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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 721 records · Page 40
All sourcesNASA NTRSDOE OSTI
NASA NTRS2005

High Resolution Aerospace Applications using the NASA Columbia Supercomputer

This paper focuses on the parallel performance of two high-performance aerodynamic simulation packages on the newly installed NASA Columbia supercomputer. These packages include both a high-fidelity, unstructured, Reynolds-averaged Navier-Stokes solver, and a fully-automated inviscid flow package for cut-cell Cartesian grids. The complementary combination of these two simulation codes enables high-fidelity characterization of aerospace vehicle design performance over the entire flight envelope through extensive parametric analysis and detailed simulation of critical regions of the flight envelope. Both packages. are industrial-level codes designed for complex geometry and incorpor.ats. CuStomized multigrid solution algorithms. The performance of these codes on Columbia is examined using both MPI and OpenMP and using both the NUMAlink and InfiniBand interconnect fabrics. Numerical results demonstrate good scalability on up to 2016 CPUs using the NUMAIink4 interconnect, with measured computational rates in the vicinity of 3 TFLOP/s, while InfiniBand showed some performance degradation at high CPU counts, particularly with multigrid. Nonetheless, the results are encouraging enough to indicate that larger test cases using combined MPI/OpenMP communication should scale well on even more processors.

Mavriplis, Dimitri J.↗
DOE OSTI2021

Packaging of an 8-kV Silicon Carbide Diode Module with Double-Side Cooling and Sintered-Silver Joints

Packaging innovations are needed for medium-voltage wide bandgap power semiconductor modules to enable their adaptation in grid applications. A unique challenge for packaging medium-voltage power modules is managing the trade-off between insulation demand and heat dissipation. The focus of this work was on developing a packaging innovation that improves the module heat dissipation and offers more flexibility to its insulation design. Two strategies were explored for the packaging of an 8-kV SiC diode rectifier module:(1) double-side cooling and (2) sintered-silver bonding. Double-side cooling was realized by using short metal posts rather than long and thin wire bonds for device interconnection, forming a low-profile package with devices sandwiched between two insulated metal substrates. Sintered-silver bonding enabled the devices to function reliably at over 250 °C. Simulations of the packaged module showed a low interconnect inductance of 2.67 nH and a 50% less heat transfer coefficient required to cool the chips. Prototypes of the module were fabricated, and preliminary electrical testing results validated the package design.

27 ARPA - Advanced Research Projects Agency-Energy↗
DOE OSTI2025

Tensile Modeling PVC Gels for Electrohydraulic Actuators

Polyvinyl chloride (PVC)-dibutyl adipate (DBA) gels are a fascinating dielectric elastomer actuator showing promise in soft robotics. When actuated with high voltages, the gel deforms towards the anode. A recent application of PVC gels in electrohydraulic actuators motivates elastic and hyperelastic constitutive relationships for tensile loading modes. PVC gels with plasticizer-to-polymer weight ratios of 2:1, 4:1, 6:1, and 8:1 w/w were evaluated. PVC gels exhibit a linear elastic region up to 25% strain. The elastic modulus decreased with increasing plasticizer content from 288.8 kPa, 56.1 kPa, 24.7 kPa, to 11 kPa. Poisson’s ratio also decreased with increasing plasticizer content from 0.42, 0.43, 0.39, to 0.35. We suggest that the decrease in polymer concentration facilitates a weakly interconnected polymer network susceptible to chain slippage that hinders the network response, thus lowering Poisson’s ratio. Our work suggests that PVC gels can be treated as isotropic and incompressible for large strains and hyperelastic modeling; however, highly plasticized gels tend to act less incompressible at small strains. The power scaling law between the elastic modulus and plasticizer weight ratio showed high agreement, making the elastic modulus deterministic for any plasticizer content. The Neo–Hookean, Mooney–Rivlin, Yeoh, Gent, Ogden, and extended tube hyperelastic constitutive models are investigated. The Yeoh model shows the highest feasibility when evaluated up to 3.5 stretch, showing a maximum normalized root-mean-square-error of 6.85%. Together, these findings establish a constitutive basis for PVC-DBA gels, incorporating small strain elasticity, large strain non-linear behavior, and network analysis while providing suggestive insight into the network structure required for accurately modeling the EPIC.

Polymer Science↗
NASA NTRS1987

Development of a semi-autonomous service robot with telerobotic capabilities

The importance to the United States of semi-autonomous systems for application to a large number of manufacturing and service processes is very clear. Two principal reasons emerge as the primary driving forces for development of such systems: enhanced national productivity and operation in environments whch are hazardous to humans. Completely autonomous systems may not currently be economically feasible. However, autonomous systems that operate in a limited operation domain or that are supervised by humans are within the technology capability of this decade and will likely provide reasonable return on investment. The two research and development efforts of autonomy and telerobotics are distinctly different, yet interconnected. The first addresses the communication of an intelligent electronic system with a robot while the second requires human communication and ergonomic consideration. Discussed here are work in robotic control, human/robot team implementation, expert system robot operation, and sensor development by the American Welding Institute, MTS Systems Corporation, and the Colorado School of Mines--Center for Welding Research.

Jones, J. E.↗
NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗
DOE OSTI2025

Data Centers and Digital Assurance Workshop 3 – Mitigations for Digital Assurance Risks

The third session of the TADA (Technical Assistance for Digital Assurance) Data Centers Cohort, held on November 18, 2025, focused on developing mitigation strategies for digital assurance risks identified in previous workshops. Hosted by Idaho National Laboratory (INL) and ScottMadden, the session emphasized the application of Cyber-Informed Engineering (CIE) to data center infrastructure, particularly at the utility–data center interface. Participants revisited and ranked key digital assurance risks, including architecture and interface weaknesses, governance gaps, and AI-enabled threats. The workshop introduced the 12 principles of CIE, advocating for consequence-focused design, engineered controls, and secure information architecture to proactively reduce cyber-physical vulnerabilities. These principles were applied to critical data center systems such as power distribution, UPS, cooling, SCADA/BMS, and grid-forming batteries. The session also addressed governance challenges at the interconnection boundary, highlighting the need for clear roles in telemetry sharing, firmware management, and trip settings. Special attention was given to emerging risks from behind-the-meter (BTM) generation, including reverse-power flow and the integration of small modular reactors (SMRs), which shift data centers from large loads to complex generation nodes. Participants explored how interconnection agreements can serve as enforceable instruments for digital assurance, and reviewed gaps in current standards such as NERC CIP, IEC 62443, and IEEE 1547. The workshop concluded with pathways to standardization, including model agreement language, state-level programs, and expanded NERC guidance. INL also presented tools and frameworks for secure procurement and supplier risk management, reinforcing the need for integrated engineering and policy solutions to secure the evolving data center–grid ecosystem. Session 3 of 3.

24 - POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2025

Cybersecurity Incident Response Guide for Wind

As wind energy systems become increasingly digitized and interconnected, they face a growing array of cyber threats that can disrupt operations, compromise safety, and trigger cascading impacts across the energy ecosystem. The Wind Incident Response Guide provides a structured, wind-specific framework for preparing for, detecting, responding to, and recovering from cyber incidents. Drawing on lessons from field demonstrations, cyber-physical testbeds, and stakeholder engagement across the wind sector, this guide integrates technical, operational, and regulatory considerations to support asset owners, operators, and responders. It outlines key roles and responsibilities, maps incident response phases to wind-specific scenarios, and highlights applicable laws, regulations, standards, and best practices. By tailoring general cybersecurity principles to the unique architectures and operational constraints of wind systems—including remote access, legacy components, and environmental interfaces—this guide aims to enhance resilience, reduce response time, and support coordinated action across public and private stakeholders. It is intended as a practical resource for utilities, developers, regulators, and emergency managers working to secure the future of wind energy.

17 - WIND ENERGY↗
NASA NTRS1986

Evaluation of reliability modeling tools for advanced fault tolerant systems

The Computer Aided Reliability Estimation (CARE III) and Automated Reliability Interactice Estimation System (ARIES 82) reliability tools for application to advanced fault tolerance aerospace systems were evaluated. To determine reliability modeling requirements, the evaluation focused on the Draper Laboratories' Advanced Information Processing System (AIPS) architecture as an example architecture for fault tolerance aerospace systems. Advantages and limitations were identified for each reliability evaluation tool. The CARE III program was designed primarily for analyzing ultrareliable flight control systems. The ARIES 82 program's primary use was to support university research and teaching. Both CARE III and ARIES 82 were not suited for determining the reliability of complex nodal networks of the type used to interconnect processing sites in the AIPS architecture. It was concluded that ARIES was not suitable for modeling advanced fault tolerant systems. It was further concluded that subject to some limitations (the difficulty in modeling systems with unpowered spare modules, systems where equipment maintenance must be considered, systems where failure depends on the sequence in which faults occurred, and systems where multiple faults greater than a double near coincident faults must be considered), CARE III is best suited for evaluating the reliability of advanced tolerant systems for air transport.

Baker, Robert↗
NASA NTRS1991

An integrated Ka/Ku-band payload for personal, mobile and private business communications

The Canadian Department of Communications has been studying options for a government-sponsored demonstration payload to be launched before the end of the century. A summary of the proposed system concepts and network architectures for providing an advanced private business network service at Ku-band and personal and mobile communications at Ka-band is presented. The system aspects addressed include coverage patterns, traffic capacity, and grade of service, multiple access options as well as special problems, such as Doppler in mobile applications. Earth terminal types and the advanced payload concept proposed in a feasibility study for the demonstration mission are described. This concept is a combined Ka-band/Ku-band payload which incorporates a number of advanced satellite technologies including a group demodulator to convert single-channel-per-carrier frequency division multiple access uplink signals to a time division multiplex downlink, on-board signal regeneration, and baseband switching to support packet switched data operation. The on-board processing capability of the payload provides a hubless VSAT architecture which permits single-hop full mesh interconnectivity. The Ka-band and Ku-band portions of the payload are fully integrated through an on-board switch, thereby providing the capability for fully integrated services, such as using the Ku-band VSAT terminals as gateway stations for the Ka-band personal and mobile communications services.

Hayes, Edward J.↗
DOE OSTI2024

Structural characterization of high-protein system through ultra-small and small-angle X-ray scattering

High-protein systems exhibit a hierarchical structure consisting of interconnected multiscale length assemblies. Recent investigations are directed toward identifying these structural units under various processing and environmental conditions to establish structure–function correlations. Ultra-small and small-angle X-ray scattering (USAXS/SAXS) has become a crucial tool for characterizing the structures of proteins and their clusters/aggregates, ranging from nanometers to micrometers, with minimal disruption to their original state. Here, this review first describes the facilities and principles of X-ray scattering, followed by discussions on the analysis of scattering data, including the interpretation of fitting models. It then delves into the main applications of USAXS/SAXS in plant and dairy protein-rich systems. Future strategies to enhance the utilization of scattering techniques for elucidating the structure of high-protein systems are also included.

60 APPLIED LIFE SCIENCES↗
DOE OSTI2024

Quantum/AI Topology-Aware Latency-Adaptive HPC Workflow Scheduling Optimization

The growing demand for more powerful high-performance computing (HPC) systems has led to a steady rise in energy consumption by supercomputing worldwide. This study is focused on comparing our Application-Topology Mapper (ATMapper) to the popular Simple Linux Utility for Resource Management (SLURM) for the purpose of exploring methods that can further optimize job-scheduling within HPC systems. ATMapper is an Artificial-Intelligence based approach to job-scheduling that is currently being enhanced with quantum annealing (QA) to generate optimal schedules faster. We are applying QA to speedup our ATMapper process to achieve higher computing efficiency, thereby reducing HPC energy consumption. Here, we examine how four job-scheduling approaches perform in processor node assignment when using an example network architecture of 4 interconnected nodes. Using a specialized script, we are assessing the schedule of a computation flow with 11 interdependent tasks. The data movements among nodes were tracked to count for the number of interactions (network hops) between nodes needed to complete the tasks. The total number of hops and the job completion time were then used to quantify the efficiency of the different mapping approaches. In addition to SLURM, we also compare our ATMapper to the QA-enabled LBNL TIGER and the D-Wave Distributed Computing processor assignment approaches. The preliminary results showed that our topology-aware, latency-adaptive ATMapper is significantly more efficient when compared to the other scheduling approaches due to its load-imbalance network allocation. The scheduler displayed a computing efficiency of 53% by performing significantly fewer network hops than its alternatives. By reducing the number of hops, ATMapper was able to perform all 11 tasks by using only 3 nodes out of given 4. This research indicates the potential to use QA/AI for HPC job-scheduling. Later, we will test a SLURM simulator program to draw further comparisons on the effectiveness of ATMapper's scheduling approach. The results of this comparison will serve as a baseline for later improving SLURM's performance using a QA-enhanced ATMapper approach.

Caraveo, Braulio [University of Huston - Clear Lak↗
NASA NTRS2000

Evolutionary Cell Computing: From Protocells to Self-Organized Computing

On the path from inanimate to animate matter, a key step was the self-organization of molecules into protocells - the earliest ancestors of contemporary cells. Studies of the properties of protocells and the mechanisms by which they maintained themselves and reproduced are an important part of astrobiology. These studies also have the potential to greatly impact research in nanotechnology and computer science. Previous studies of protocells have focussed on self-replication. In these systems, Darwinian evolution occurs through a series of small alterations to functional molecules whose identities are stored. Protocells, however, may have been incapable of such storage. We hypothesize that under such conditions, the replication of functions and their interrelationships, rather than the precise identities of the functional molecules, is sufficient for survival and evolution. This process is called non-genomic evolution. Recent breakthroughs in experimental protein chemistry have opened the gates for experimental tests of non-genomic evolution. On the basis of these achievements, we have developed a stochastic model for examining the evolutionary potential of non-genomic systems. In this model, the formation and destruction (hydrolysis) of bonds joining amino acids in proteins occur through catalyzed, albeit possibly inefficient, pathways. Each protein can act as a substrate for polymerization or hydrolysis, or as a catalyst of these chemical reactions. When a protein is hydrolyzed to form two new proteins, or two proteins are joined into a single protein, the catalytic abilities of the product proteins are related to the catalytic abilities of the reactants. We will demonstrate that the catalytic capabilities of such a system can increase. Its evolutionary potential is dependent upon the competition between the formation of bond-forming and bond-cutting catalysts. The degree to which hydrolysis preferentially affects bonds in less efficient, and therefore less well-ordered, peptides is also critical to evolution of a non-genomic system. Based on these results, a new computational object called a "molnet" is defined. Like a neural network, it is formed of interconnected units that send "signals" to each other. Like molecules, neural networks have a specific function once their structure is defined. The difference between a molnet and traditional neural networks, is that input to molnets is not simply passed along and processed from input to output units, but rather it is utilized to form and break connections(bonds), and thus to form new structures. Molnets represent a powerful tool that can be used to understand the conditions under which chemical systems can form large molecules, such as proteins, and display ever more complex functions. This has direct applications, for example to the design of smart,synthetic fabrics. Additional information is contained in the original.

Colombano, Silvano↗
NASA NTRS2000

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

Parsons, Heather A.↗
NASA NTRS2003

Unified Models of Turbulence and Nonlinear Wave Evolution in the Extended Solar Corona and Solar Wind

The PI (Cranmer) and Co-I (A. van Ballegooijen) made significant progress toward the goal of building a "unified model" of the dominant physical processes responsible for the acceleration of the solar wind. The approach outlined in the original proposal comprised two complementary pieces: (1) to further investigate individual physical processes under realistic coronal and solar wind conditions, and (2) to extract the dominant physical effects from simulations and apply them to a one-dimensional and time-independent model of plasma heating and acceleration. The accomplishments in the report period are thus divided into these two categories: 1a. Focused Study of Kinetic MHD Turbulence. We have developed a model of magnetohydrodynamic (MHD) turbulence in the extended solar corona that contains the effects of collisionless dissipation and anisotropic particle heating. A turbulent cascade is one possible way of generating small-scale fluctuations (easy to dissipate/heat) from a pre-existing population of low-frequency Alfven waves (difficult to dissipate/heat). We modeled the cascade as a combination of advection and diffusion in wavenumber space. The dominant spectral transfer occurs in the direction perpendicular to the background magnetic field. As expected from earlier models, this leads to a highly anisotropic fluctuation spectrum with a rapidly decaying tail in the parallel wavenumber direction. The wave power that decays to high enough frequencies to become ion cyclotron resonant depends on the relative strengths of advection and diffusion in the cascade. For the most realistic values of these parameters, though, there is insufficient power to heat protons and heavy ions. The dominant oblique waves undergo Landau damping, which implies strong parallel electron heating. We thus investigated the nonlinear evolution of the electron velocity distributions (VDFs) into parallel beams and discrete phase-space holes (similar to those seen in the terrestrial magnetosphere) which are an alternate means of heating protons via stochastic interactions similar to particle-particle collisions. 1b. Focused Study of the Multi-Mode Detailed Balance Formalism. The PI began to explore the feasibility of using the "weak turbulence," or detailed-balance theory of Tsytovich, Melrose, and others to encompass the relevant physics of the solar wind. This study did not go far, however, because if the "strong" MHD turbulence discussed above is a dominant player in the wind's acceleration region, this formalism is inherently not applicable to the corona. We will continue to study the various published approaches to the weak turbulence formalism, especially with an eye on ways to parameterize nonlinear wave reflection rates. 2. Building the Unified Model Code Architecture. We have begun developing the computational model of a time-steady open flux tube in the extended corona. The model will be "unified" in the sense that it will include (simultaneously for the first time) as many of the various proposed physical processes as possible, all on equal footing. To retain this generality, we have formulated the problem in two interconnected parts: a completely kinetic model for the particles, using the Monte Carlo approach, and a finite-difference approach for the self-consistent fluctuation spectra. The two codes are run sequentially and iteratively until complete consistency is achieved. The current version of the Monte Carlo code incorporates gravity, the zero-current electric field, magnetic mirroring, and collisions. The fluctuation code incorporates WKJ3 wave action conservation and the cascade/dissipation processes discussed above. The codes are being run for various test problems with known solutions. Planned additions to the codes include prescriptions for nonlinear wave steepening, kinetic velocity-space diffusion, and multi-mode coupling (including reflection and refraction).

Cranmer, Steven R.↗
NASA NTRS2009

Smart and Intelligent Sensors

John C. Stennis Space Center (SSC) provides rocket engine propulsion testing for NASA's space programs. Since the development of the Space Shuttle, every Space Shuttle Main Engine (SSME) has undergone acceptance testing at SSC before going to Kennedy Space Center (KSC) for integration into the Space Shuttle. The SSME is a large cryogenic rocket engine that uses Liquid Hydrogen (LH2) as the fuel. As NASA moves to the new ARES V launch system, the main engines on the new vehicle, as well as the upper stage engine, are currently base lined to be cryogenic rocket engines that will also use LH2. The main rocket engines for the ARES V will be larger than the SSME, while the upper stage engine will be approximately half that size. As a result, significant quantities of hydrogen will be required during the development, testing, and operation of these rocket engines.Better approaches are needed to simplify sensor integration and help reduce life-cycle costs. 1.Smarter sensors. Sensor integration should be a matter of "plug-and-play" making sensors easier to add to a system. Sensors that implement new standards can help address this problem; for example, IEEE STD 1451.4 defines transducer electronic data sheet (TEDS) templates for commonly used sensors such as bridge elements and thermocouples. When a 1451.4 compliant smart sensor is connected to a system that can read the TEDS memory, all information needed to configure the data acquisition system can be uploaded. This reduces the amount of labor required and helps minimize configuration errors. 2.Intelligent sensors. Data received from a sensor be scaled, linearized; and converted to engineering units. Methods to reduce sensor processing overhead at the application node are needed. Smart sensors using low-cost microprocessors with integral data acquisition and communication support offer the means to add these capabilities. Once a processor is embedded, other features can be added; for example, intelligent sensors can make a health assessment to inform the data acquisition client when sensor performance is suspect. 3.Distributed sample synchronization. Networks of sensors require new ways for synchronizing samples. Standards that address the distributed timing problem (for example, IEEE STD 1588) provide the means to aggregate samples from many distributed smart sensors with sub-microsecond accuracy. 4. Reduction in interconnect. Alternative means are needed to reduce the frequent problems associated with cabling and connectors. Wireless technologies offer the promise of reducing interconnects and simultaneously making it easy to quickly add a sensor to a system.

Lansaw, John↗
DOE OSTI2023

S4PST: Sustainability for Programming Systems and Tools: May Workshop Report

The US Department of Energy (DOE) Exascale Computing Project (ECP) has fostered and strengthened the use of modern software engineering practices for developing applications and libraries, and this effort has resulted in the coordinated and interoperable E4S1 and xSDK2 ecosystems. Although this approach is cost-effective, it relies on robust programming systems and tools (PST) as the underlying foundation for our HPC software. At present, our primary PST stack consists of traditional high-performance computing (HPC) languages, namely Fortran, C, C++, and the popular Python language for data analysis and AI workflows. These languages support various programming frameworks and run-time abstractions that enable parallelism and concurrency across multiple node architectures and thousands of nodes through a variety of interconnect systems. However, to accommodate users’ diverse needs, certain aspects of the HPC ecosystem are delegated to vendor-specific or third-party implementations that extend beyond a particular scientific domain. This broader scope results in a multitude of specifications and variations, which leads to a complex orchestration of many-ecosystems. Unfortunately, this complexity in the ecosystem imposes additional overhead costs on consumers during the latter stages of the development cycle. In addition to the software ecosystem challenge, the upcoming conclusion of the ECP by December 2023 has raised significant concerns within the HPC programming systems community, from both the economic and social perspectives. The ECP has implemented a management structure for software development and funding decisions across all ECP participants by following a conventional hierarchical and centralized approach. However, this structure has prompted certain considerations within the community, particularly in anticipation of the Software Sustainability initiative by the DOE’s Advanced Scientific Computing Research Program (ASCR). For the success of this new initiative, it is of utmost importance to secure consistent funding and foster close engagement with researchers and core developers of existing programming-system products. This collaboration is vital to maintaining the critical capabilities of the current software during the transition phase while proactively adapting to future technology and workforce trends. The community recognizes the significance of adapting to emerging trends and is aware of the inherent fragility of the HPC software ecosystem, particularly in relation to programming systems that cater to all users. The ability to adapt and evolve is essential to staying relevant and effectively addressing these technical, economic, and social challenges. The S4PST team, which represents one of the six ASCR Software Sustainability seedling projects, is dedicated to tackling these challenges through community-based approaches that go beyond the scope of the DOE. This involves collaboration between national laboratories with academia, non-DOE institutions, hardware and system vendors, and international partners. By fostering these partnerships, we aim to create a robust and sustainable HPC software ecosystem that can effectively meet the needs of the community. This new community effort, driven by the eight DOE labs, will take on the responsibility of guiding funding decisions for programming-systems development and maintenance with transparency and consistency across all decisions. Additionally, the team will offer common technical services to the programming systems community, irrespective of their funding situations, and facilitate community-wide incubation to proactively nurture the software ecosystem. By actively engaging with stakeholders and employing a collaborative approach, we can collectively shape the future of programming systems and ensure a robust and thriving HPC software landscape. On May 11–12, 2023, the S4PST team conducted its inaugural kick-off workshop at the Innovative Computing Laboratory (ICL) in the University of Tennessee, Knoxville, hosted by Hartwig Anzt. The workshop encompassed various sessions dedicated to presentations and discussions, with the aim of comprehending the team members’ perspectives on the vision of software sustainability. Additionally, the workshop aimed to identify the technical, economic, and social requirements for sustaining the programming-systems community in the field of HPC. This report provides a summary of the S4PST effort by highlighting five major thrust areas discussed during the workshop: (i) community, (ii) technical support, (iii) training and diversity, (iv) verification, validation and correctness, and (v) emerging technologies. It also encompasses an overview of the presentations and discussions held throughout the event, our views and potential synergies with other seedling efforts, along with the outcomes and key takeaways from our initial discussions.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2021

Seamless Hybrid-integrated Interconnect NEtwork (SHINE)

Large-scale date centers are becoming increasingly limited by the capacity of interconnects due to the rapid increasing power consumption and bandwidth demands driven by the rigorous down scaling of CMOS critical dimensions in according with the Moore’s Law. As a result of the continuing bandwidth scaling, optical interconnects based on parallel optics, where data are simultaneously transmitted along more than one lane, have becoming a preferred interconnected solution over copper cables. To building an efficient optical interconnect system, optical coupling between different elements, such as optical fibers, photonics chips, is a critical step, which is challenging due to the mode mismatch of varies optical ports. In this project, we proposed and demonstrated an optical interfacing scheme, which provided a light coupling approach with low energy loss, broadband operation, high alignment tolerance and compatible with scalable fabrication and testing. Here, the mode transformation is achieved by a total internal reflection from a chip integrated microscale freefrom surface. Due to the enormous light wavefront manipulating ability associated with the gigantic design space, the freeform couplers platform is universally applicable to a wide range of optical coupling scenarios, such as the interfacing between a waveguide to a fiber, another waveguide, surface normal device, or free space.

42 ENGINEERING↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗