Inventions, innovations, and new technologies: Flexible and lightweight thin-film solar PV based on CIGS, CdTe, and a-Si:H
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Traditional Glass-Backsheet (GB) photovoltaic (PV) modules have been the industry standard for a long time, but the Glass-Glass (GG) modules are quickly rising in popularity. PV modules installed in hot-humid climates with high string voltages can undergo potential induced degradation (PID). So far, to the best of our knowledge, only fresh modules with strong interfacial adhesion have been investigated for PID. However, in reality, the PV modules have weak interfacial adhesion after a few years of field exposure. Therefore, it is essential to evaluate PV modules with weakened interfaces. In this study, we investigated the PID susceptibility of PV modules with weakened interfaces after subjecting them to 2000 hours of damp heat (DH2000) at 85°C/85% relative humidity (RH) in an accelerated environmental chamber. Fresh GG modules were also stressed for PID to compare with PID degradation of DH-stressed modules. Pre- and post-characterization tests were done before, between, and after each stress method to determine the changes in electrical performance, cell metallization properties, and hotspot properties. It is observed that fresh GG modules showed little/no degradation (less than 1%) in maximum power (Pmax), whereas the GG modules that underwent sequential DH and PID degraded by 11% to 12%. Potential mechanisms for these degradations are also presented. Furthermore, the results presented in this study are critical for the industry, considering that the bifacial modules with GG construction will be dominant in the next 10 years.
Particle-based concentrating solar power systems integrated with sCO 2 power cycles offer high thermal efficiencies but require durable heat exchangers to transfer heat from high-temperature particles to the sCO 2 working fluid. Here, this study presents the design and optimization of a silicon carbide-silicon moving packed-bed heat exchanger for fabrication via binder jetting additive manufacturing. The heat exchanger was designed to withstand a 20 MPa sCO 2 pressure and operate at particle inlet temperatures up to 750 °C. The final design features 152 sCO 2 channels distributed across 19 plates, with elliptical corners and a minimum wall thickness of 3 mm. Flow restrictors at the sCO 2 channel inlets significantly improved flow uniformity, reducing thermal stresses and achieving a structural reliability of 99 % under representative operating conditions. The heat exchanger delivers a thermal duty of 9 kW and a volumetric power density of approximately 1 MW/m 3 in the channel region. Sensitivity studies confirmed the heat exchanger’s robustness under varying operating conditions, demonstrating its viability as a high-performance alternative to metallic heat exchangers for particle-based high-temperature concentrating solar power applications.
Module reliability and service lifetime are critical factors in improving photovoltaic system performance and reducing the levelized cost of electricity (LCOE). Soldering and lamination of the cell impart residual stresses that persist over time and superimpose additional loads during operation. This paper demonstrates the use of X-ray Topography (XRT) to image in-situ the dynamic response of a glass/backsheet mini-module upon drying at elevated temperature after saturation at humidity levels compatible with accelerated testing. The local water content in the encapsulant is also determined in-situ over time via Water Reflectometric Detection (WaRD), with diffusion of water in the front (glass side) and rear (backsheet side) resolved. As water diffuses out from the back of the glass/backsheet module, the cell curves towards the backsheet concomitantly. Here we find that the cell edges deflect 40μm out-of-plane with respect to its center while the encapsulant dries, compared to ~100 μm deflection when heating from 25°C to 85°C. The local cell deflections (changes in cell orientation) are correlated with the dynamic loss of water in the backside encapsulant. We conclude that the observed cell deflections are the result of hygroscopic stress induced by the encapsulant upon moisture outdiffusion. Therefore, the cell experiences a continually changing stress state and curvature dependent on local humidity and temperature. Depending on cell architecture and interconnection, this “breathing” mode of the cell may induce wear out and fatigue of the interconnects, affect the electrical connection of cracked pieces or cause failure near the interconnected edges of two cells.
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