DOE OSTI2019
This SBIR Phase I project developed the manufacturing capability for the production of ultra-low-background copper and lead for use in electronic interconnects and support architecture. Copper is an attractive electronic and support material because of its favorable conductivity and mechanical properties. Fortuitously, the material can also be electroplated with high radiopurity, particularly if the electroforming is performed in shielded, buried facilities within which the cosmogenic background is minimized. The machining of the electroformed copper into wires, feedthroughs, and support hardware can potentially introduce impurities through the shop environment or through the dies used in wire-drawing and part formation. During Phase I, we demonstrated an alternative low-cost solution-based approach in which copper nanoparticles are colloidally-grown and self-assembled into solids that can serve as thermal structures- such as cold-fingers, mechanical structures- such as the inner shielding lining, and electronic devices. We demonstrated ultrastrong, high-conductivity free-standing copper conductors during Phase I suitable for battery electrodes, interconnects, and cabling, all components that enable next-generation flexible electronics. In nanoparticle form, copper forms in a crystalline lattice with very low impurity content, but its self-assembly is facilitated by organic capping ligands that can serve as impurity sources. Upon the formation of a colloidal solid, the copper particles can be fused and the organic components evaporated through vacuum annealing. The study of ultra-pure copper was expanded during Phase I to include nanostructured lead, which is an important radiation-shielding material. By growing lead particles in a water-based solution the resulting solution can be poured into the desired form-factor mold, within which it will self-assemble and harden upon evaporation of the water and any organics. The effort during Phase II is designed to complete the development of the manufacturing process and to use that process to deliver high radio-purity copper and lead components to the rare-event detection community so that the noise-floor contribution from the surrounding materials is substantially eliminated.