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At least 721 records · Page 40

Characterization and Analysis of Insulated Metal Substrate-Based SiC Power Module for Traction Application

This paper presents the electrical characterization and drive cycle--based thermal analysis of an insulated metal substrate (IMS)--based silicon carbide power module for high-power traction inverters. The substrate was constructed using a thin layer of polymer--ceramic blend dielectric material with a thick copper core to improve transient thermal performance. The cooling performance of this module has already been validated with promising results. In this paper, an experimental test bed was set up to evaluate the dynamic and static electrical performance of the designed module under a wide range of operating conditions. The characterization results were then used to develop a drive cycle--based thermal model to validate the performance compared to the traditional direct bonded copper--based power module. The results indicate that the IMS-based power module is a suitable solution for high-power traction applications.

Chowdhury, Shajjad↗

Reducing Operating Temperature in Photovoltaic Modules

Reducing the operating temperature of photovoltaic modules increases their efficiency and lifetime. This can be achieved by reducing the production of waste heat or by improving the rejection of waste heat. We tested, using a combination of simulation and experiment, several thermal modifications in each category. To predict operating temperature and energy yield changes in response to changes to the module, we implemented a physics-based transient simulation framework based almost entirely on measured properties. The most effective thermal modifications reduced the production of waste heat by reflecting unusable light from the cell or the module. Consistent with previous results and verified in this work through year-long simulations, the ideal reflector resulted in an annual irradiance-weighted temperature reduction of 3.8 K for crystalline silicon (c-Si). Our results illustrate that more realistic reflector concepts must balance detrimental optical effects with the intended thermal effects to realize the optimal energy production advantage. Methods improving thermal conductivity or back-side emissivity showed only modest improvements of less than 1 K. We also studied a GaAs module, which uses high-efficiency and high-subbandgap reflectivity to operate at an annual irradiance-weighted temperature 12 K cooler than that of a c-Si module under the same conditions.

14 SOLAR ENERGY↗

The Polyhedral Specular Reflector: A Spectrum-Splitting Multijunction Design to Achieve Ultrahigh ( >50%) Solar Module Efficiencies

The most feasible pathway to record 50% efficiency photovoltaic devices is by utilizing many (>4) junctions to minimize thermalization and nonabsorption losses. Here we propose a spectrum-splitting design, the polyhedral specular reflector (PSR), that employs an optical architecture to divide and concentrate incident sunlight, allowing the incorporation of more junctions compared with traditional monolithic architectures. This paper describes the PSR design and indicates the requirements to achieve a 50% efficiency module by coupling robust cell, optical, and electrical simulations. We predict that a module comprised of the seven subcells with an average external radiative efficiency of at least 3%, an optical architecture capable of a splitting efficiency of at least 88% and 300× concentration, small (≤1 μm) metallic fingers for subcell contact, and a state-of-the-art power conditioning system (>98% efficiency) can achieve a module efficiency of 50%, a record for both multijunction cells and modules. We also discuss the flexibility of the design and explore how adjusting the size and type of concentrators can still yield record module efficiencies (>40%).

solar (photovoltaic), solid state lighting, phonon↗

Strong Attraction and Adhesion Forces of Dust Particles by System Voltages of Photovoltaic Modules

We report for the first time on direct measurements using atomic force microscopy (AFM) of electric field induced attraction and adhesion forces associated with soiling on photovoltaic (PV) modules. Real dust particles and silica spheres as surrogate to simulating dust particles were glued to AFM probe cantilevers. The electric field induced force (Fes) was measured via AFM force-distance (f-z) curves, where the electric field was generated by applying a voltage (Vs) to a simulated PV module. Fes and van der Waals (Fvw) force contributions could be separated with the f-z curves. The results show that Fes ~2.5 u N on dust particles is ~5 times larger than Fvw ~0.5 u N at even Vs = -100 V (i.e., similar to large-module operating voltages). Fes increases by an order of magnitude as the applied potential increases from Vs = -100 V to Vs = -500 V. These adhesion forces are by far the strongest that we have measured using the AFM technique for 'initial' contact of particles. Furthermore, unlike the more typical short-range forces of Fvw and liquid bridge, Fes extends sub-millimeters to a millimeter beyond the PV module surface, creating large attraction forces to even uncharged dust particles (i.e., via induced dipoles) in the air. These results indicate that the high voltages typically used with PV arrays today will attract more dust particles from the air, hold the dust particles to the surface very strongly, and potentially induce other PV module surface effects, all of which could increase the power production losses because of soiling.

14 SOLAR ENERGY↗

Transient Weighted Moving-Average Model of Photovoltaic Module Back-Surface Temperature

Accurate modeling of photovoltaic (PV) performance requires the precise calculation of module temperature. Currently, most temperature models rely on steady-state assumptions that do not account for the transient climatic conditions and thermal mass of the module. On the other hand, complex physics-based transient models are computationally expensive and difficult to parameterize. In order to address this, a new approach to transient thermal modeling was developed, in which the steady-state predictions from previous timesteps are weighted and averaged to accurately predict the module temperature at finer time scales. This model is informed by 3-D finite-element analyses, which are used to calculate the effect of wind speed and module unit mass on module temperature. The model, in application, serves as an added filter over existing steady-state models that smooths out erroneous values that are a result of intermittency in solar resource. Validation of this moving-average model has shown that it can improve the overall PV energy performance model accuracy by as much as 0.58% over steady-state models based on mean absolute error improvements and can significantly reduce the variability between the model predictions and measured temperature times series data.

14 SOLAR ENERGY↗

Nanomechanical and Fluorescence Characterizations of Weathered PV Module Encapsulation

Nanoindentation and fluorescence spectroscopy provide spatially resolved mechanical and chemical characterization for degradation of poly (ethylene-co-vinyl acetate) (EVA) encapsulants aged under accelerated weathering and in field deployed photovoltaic (PV) modules. For the accelerated weathering tests, two different EVA formulations in the glass/EVA/glass-laminated coupons were exposed to ultraviolet (UV) light for 180 days at three different temperatures (40, 60, and 80 °C) and UV intensities (0.4, 2.2, and 2.9 W/m2/nm at 340 nm). The fluorescence spectra and moduli were uniform through the cross section of both EVA formulations at the lowest temperature and UV intensity; however, under the highest temperature and UV intensity, the UV irradiated sides showed lower moduli and higher fluorescence compared to the opposite sides. For EVA obtained from PV modules deployed 27 years in Sacramento, CA, USA, changes in fluorescence intensity across the thickness were relatively greater than changes in modulus. On the other hand, for EVA obtained from the same type of module stored in the shed for 27 years, no fluorescence was observed, and a uniform modulus was seen through the EVA layer, but with substantially higher values than those obtained from the field-deployed modules. The different extent of changes between laboratory and field exposures suggests the importance of considering effects of temperature and UV intensity for designing a reliable accelerated testing. This study uniquely demonstrates the capability of microscale characterization using nanoindentation and fluorescence microscopy to monitor mechanical and chemical degradation of EVA encapsulants in PV modules.

14 SOLAR ENERGY↗

Thermal and Electrical Effects of Partial Shade in Monolithic Thin-Film Photovoltaic Modules

Photovoltaic cells can be damaged by reverse bias stress, which arises during service when a monolithically integrated thin-film module is partially shaded. We introduce a model for describing a module's internal thermal and electrical state, which cannot normally be measured. Using this model and experimental measurements, we present several results with relevance for reliability testing and module engineering: Modules with a small breakdown voltage experience less stress than those with a large breakdown voltage, with some exceptions for modules having light-enhanced reverse breakdown. Masks leaving a small part of the masked cells illuminated can lead to very high temperature and current density compared to masks covering entire cells.

14 SOLAR ENERGY↗

Partial Shade Endurance Testing for Monolithic Photovoltaic Modules

In monolithically integrated photovoltaic (PV) modules, including CdTe, CIGS, and a-Si modules, some shadows can cause permanent damage under some operating conditions. This damage reduces efficiency and causes shunts that are visible to the eye and in luminescence imaging. Although these shadows are sometimes forbidden by product documentation, we have observed this type of damage in utility-scale PV systems. Existing standards ensure that qualified modules are safe to use after they are damaged by shadows. But no standard test exists to quantify the loss of efficiency that can result from this damage. In this work we describe new, accelerated tests to quantify the power loss that occurs due to shadows from human bodies and narrow objects, such as tools, placed nearby or directly touching modules. The tests are designed to be easy to conduct uniformly across products and laboratories. The tests can be performed outdoors and last only a few minutes. In our trials on commercial products, these tests resulted in 2%-27% permanent loss in power at standard test conditions (STC). The relative loss was several times larger when measured at lower irradiance. The tests we describe can be used to differentiate products, to direct the development of technological solutions to shadow sensitivity at the cell and module levels, and to establish the need for system-level and administrative solutions to the occurrence of shadows. Similar tests will be the basis of a new International Electrotechnical Commission (IEC) technical specification (TS) 63140.

14 SOLAR ENERGY↗

Technoeconomic Analysis of Photovoltaics Module Manufacturing with Thin Silicon Wafers

Reducing silicon usage by adopting thinner wafers can significantly reduce capital expenditure (capex) and cost, and thus accelerate the growth of manufacturing capacity and deployment. In this work, we evaluated potential benefits of thin Si wafers for current and future PV modules. We apply a technoeconomic framework that couples bottom-up cost model, and a cash-flow growth model to analyze PV modules with thin wafers. First, we show that, comparing the current PERC with 160 um thick wafers to the high-efficiency concept with 50 um thin wafers, the capex is reduced from 0.39 to 0.2 $/(W/year) while the cost is from 0.32 to 0.2 $/W. Second, the potential of accelerated deployment is analyzed for the highefficiency thin wafer concept. We found the significant advantages of higher growth rate (~20% relative) and higher deployment plateau (~3 times) than the current PERC modules. modules with thin wafers. First, we show that, comparing the current PERC with 160 um thick wafers to the high-efficiency concept with 50 um thin wafers, the capex is reduced from 0.39 to 0.2 $/(W/year) while the cost is from 0.32 to 0.2 $/W. Second, the potential of accelerated deployment is analyzed for the highefficiency thin wafer concept. We found the significant advantages of higher growth rate (~20% relative) and higher deployment plateau (~3 times) than the current PERC modules.

14 SOLAR ENERGY↗

Cracked Solar Cell Performance Depends on Module Temperature

When cells in a crystalline silicon photovoltaic module crack, packaging materials hold the fragments together. Changes in module temperature cause cell fragments to move, allowing cracked metallization to lose and regain contact. We intentionally cracked cells in commercial PV modules and characterized the modules’ temperature-dependent electroluminescence (EL) response. Here we show that (1) metallization makes contact across cracks in a way that is temperature dependent and (2) this contact is not a function of temperature, but is hysteretic. We expect that any electro-optical characterization made at a single temperature will be misleading as to the effects of cracked cells at different temperatures. And we expect that a single temperature sweep cannot fully characterize the temperature dependence of electro-optical performance of modules with cracked cells.

crack↗

Life-Cycle Analysis of Potentially Longer Life Expectancy CdTe PV Modules

Research on PV module longevity shows that with lower degradation rates and better encapsulation, PV modules can significantly outlast their current life expectancy of 25-30 years. The focus of this study is on alternative CdTe PV module back-contact and encapsulation materials that show the potential of increasing module operation lives from 30 to 40 and 50 years. Life-cycle-analyis shows that some alternative materials may slightly increase cradle-to-gate environmental impacts per m2 of module, but increased operational life more than counterbalances such impacts. The life-cycle carbn footprint of systems operating under average US insolation conditions of 1800 kWh/m2/yr is reduced from 10 gCO2eq/kWh to 6 gCO2eq/kWh when the operation life increases from 30 to 50 yrs. Similar reductions are noted for all life-cycle impact indicators, whereas the EROI of the considered system increases from 67 to 177 as life increases from 30 to 50 yrs.

14 SOLAR ENERGY↗

Comparison and Discussion on Shortcircuit Protections for Silicon-Carbide MOSFET Modules: Desaturation Versus Rogowski Switch-Current Sensor

Survivability of silicon-carbide (SiC) mosfet modules during short circuit (SC) is essential for modern power electronics systems due to large economic implications. SiC mosfet modules exhibit narrow SC withstand times and generally much lower SC robustness than silicon (Si) insulated-gate bipolar transistors (IGBTs). This puts a critical concern on their utilization, further stressing the importance of reliable protection. This article presents a comprehensive analysis and discussion on the SiC mosfet module SC protection and performance comparison between conventional desaturation detection, previously used for Si IGBT protection, and Rogowski switch-current sensor (RSCS) detection. In addition, this article presents the experimental design for soft turn-off as a reaction to the SC detection to avoid excessive overshoots during the abrupt turn-off of the SC current. To perform different types of SC with various fault inductances on different temperatures, and for the sake of fair comparison under the same conditions, a gate-driver unit for 1.2 kV SiC mosfet half-bridge modules is developed containing both detection methods. The results demonstrate that both methods are successful in protecting the module in all SC types, with superiority of the RSCS detection and concerns for desaturation detection in high-inductance and high dc-bus voltage SC events.

42 ENGINEERING↗

Externally-Modulated Electro-Optically Coupled Detector Architecture for Nuclear Physics Instrumentation

A new laser-based externally-modulated electro-optically coupled detector (EOCD) architecture is being developed to enable high-density readout for radiation detectors with accurate analog radiation pulse shape and timing preservation. Unlike digital conversion before electro-optical modulation, the EOCD implements complete analog optical signal modulation and multiplexing in its detector front-end. The result is a compact, high performance detector readout that can be both radiation tolerant and immune to magnetic fields. In this work, the feasibility of EOCD was explored by constructing a two-wavelength laser-based externally-modulated EOCD, and testing analog pulse shape preservation and wavelength-division multiplexing (WDM) crosstalk. Comparisons were first made between the corresponding initial pulses and the electro-optically coupled analog pulses. This confirmed an excellent analog pulse preservation over $ sim {hbox {29}}% $ of the modulator’s switching voltage range. Optical spectrum analysis revealed less than $-{hbox {14}}~hbox{dB}$ crosstalk with 1.2 nm WDM wavelength bandgap, and provided insight on experimental conditions that could lead to increased inter-wavelength crosstalk. Further discussions and previous research on the radiation tolerance and magnetic field immunity of the candidate materials were also given, and quantitative device testing is proposed in the future.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

A surface ice module for wind turbine dynamic response simulation using FAST

It is a fact that developing offshore wind energy has become more and more serious worldwide in recent years. Many of the promising offshore wind farm locations are in cold regions that may have ice cover during wintertime. The challenge of possible ice loads on offshore wind turbines raises the demand of modeling capacity of dynamic wind turbine response under the joint action of ice, wind, wave, and current. The simulation software FAST is an open source computer-aided engineering (CAE) package maintained by the National Renewable Energy Laboratory. In this paper, a new module of FAST for assessing the dynamic response of offshore wind turbines subjected to ice forcing is presented. In the ice module, several models are presented which involve both prescribed forcing and coupled response. For conditions in which the ice forcing is essentially decoupled from the structural response, ice forces are established from existing models for brittle and ductile ice failure. For conditions in which the ice failure and the structural response are coupled, such as lock-in conditions, a rate-dependent ice model is described, which is developed in conjunction with a new modularization framework for FAST. In this paper, analytical ice mechanics models are presented that incorporate ice floe forcing, deformation, and failure. For lower speeds, forces slowly build until the ice strength is reached and ice fails resulting in a quasi-static condition. For intermediate speeds, the ice failure can be coupled with the structural response and resulting in coinciding periods of the ice failure and the structural response. A third regime occurs at high speeds of encounter in which brittle fracturing of the ice feature occurs in a random pattern, which results in a random vibration excitation of the structure. An example wind turbine response is simulated under ice loading of each of the presented models. This module adds to FAST the capabilities for analyzing the response of wind turbines subjected to forces resulting from ice impact on the turbine support structure. The conditions considered in this module are specifically addressed in the International Organization for Standardization (ISO) standard 19906:2010 for arctic offshore structures design consideration. Special consideration of lock-in vibrations is required due to the detrimental effects of such response with regard to fatigue and foundation/soil response. Finally, the use of FAST for transient, time domain simulation with the new ice module is well suited for such analyses.

17 WIND ENERGY↗

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Direct bonded copper (DBC) substrates used in power modules have limited heat spreading and manufacturing capability due to ceramic properties and manufacturing technology. The ceramic and copper bonding is also subject to high mechanical stress due to coefficient of thermal expansion mismatch between the copper and the ceramic. For wide-bandgap (WBG) devices, it is of interest exploring new substrate technologies that can overcome some of the challenges of direct bonded copper substrates. In this technical paper, the design, analysis, and comparison of insulated metal substrates (IMSs) for high-power wide-bandgap semiconductor-based power modules are discussed. This paper starts with technical description and discussion of state-of-the-art DBC substrates with different ceramic insulators such as aluminum nitride (AlN), Al 2 O 3 , and Si 3 N 4 . Next, an introduction of IMSs and their material properties, and a design approach for SiC (silicon carbide) metal-oxide-semiconductor field-effect transistor (MOSFET)-based power modules for high-power applications is provided. The influence of dielectric thickness on the power handling capability of the substrate are also discussed. The designed IMS and DBC substrates were characterized in terms of steady-state and transient thermal performance using finite element simulation. Finally, the performance of the IMS and DBC are validated in an experimental setup under different loading and cooling temperature conditions. We report the simulation and experimental results showed that the IMS can provide high steady-state thermal performance for high-power modules based on SiC MOSFETs. Furthermore, the IMS provided enhanced transient thermal performance, which provided a reduced junction temperature when the module is operated at low fundamental output frequencies in traction drive systems.

42 ENGINEERING↗

A Combined Computational and Mathematical Analysis of Interconnect Fatigue Potential in Photovoltaic Modules

A finite element model of a 60-cell monocrystalline silicon glass-polymer photovoltaic module was simulated with ±1.0 kPa and ±2.4 kPa loads applied to the glass to calculate the deformation under load. Cell-to-cell displacements were used to approximate interconnect strain and stress. A mathematical fatigue cycle life relation was fitted to data for the interconnect material (copper), to generate a life prediction at each interconnect location based on the local stress means, reversal extents, and amplitudes. Interconnect stress was found to be significantly asymmetric about zero despite symmetric positive and negative module loads due to laminate thickness offsets about the neutral plane and the effects of module framing. Cycle life results indicated that interconnect fatigue failure was unlikely to occur over a 30-year lifetime of conservative wind and snow load cycles since the typical cell design feature of leaving some unconstrained length between the cell edge and first solder pad increases the effective gauge length and decreases the stress levels below the material endurance limit. Follow-up analyses found that 3.6 mm and 6.4 mm were the minimum unconstrained lengths required to survive the assumed lifetime of wind and snow cycles, respectively, confirming that typical industrial module constructions with 8–15 mm unconstrained lengths should survive conservatively. Notably, large magnitude, low-cycle snow loading was consistently the limiting factor requiring a longer unconstrained interconnect length. Finally, insights and workflows from this study inform module interconnection design limits for survival against mechanical fatigue in deployment environments.

14 SOLAR ENERGY↗

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

This project describes the modeling process to design the packaging and heat exchanger for a half-bridge wide-bandgap (WBG) power semiconductor module. The module uses two silicon carbide, metal-oxide-semiconductor field-effect transistor (MOSFET) devices per switch position that are soldered to an aluminum nitride, direct-bond copper (DBC) substrate. A baseplate cooling configuration (e.g., no thermal grease) is used along with a water-ethylene glycol, jet-impingement-style heat exchanger. The heat exchanger was designed to be fabricated using prototyping equipment from the National Renewable Energy Laboratory, complies with automotive standards (for minimal channel sizes, flow rates, and coolant), and considers reliability aspects (i.e., erosion/corrosion). Device-scale computational fluid dynamics (CFD) is used first to design the slot jet impingement cooling configuration and compute the effective heat transfer coefficient (HTC) of the concept. The computed HTCs are then used as boundary conditions for a finite element study to optimize the package geometry (e.g., device layout and baseplate thickness) to minimize thermal resistance and minimize temperature variation between the module's four devices. Finally, a fluid manifold is designed to generate the slot jets and cool the devices. Module-scale CFD predicts a relatively low junction-to-fluid thermal resistance of 16.7 mm2 K/W, a 1.4 degrees C temperature variation between devices, and a total pressure drop of 5,860 Pa (0.85 psi) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance.

DIRECT ENERGY CONVERSION↗

Multiphysics Co-Optimization Design and Analysis of Double-Side Cooled Silicon Carbide-Based Power Module: Preprint

With the rapid growth of Electric Vehicles (EVs) and Hybrid Electric Vehicles (HEVs), much more rigorous design targets have been set for automotive power electronics, including high power density, high reliability, and low cost. Novel power module and inverter technologies based on wide bandgap (WEG) semiconductors have been developed to meet these design targets, while providing optimal power semiconductor operating temperature and promising thermomechanical performance. Compared with conventional cooling techniques which are normally applied only on one side of power module, double-side cooling approach is now believed to be the solution to enable high power density and low thermal resistance of WEG semiconductor-based power electronics. In this work, we develop a three-phase power module that is double-sided cooled using dielectric fluid jet impingement. In each phase, four silicon carbide (SiC) power semiconductors are bonded to copper busbars without electrical insulation layers. A finite element analysis (FEA) model is created for thermal and thermomechanical analysis. Based on FEA modeling results, we select particular dimensions for a parametric study to optimize thermal and mechanical performance. Using a multi-objective genetic algorithm (MOGA)-based optimization method, we have minimized the maximum junction temperature and thermal stresses within the power module. The multiphysics co-optimization approach has enabled an efficient design process of power modules with greatly reduced computational cost, as compared to conventional processes that rely on exhaustive numerical simulations and iterations.

ADVANCED PROPULSION SYSTEMS↗