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At least 739 records · Page 41

Rigid open-cell polyurethane foam for cryogenic insulation

Lightweight polyurethane foam assembled in panels is effective spacer material for construction of self-evacuating multilayer insulation panels for cryogenic liquid tanks. Spacer material separates radiation shields with barrier that minimizes conductive and convective heat transfer between shields.

Faddoul, J. R.↗

Ceramic wiring board increases packaging density of electronic modules

Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.

Hamley, L. D.↗

Thermal scale modeling

Complex system study data indicate that factors associated with multilayer insulation pose major problem in scale modeling, that numerical analysis aids correction for known compromises of scaling criteria, and that probable errors in scale modeling experiments fall within range predicted by statistical analysis.

Mac Gregor, R. K.↗

Cryogenic insulation system Patent

Prefabricated multilayered self-evacuating insulation panels using gas with low vapor pressure at cryogenic temperatures for application to storage of cryogens

Perkins, P. J., Jr.↗

Superior cryogenic insulation developed

Multilayer composite consisting of alternate spunbond nylon layers and doubly aluminized mylar layers is used primarily in cryogenic thermal protection systems.

Hale, D. V.↗

Insulating effectiveness of self-spacing dimpled foil

Experimental data are graphed for determining conductive heat losses of multilayer insulation as function of number of foil layers. Foil was 0.0051 cm thick Nb, 1% Zr refractory alloy, dimpled to 0.0254 cm with approximately 28 dimples/sq cm. Heat losses were determined at 0.1 microtorr between 700 and 1089 K.

Bond, J. A.↗

Unsupported thin film beam splitter

Multilayer beam splitter system yielding nearly equal broadband infrared reflectance and transmittance in the 5 to 50 micron spectral region has been developed which will significantly reduce size and cost of light path compensating devices in infrared spectral instruments.

Bastien, R. C.↗