Top-gated chemical vapor deposited MoS{sub 2} field-effect transistors on Si{sub 3}N{sub 4} substrates
We report the electrical characteristics of chemical vapor deposited (CVD) monolayer molybdenum disulfide (MoS{sub 2}) top-gated field-effect transistors (FETs) on silicon nitride (Si{sub 3}N{sub 4}) substrates. We show that Si{sub 3}N{sub 4} substrates offer comparable electrical performance to thermally grown SiO{sub 2} substrates for MoS{sub 2} FETs, offering an attractive passivating substrate for transition-metal dichalcogenides (TMD) with a smooth surface morphology. Single-crystal MoS{sub 2} grains are grown via vapor transport process using solid precursors directly on low pressure CVD Si{sub 3}N{sub 4}, eliminating the need for transfer processes which degrade electrical performance. Monolayer top-gated MoS{sub 2} FETs with Al{sub 2}O{sub 3} gate dielectric on Si{sub 3}N{sub 4} achieve a room temperature mobility of 24 cm{sup 2}/V s with I{sub on}/I{sub off} current ratios exceeding 10{sup 7}. Using HfO{sub 2} as a gate dielectric, monolayer top-gated CVD MoS{sub 2} FETs on Si{sub 3}N{sub 4} achieve current densities of 55 μA/μm and a transconductance of 6.12 μS/μm at V{sub tg} of −5 V and V{sub ds} of 2 V. We observe an increase in mobility at lower temperatures, indicating phonon scattering may dominate over charged impurity scattering in our devices. Our results show that Si{sub 3}N{sub 4} is an attractive alternative to thermally grown SiO{sub 2} substrate for TMD FETs.