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At least 739 records · Page 41

Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF{sub 4} for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

36 MATERIALS SCIENCE↗

Efficient Recovery of Copper and Cobalt from the Matte–Slag Mixture of ISA Furnace by Injection of Coke and Pyrite

During ISA copper smelting process, ISASMELT furnace discharges a large amount of matte and slag mixture and the separation of them has an important influence on the recovery of valuable metals. This paper presented a reduction-sulfurization sedimentation process for recovering copper and cobalt from the matte–slag mixture of ISA furnace. Firstly, matte–slag mixture and traditional static sedimentation slag are characterized to determine their mineral composition and occurrence state. It indicates that Cu is primarily lost in slag in the form of sulfide, while Co is mostly lost in the form of oxide. With coke and pyrite as the reducing agent and vulcanizing agent, an orthogonal laboratory experiment was conducted to determine the effects of the smelting temperature and additive dosage on the recovery process. The optimum slag cleaning conditions were found to be: a coke dosage of 2 pct, a pyrite dosage of 2 pct, and a smelting temperature of 1260 °C lasting for 2 hours. In order to improve on the low utilization ratio of additives associated with the industrial sedimentation process, an innovative additive introducing method was put forward which enables the additives to mix and react with slag more adequately. A powder injection device was purpose-made to inject additives into molten slag in dispersion state, and a laboratory experiment was carried out to simulate this process. By injecting 2 pct coke and 2 pct pyrite, the contents of Cu and Co in cleaned slag decreased to 0.46 and 0.01 pct, respectively. It proves that the injection of additives into molten slag is an effective method to recover Cu and Co from the matte–slag mixture of ISA furnace.

36 MATERIALS SCIENCE↗

Distributions of Ag, Bi, and Sb as Minor Elements between Iron-Silicate Slag and Copper in Equilibrium with Tridymite in the Cu-Fe-O-Si System at T = 1250 °C and 1300 °C (1523 K and 1573 K)

New experimental data on the distributions of silver (Ag), bismuth (Bi), and antimony (Sb) between liquid iron-silicate slag and liquid copper metal in equilibrium with tridymite in the Cu-Fe-O-Si system at T = 1250 °C and 1300 °C (1523 K and 1573 K) have been obtained. The experimental methodology involved high-temperature equilibration, rapid quenching of the equilibrated phases, followed by direct measurement of the equilibrium phases with electron probe X-ray microanalysis (EPMA) for measurement of major element concentrations and laser ablation inductively coupled plasma mass spectrometry (LAICPMS) for the measurement of minor element concentrations. The 4-point test approach was employed to confirm the achievement of chemical equilibrium in the current study. Open-system equilibration on quartz substrates in controlled gas atmospheres (CO/CO{sub 2}/Ar) and closed-system equilibration in sealed quartz ampoules were used. The new experimental data resolve significant discrepancies found in previous studies and can be used as input for the development of thermodynamic databases for copper-making processes.

36 MATERIALS SCIENCE↗

Distribution of Ni, Co, Precious, and Platinum Group Metals in Copper Making Process

The distribution coefficients of Ni, Co, Ag, Au, Pt, and Pd between molten copper and silica-saturated iron silicate slags (L{sub Me}{sup Cu/s}) were measured experimentally. The distribution behaviors were studied under typical conditions of copper converting and fire refining, i.e., from 1250 °C to 1350 °C, and from 10{sup −8} to 10{sup −4} atm oxygen partial pressure. The coefficients were determined as the ratios of the trace element weight concentrations measured in situ, directly from the equilibrated metal and slag phases. For the quantitative elemental analysis of the phases, state-of-the-art analytic techniques, including electron probe microanalysis and laser ablation-inductively coupled plasma-mass spectrometry, were employed. The distribution coefficients L{sub Me}{sup Cu/s} determined can be arranged in the following order: Pt > Au > Pd >> Ag > (Cu) > Ni > Co > (Fe).

36 MATERIALS SCIENCE↗

Ultrasound-Assisted Leaching and Kinetic Study of Blended Copper Slag

This article deals with the dissolution of blended copper slag (flash and converter furnace) in hydrogen peroxide and acetic acid in the presence of ultrasound. The parameters that are effective on leaching efficiency, such as leaching temperature, leaching time, ultrasound power, acetic acid concentration, and hydrogen peroxide concentration, were investigated. The optimum leaching conditions for maximum copper dissolution (93 pct) and minimum iron dissolution (3 pct) were determined as follows: 2 M H{sub 2}O{sub 2}, 4 M CH{sub 3}COOH, 10 pct of ultrasound power, 65 °C of leaching temperature, 60 minutes of leaching time, and 1:25 of solid–liquid ratio. According to the Brunauer–Emmett–Teller (BET) analysis results on the original sample and leaching residue, the ultrasound caused formation of microcracks on the particle surface; however, the BET surface area increased and the mean adsorption pore width decreased. The apparent activation energy was found to be 55.35 kJ/mol, and the kinetics equations of the processes were established.

36 MATERIALS SCIENCE↗

Behavior of Ga, In, Sn, and Te in Copper Matte Smelting

The distributions of Ga, In, Sn, and Te between copper-iron mattes and silica-saturated iron silicate slags over a wide range of matte grades 55 to 75 pct Cu were determined at 1300 °C using a gas-phase equilibration-quenching technique and direct phase composition analysis by Electron Probe X-ray Microanalysis and Laser Ablation-Inductively Coupled Plasma-Mass Spectrometry. Alumina from aluminum, a typical minor element of electric and electronic copper scrap, and lime were adopted as slag modifiers for increasing the trace element recoveries. Gallium and tin were distributed predominantly in the slag, indium preferred sulfide matte at low matte grades and slag at high, whereas tellurium strongly favored the sulfide matte in particular in high matte grades. The slag modifiers alumina and lime had a minor impact on the distribution coefficients of gallium and tin, but for indium and tellurium the distribution coefficients were more strongly affected by the basic oxides. The strong tendencies of tin and tellurium to vaporize at the experimental temperature were confirmed.

36 MATERIALS SCIENCE↗

Constitutive Behavior and Processing Map of T2 Pure Copper Deformed from 293 to 1073 K

The deformation behavior of T2 pure copper compressed from 293 to 1073 K with strain rates from 0.01 to 10 s{sup −1} was investigated. The constitutive equations were established by the Arrhenius constitutive model, which can be expressed as a piecewise function of temperature with two sections, in the ranges 293-723 K and 723-1073 K. The processing maps were established according to the dynamic material model for strains of 0.2, 0.4, 0.6, and 0.8, and the optimal processing parameters of T2 copper were determined accordingly. In order to obtain a better understanding of the deformation behavior, the microstructures of the compressed samples were studied by electron back-scattered diffraction. The grains tend to be more refined with decreases in temperature and increases in strain rate.

36 MATERIALS SCIENCE↗

Tensile Properties and Fracture Characteristics of Nanostructured Copper and Cu-SiC Nanocomposite Produced by Mechanical Milling and Spark Plasma Sintering Process

The presence of large grains within nanometric and ultrafine grain matrix is an effective method in order to enhance strength while keeping the high ductility of metals. For this purpose, in this research, spark plasma sintering (SPS) was used to consolidate milled Cu and Cu-SiC powders. In SPS process, local sparks with high temperature between particles take place and locally lead to intense grain growth, and therefore, this method has the ability to produce bimodal grain structures in copper and copper-based composites. Microstructural and mechanical studies showed ≈ 185 and ≈ 437 nm matrix grain sizes, high tensile yield strength values of ≈ 188.4 and ≈ 296.9 MPa, and fracture strain values of 15.1 and 6.7% for sintered Cu and Cu-4 vol.% SiC nanocomposite materials, respectively. The presence of nanoparticles promoted the occurrence of static recrystallization and decreased the fraction of coarse grains in microstructure. The high tensile properties of the produced materials are attributed to fine grain size, homogenous dispersion of nanoparticles and retarded grain boundary migration during sintering.

77 NANOSCIENCE AND NANOTECHNOLOGY↗

Microstructure Evolution and Microhardness Distribution of Copper Processed Using Multiple Passes of Elliptical Cross-Sectional Spiral Equal-Channel Extrusion

The aim of this work is to study the effect of six-pass elliptical cross-sectional spiral equal-channel extrusion (ECSEE) on the microstructure and performance of ultrafine-grained (UFG) copper. Equiaxed grains of average grain size of less than 1 μm are formed into shear bands in the low strain region of ECSEE deformed specimen. More homogeneous and equiaxed microstructure with high misorientation angles is obtained in the high strain. Moreover, the microstructure evolution of ECSEE-induced copper is a dynamic equilibrium process of shear deformation accompanying the interactions of high dislocation density, cellular structure and high-angle grain boundaries. The grain ECSEE refinement mechanism is described as the formation process of dislocations, cells, local grain sub-boundaries rotation and large angle grain restructure. The significantly non-uniform hardness distribution is consistent with the deformation behavior and microstructure refinement in the ECSEE-induced specimen. The homogeneity of microstructure and hardness improves as the ECSEE pass increases.

36 MATERIALS SCIENCE↗

Elastic Modulus Estimation for Copper Syntactic Foams Reinforced with Iron Hollow Spheres of Different Wall Thicknesses

The present study estimates the effect on Young’s modulus of the percentage and thickness of iron hollow spheres reinforcing copper syntactic foams. The resulting materials were modeled by inserting hollow spheres in a random arrangement, using a combination of Discrete Element Method (DEM) for generating the sphere location coordinates and Finite Element Analysis (FEA). Estimations for syntactic foams were compared to those obtained for conventional copper foams with the same porosity. Results showed that the elastic modulus of both syntactic and conventional foams drops significantly as the percentage of spheres or porosity increases. Furthermore, the increase in the wall thickness of the iron hollow spheres leads to significant rises in the Young’s modulus. Depending on the desired mechanical properties, the outcomes presented in this work could be used for selecting the kind of foam (syntactic or conventional) and predesign some characteristics such as porosity or thickness of the spheres or pores.

36 MATERIALS SCIENCE↗

In Situ Synthesis of 3D Interconnected Graphene-Reinforced Copper Composites

Graphene shows great potential in composite applications, but the performance of traditional graphene-metal composites is poorer than desired due to the uneven dispersion of graphene in the matrix. This study provides an effective method to grow high-quality graphene on the surface of 3D porous copper using a combination of chemical vapor deposition and spark plasma sintering to obtain a dense 3D-interconnected graphene/Cu composite. Transmission electron microscopy and scanning electron microscopy showed that graphene-coated copper and Raman analysis showed high-quality graphene. The tensile strength of the 3D graphene/Cu composite was 425 MPa, which is ~ 25% higher than that of pure Cu, and the coefficient of friction (0.33) is about 45% lower than that of pure Cu (0.58). The formation of high-quality 3D graphene interconnects in the Cu matrix results in a higher mechanical strength, better friction properties and superior electrical and thermal conductivity of the composite compared to those of pure Cu.

36 MATERIALS SCIENCE↗

Influence of Alternating Short-Cycle Bending on the Mechanical Properties of Copper, α-Titanium and the Mild Steel DC01

The influence of alternating bending loads as they occur during roller levelling on the mechanical properties of sheet metals is not yet fully understood. A detailed knowledge of the influence of the commonly used levelling process on the resulting properties of sheet material is needed in particular for the design of subsequent processes with narrow process windows. To investigate the mechanical property changes during loading conditions similar to roller levelling, sheet samples of mild steel DC01, α-titanium and pure copper (CU-DHP) were subjected to alternating bending loads with different amplitudes for up to 9.5 bending cycles. An isotropic hardening behavior according to a Voce description could be shown for the DC01 deep drawing steel with a strong dependence on the load amplitude applied per cycle. A strengthening behavior that depends on the loading amplitude could be observed for α-titanium as well. In contrast, pure copper featured minor changes with a tendency to soften. For all three materials, changes in springback were present after one bending cycle.

36 MATERIALS SCIENCE↗

Microstructure and mechanical properties of pure copper wire produced by shear assisted processing and extrusion

Shear assisted processing and extrusion (ShAPE) process can consolidate powdered materials and simultaneously extrude wire or tube with improved properties. We successfully produced copper wire extrusions from powder and solid materials for the first time. The extrusion pressure of ShAPE process is at least two times less than that required for conventional extrusion. We used optical microscopy to inspect and validate the integrity of extrudates. It shows that the microstructure was refined and dynamically recrystallized to equiaxial grains. Compared to the annealed copper wire, ShAPE processed wire has 80% higher yield strength, 15% higher ultimate tensile strength and 20% higher ductility. These were correlated with refined grain size and sub-structuring observed via electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM).

Copper, Wire, Shear Assisted Processing and Extrus↗

Microstructure effects on high velocity microparticle impacts of copper

Constitutive models can fail to predict high-rate deformation behavior due to their inability to account for microstructural effects. In part, this is because of a dearth of experimental benchmarking data in the high strain-rate, low pressure regime, since many high-rate experiments also probe a region of strong shockwaves, at which point microstructure effects no longer play a primary role. This work uses laser-induced particle impact testing to quantitatively study high velocity impacts of small, rigid alumina microspheres on flat copper substrates with varying amounts of initial cold work in the weak shock regime, but at very high strain rates up to ~10 7 s –1 . Through paired experiments and numerical simulations, this work shows that the initial microstructure condition can have significant influence on dynamical mechanical properties in this range. Specifically, prior work hardening of the copper substrate leads to increased rebounding of the microparticles (i.e., less plastic dissipation in the impact) as well as smaller craters. Each of these experimental measurables can be converted into a strength measure, i.e., the dynamic yield strength or dynamic hardness, respectively, neither of which is well predicted consistently by existing constitutive laws. The general trend of hardening can be captured by such models by incorporating an existing “pre-strain,” suggesting that future calibration of the materials parameters may yield a good fit over a broader range of conditions. Our results emphasize the importance of reporting the microstructural condition in dynamic studies, as well as the necessity of accounting for these factors when formulating and optimizing constitutive models.

36 MATERIALS SCIENCE↗

Copper chaperone Atox1 plays role in breast cancer cell migration

Copper (Cu) is an essential transition metal ion required as cofactor in many key enzymes. After cell uptake of Cu, the metal is transported by the cytoplasmic Cu chaperone Atox1 to P{sub 1B}-type ATPases in the Golgi network for incorporation into Cu-dependent enzymes in the secretory path. Cu is vital for many steps of cancer progression and Atox1 was recently suggested to have additional functionality as a nuclear transcription factor. We here investigated the expression level, cellular localization and role in cell migration of Atox1 in an aggressive breast cancer cell line upon combining immunostaining, microscopy and a wound healing assay. We made the unexpected discovery that Atox1 accumulates at lamellipodia borders of migrating cancer cells and Atox1 silencing resulted in migration defects as evidenced from reduced wound closure. Therefore, we have discovered an unknown role of the Cu chaperone Atox1 in breast cancer cell migration. - Highlights: • Copper chaperone Atox1 is found to have new role in cancer. • Atox1 accumulates in lamellipodia borders of breast cancer cells. • Silencing of Atox1 reduced cell mobility in wound healing assay. • Atox1 appears necessary for breast cancer cell migration.

60 APPLIED LIFE SCIENCES↗

Copper transformation, speciation, and detoxification in anoxic and suboxic freshwater sediments

The complex chemistry of copper (Cu) in freshwater sediments at low concentrations is not well understood. We evaluated the transformation processes of Cu added to freshwater sediments under suboxic and anoxic conditions. Freshwater sediments from three sources in Michigan with different characteristics (Spring Creek, River Raisin, and Maple Lake) were spiked with 30 or 60 mg kg -1 Cu and incubated under a nitrogen atmosphere. After 28-d, each treatment subset was amended with organic matter (OM) to promote anoxic conditions and evaluate its effects on Cu speciation. OM addition triggered a shift from suboxic to anoxic conditions, and sequential extractions showed that Cu accordingly shifted from acid-soluble to oxidizable fractions. Extended X-ray absorption fine-structure (EXAFS) spectroscopy revealed that Cu sulfides dominated all anoxic samples except for Spring Creek 30 mg kg -1 , where Cu(I) was predominantly complexed to thiol groups of OM. Covellite and chalcopyrite (CuFeS 2 ) were the predominant Cu species in nearly all anoxic samples, as determined by Raman spectroscopy, scanning electron microscopy, and X-ray absorption near-edge structure (XANES) spectroscopy. Copper reduction also occurred under suboxic conditions: for two of three sediments, around 80% had been reduced to Cu(I), while the remaining 20% persisted as Cu(II) complexed to OM. However, in the third coarsest (i.e., Spring Creek), around 50% of the Cu had been reduced, forming Cu(I)-OM complexes, while the remainder was Cu(II)-OM complexes. Toxicity tests showed that survival of H. azteca and D. magna were significantly lower in suboxic treatments. Anoxic sediments triggered a near-complete transformation of Cu to sulfide minerals, reducing its toxicity.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Environmental degradation of electroplated nickel and copper coated SS316H in molten FLiNaK salt

Corrosion of nickel and copper electroplated coatings on SS316H in molten FLiNaK salt was studied. 500- and 1000-hour static corrosion tests were performed in molten FLiNaK at 700 degrees Celsius. Characterization of the coatings following corrosion indicated that they did not degrade in the molten salt during the corrosion experiment and fully protected the underlying SS316H from chromium dissolution. Interdiffusion between the copper coating and SS316H was extremely limited, interdiffusion between the nickel coating and SS316H. Diffusion modelling revealed that the nickel coatings still significantly reduced chromium dissolution over 60 years despite the interdiffusion.

36 MATERIALS SCIENCE↗

The effect of composition, temperature and pressure on the oxidation state and coordination environment of copper in silicate melts

Copper is a redox variable element that may occur as Cu 0 , Cu + , and Cu 2+ in the Earth’s crust. The oxidation state will affect its partitioning between coexisting minerals, melts and fluids and hence its behaviour in magmatic processes. Copper bearing silicate glasses were quenched from melts with 23 synthetic compositions (19 CaO-Na 2 O-MgO-Al 2 O 3 -SiO 2 (CNMAS), two “granites” containing K 2 O ± H 2 O, and Fe-bearing “MORB” and “andesite”) equilibrated at oxygen fugacities (fO 2 ), expressed in log units relative to the fayalite-magnetite-quartz (FMQ) buffer, ranging from −0.7 to 14, temperatures from 900 to 1500 °C and pressures from 0 to 2.5 GPa. Cu K-edge X-ray absorption near edge structure (XANES) spectra were recorded from the glasses and a pre-edge feature in the XANES spectra was found to scale with the proportion of Cu + . Cu + /ΣCu (where ΣCu = Cu + + Cu 2+ ) was quantified by fitting the intensity of the pre-edge feature as a function of fO 2 to the thermodynamically expected relationship. Cu + /ΣCu was found to only weakly depend on melt composition, with more basic melts (e.g., basalts rather than granites) preferentially stabilising Cu 2+ . Increasing temperature stabilises Cu + , while increasing pressure had little effect on Cu + /ΣCu in CNMAS melts but preferentially stabilised Cu 2+ in granite melts. Cu + /ΣCu can be predicted in silicate melts by the empirical equation: log(Cu 2+ /Cu + ) = 0.25(ΔFMQ + 8.58 − 25050/T + 940P/T – 0.02P) − 4.73 + 5400/T + 1.99Λ + (280P – 90P2) where T is temperature in K, P is pressure in GPa and is the optical basicity of the composition. The effects of fO 2 , melt composition, temperature and pressure on Cu + /ΣCu indicate that Cu + will be the dominant oxidation state in terrestrial silicate melts (e.g., Cu + /ΣCu = 99% in an andesitic melt at 900 °C, 1 GPa and ΔFMQ = 1). The electron exchange reaction Cu 2+ + Fe 2+ → Cu + + Fe 3+ occurs on cooling and, given the abundance of Fe in natural melts, the oxidation state of Cu in natural glasses is unlikely to correspond to that in the original melt.

Copper↗