from Space Shuttle or Space Station. The sensor consists of a pinhole camera with two pairs of perpendicularly mounted linear photodiode arrays to detect the intensity distribution of the solar image produced by the pinhole, track and hold circuitry for data reduction, an analog to digital converter, and a microcomputer. The deflection of the image center is calculated from these data using an approximation for the solar image. A second system consists of a pinhole camera with a pair of perpendicularly mounted linear photodiode arrays, amplification circuitry, threshold detection circuitry, and a microcomputer board. The deflection of the image is calculated by knowing the position of each pixel of the photodiode array and merely counting the pixel numbers until threshold is surpassed. A third optical sensor system is capable of measuring the internal vibration of the P/OF between the mask and base. The system consists of a white light source, a mirror and a pair of perpendicularly mounted linear photodiode arrays to detect the intensity distribution of the solar image produced by the mirror, amplification circuitry, threshold detection circuitry, and a microcomputer board. The deflection of the image and hence the vibration of the structure is calculated by knowing the position of each pixel of the photodiode array and merely counting the pixel numbers until threshold is surpassed.

Greene, Michael E.↗

Friction Stir Weld Inspection Through Conductivity Imaging Using Shaped Field MWM(TM)-Arrays

Friction Stir Welds (FSW) of A1 2195-T8 and A1 2219-T8, provided by Lockheed Martin Michoud Operations, were inspected for lack-of-penetration (LOP) defects using a custom designed MWM-Array, a multi-element eddy-current sensor. MWM electrical conductivity mapping demonstrated high sensitivity to LOP as small as 0.75 mm (0.03 in.), as confirmed by metallographic data that characterized the extent of LOP defects. High sensitivity and high spatial resolution was achieved via a 37-element custom designed MWM-Array allowing LOP detection using the normalized longitudinal component of the MWM measured conductivity. This permitted both LOP detection and correlation of MWM conductivity features with the LOP defect size, as changes in conductivity were apparently associated with metallurgical features within the near-surface layer of the LOP defect zone. MWM conductivity mapping reveals information similar to macroetching as the MWM-Array is sensitive to small changes in conductivity due to changes in microstructure associated with material thermal processing, in this case welding. The electrical conductivity measured on the root side of FSWs varies across the weld due to microstructural differences introduced by the FSW process, as well as those caused by planar flaws. Weld metal, i.e., dynamically recrystallized zone (DXZ), thermomechanically affected zone (TMZ), heat-affected zone (HAZ), and parent metal (PM) are all evident in the conductivity maps. While prior efforts had met with limited success for NDE of dissimilar alloy, A12219 to A12195 FSW, the new custom designed multi-element MWM-Array achieved detection of all LOP defects even in dissimilar metal welds.

Goldfine, Neil↗

The NASA MLA program

The NASA Multispectral Linear Array (MLA) program is structured to provide for the evolutionary development of advanced sensor concepts, technologies, and scientific basis for future remote sensing missions. Program elements include the development of multispectral visible and shortwave infrared (SWIR) detector arrays, optics and on-board signal processing technologies, sensor design studies, and supporting research. The research consists of advanced airborne sensor development with data acquisitions, field measurements, and supporting science studies. At the present time, two instrument concepts, including an imaging spectrometer, are in development as payloads for a series of Shuttle remote sensing research flights beginning as early as 1987. Progressively more advanced capability instruments suitable for extended duration Shuttle, free flyer, and space platform missions in the 1990's are also being studied.

Ando, K. J.↗

Friction Stir Weld Inspection Through Conductivity Imaging Using Shaped Field MWM(Registered Trademark) - Arrays

Friction Stir Welds (FSW) of Al 2195-T8 and Al 2219-T8, provided by Lockheed Martin Michoud Operations, were inspected for lack-of-penetration (LOP) defects using a custom designed MWM-Array, a multi-element eddy-current sensor. MWM (registered trademark) electrical conductivity mapping demonstrated high sensitivity to LOP as small as 0.75 mm (0.03 in.), as confirmed by metallographic data that characterized the extent of LOP defects. High sensitivity and high spatial resolution was achieved via a 37-element custom designed MWM-Array allowing LOP detection using the normalized longitudinal component of the MWM measured conductivity. This permitted both LOP detection and correlation of MWM conductivity features with the LOP defect size, as changes in conductivity were apparently associated with metallurgical features within the near-surface layer of the LOP defect zone. MWM conductivity mapping reveals information similar to macro-etching as the MWM-Array is sensitive to small changes in conductivity due to changes in microstructure associated with material thermal processing, in this case welding. The electrical conductivity measured on the root side of FSWs varies across the weld due to microstructural differences introduced by the FSW process, as well as those caused by planar flaws. Weld metal, i.e., dynamically recrystallized zone (DXZ), thermomechanically affected zone (TMZ), heat-affected zone (HAZ), and parent metal (PM) are all evident in the conductivity maps. While prior efforts had met with limited success for NDE (Nondestructive Evaluation) of dissimilar alloy, Al2219 to Al2195 FSW, the new custom designed multi-element MWM-Array achieved detection of all LOP defects even in dissimilar metal welds.

Goldfine, Neil↗

Nanoscale Surface Plasmonics Sensor With Nanofluidic Control

Conventional quantitative protein assays of bodily fluids typically involve multiple steps to obtain desired measurements. Such methods are not well suited for fast and accurate assay measurements in austere environments such as spaceflight and in the aftermath of disasters. Consequently, there is a need for a protein assay technology capable of routinely monitoring proteins in austere environments. For example, there is an immediate need for a urine protein assay to assess astronaut renal health during spaceflight. The disclosed nanoscale surface plasmonics sensor provides a core detection method that can be integrated to a lab-on-chip device that satisfies the unmet need for such a protein assay technology. Assays based upon combinations of nanoholes, nanorings, and nanoslits with transmission surface plasmon resonance (SPR) are used for assays requiring extreme sensitivity, and are capable of detecting specific analytes at concentrations as low as picomole to femtomole level in well-controlled environments. The device operates in a transmission mode configuration in which light is directed at one planar surface of the array, which functions as an optical aperture. The incident light induces surface plasmon light transmission from the opposite surface of the array. The presence of a target analyte is detected by changes in the spectrum of light transmitted by the array when a target analyte induces a change in the refractive index of the fluid within the nanochannels. This occurs, for example, when a target analyte binds to a receptor fixed to the walls of the nanochannels in the array. Independent fluid handling capability for individual nanoarrays on a nanofluidic chip containing a plurality of nanochannel arrays allows each array to be used to sense a different target analyte and/or for paired arrays to analyze control and test samples simultaneously in parallel. The present invention incorporates transmission mode nanoplasmonics and nanofluidics into a single, microfluidically controlled device. The device comprises one or more arrays of aligned nanochannels that are in fluid communication with inflowing and outflowing fluid handling manifolds that control the flow of fluid through the arrays. The array acts as an aperture in a plasmonic sensor. Fluid, in the form of a liquid or a gas and comprising a sample for analysis, is moved from an inlet manifold through the nanochannel array, and out through an exit manifold. The fluid may also contain a reagent used to modify the interior surfaces of the nanochannels, and/or a reagent required for the detection of an analyte.

Wei, Jianjun↗

Modeling Charge Collection in Detector Arrays

A detector array charge collection model has been developed for use as an engineering tool to aid in the design of optical sensor missions for operation in the space radiation environment. This model is an enhancement of the prototype array charge collection model that was developed for the Next Generation Space Telescope (NGST) program. The primary enhancements were accounting for drift-assisted diffusion by Monte Carlo modeling techniques and implementing the modeling approaches in a windows-based code. The modeling is concerned with integrated charge collection within discrete pixels in the focal plane array (FPA), with high fidelity spatial resolution. It is applicable to all detector geometries including monolithc charge coupled devices (CCDs), Active Pixel Sensors (APS) and hybrid FPA geometries based on a detector array bump-bonded to a readout integrated circuit (ROIC).

Hardage, Donna↗

Extended-Range Passive RFID and Sensor Tags

Extended-range passive radio-frequency identification (RFID) tags and related sensor tags are undergoing development. A tag of this type incorporates a retroreflective antenna array, so that it reflects significantly more signal power back toward an interrogating radio transceiver than does a comparable passive RFID tag of prior design, which does not incorporate a retroreflective antenna array. Therefore, for a given amount of power radiated by the transmitter in the interrogating transceiver, a tag of this type can be interrogated at a distance greater than that of the comparable passive RFID or sensor tag of prior design. The retroreflective antenna array is, more specifically, a Van Atta array, named after its inventor and first published in a patent issued in 1959. In its simplest form, a Van Atta array comprises two antenna elements connected by a transmission line so that the signal received by each antenna element is reradiated by the other antenna element (see Figure 1). The phase relationships among the received and reradiated signals are such as to produce constructive interference of the reradiated signals; that is, to concentrate the reradiated signal power in a direction back toward the source. Hence, an RFID tag equipped with a Van Atta antenna array automatically tracks the interrogating transceiver. The effective gain of a Van Atta array is the same as that of a traditional phased antenna array having the same number of antenna elements. Additional pairs of antenna elements connected by equal-length transmission lines can be incorporated into a Van Atta array to increase its directionality. Like some RFID tags here-to-fore commercially available, an RFID or sensor tag of the present developmental type includes one-port surface-acoustic-wave (SAW) devices. In simplified terms, the mode of operation of a basic one-port SAW device as used heretofore in an RFID device is the following: An interrogating radio signal is converted, at an input end, from an electrical signal to an acoustic wave that propagates along a surface and encounters multiple reflectors suitably positioned along the surface. Upon returning to the input end, the reflected acoustic wave is re-converted to an electrical signal, which, in turn, is reradiated from an antenna. The distances between the reflectors in the SAW device and the corresponding times between reflections encode the identifying or sensory information onto the reradiated signal. The fundamental problem in the present development is how to combine a Van Atta antenna array (which is inherently a multiple-port device) and one or more one-port SAW device(s) into a single, compact, passive unit that can function as a retroreflective RFID tag. The solution is to use one or more hybrid, half-power 90 couplers. A basic unit of this type, shown in Figure 2, includes a half-power 90 hybrid coupler; two identical SAW devices (SAW1 and SAW2) connected to ports 3 and 4 of the coupler, respectively; and antenna elements connected to ports 1 and 2 of the coupler. Necessarily omitting details for the sake of brevity, it must suffice to report that the phase relationships among the coupler inputs and outputs are such as to couple the incident signal from the antenna elements to the SAW devices and couple the reflected signals from the SAW devices back to the antenna elements in the phase relationships required for a Van Atta array. Hence, the reradiated signal is automatically directed back toward the interrogating transceiver and contains identifying and/or sensory information encoded in time intervals between reflections.

Fink, Patrick W.↗

Infrared-Bolometer Arrays with Reflective Backshorts

Integrated circuits that incorporate square arrays of superconducting-transition- edge bolometers with optically reflective backshorts are being developed for use in image sensors in the spectral range from far infrared to millimeter wavelengths. To maximize the optical efficiency (and, thus, sensitivity) of such a sensor at a specific wavelength, resonant optical structures are created by placing the backshorts at a quarter wavelength behind the bolometer plane. The bolometer and backshort arrays are fabricated separately, then integrated to form a single unit denoted a backshort-under-grid (BUG) bolometer array. In a subsequent fabrication step, the BUG bolometer array is connected, by use of single-sided indium bump bonding, to a readout device that comprises mostly a superconducting quantum interference device (SQUID) multiplexer circuit. The resulting sensor unit comprising the BUG bolometer array and the readout device is operated at a temperature below 1 K. The concept of increasing optical efficiency by use of backshorts at a quarter wavelength behind the bolometers is not new. Instead, the novelty of the present development lies mainly in several features of the design of the BUG bolometer array and the fabrication sequence used to implement the design. Prior to joining with the backshort array, the bolometer array comprises, more specifically, a square grid of free-standing molybdenum/gold superconducting-transition-edge bolometer elements on a 1.4- m-thick top layer of silicon that is part of a silicon support frame made from a silicon-on-insulator wafer. The backshort array is fabricated separately as a frame structure that includes support beams and contains a correspond - ing grid of optically reflective patches on a single-crystal silicon substrate. The process used to fabricate the bolometer array includes standard patterning and etching steps that result in the formation of deep notches in the silicon support frame. These notches are designed to interlock with the support beams on the backshort-array structure to provide structural support and precise relative positioning. The backshort-array structure is inserted in the silicon support frame behind the bolometer array, and the notches in the frame serve to receive the support beams of the backshort-array structure and thus determine the distance between the backshort and bolometer planes. The depth of the notches and, thus, the distance between the backshort and bolometer planes, can be tailored to a value between 25 to 300 m adjusting only a few process steps. The backshort array is designed so as not to interfere with the placement of indium bumps for subsequent indium bump-bonding to the multiplexing readout circuitry

Miller, Timothy M.↗