Thermal cycling of thin-film cadmium sulfide solar cells
Thermal cycling of thin-film cadmium sulfide solar cells
CADMIUM SULFIDE↗
SEARCH · Engineering Papers
Results for “thermal cycle”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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An extreme thermal cycling reliability test of ATLAS ITk Strips barrel modules
At the end of Run 3 of the Large Hadron Collider (LHC), the accelerator complex will be upgraded to the High-Luminosity LHC (HL-LHC) in order to increase the total amount of data provided to its experiments. To cope with the increased rates of data, radiation, and pileup, the ATLAS detector will undergo a substantial upgrade, including a replacement of the Inner Detector with a future Inner Tracker, called the ITk. The ITk will be composed of pixel and strip sub-detectors, where the strips portion will be composed of 17,888 silicon strip detector modules. During the HL-LHC running period, the ITk will be cooled and warmed a number of times from about -35°C to room temperature as part of the operational cycle, including warm-ups during yearly shutdowns. To ensure ITk Strips modules are functional after these expected temperature changes, and to ensure modules are mechanically robust, each module must undergo ten thermal cycles and pass a set of electrical and mechanical criteria before it is placed on a local support structure. This paper describes the thermal cycling Quality Control (QC) procedure, and results from the barrel pre-production phase (about 5% of the production volume). Additionally, in order to assess the headroom of the nominal QC procedure of 10 cycles and to ensure modules don't begin failing soon after, four representative ITk Strips barrel modules were thermally cycled 100 times — this study is also described.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Accelerated Thermal Cycling and Failure Mechanisms
This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.
BGA CSP CBGA thermal cycle solder joint reliabilit↗
Microstructural stability of irradiated yttrium hydride under thermal cycles
Hydrides that retain their hydrogen in service are critical for advanced microreactor and space nuclear systems. Hydrogen retention is affected by evolving microstructure under temperature and irradiation extremes. This study investigated microstructural features in neutron-irradiated yttrium hydride and the stability of these features under thermal cycles. Differential scanning calorimetry was used to determine hydrogen desorption and temperatures at which significant phase changes are occurring, and transmission electron microscopy was used for microstructural analysis after each thermal cycle. Cyclic heating led to crystallization and epitaxial growth of surface oxidation and dehydriding of the matrix. Other features such as the bulk matrix crystal structure, irradiation-induced cavities, and matrix precipitation remained constant after thermal cycling. Results allow us to design better hydride alloys through microstructure tailoring and potential irradiation conditioning treatments.
36 MATERIALS SCIENCE↗
Thermal Cycling and Isothermal Deformation Response of Polycrystalline NiTi: Simulations vs. Experiment
A recent microstructure-based FEM model that couples crystal-based plasticity, the B2<-> MB190 phase transformation and anisotropic elasticity at the grain scale is calibrated to recent data for polycrystalline NiTi (49.9 at.% Ni). Inputs include anisotropic elastic properties, texture and differential scanning calorimetry data, as well as a subset of recent isothermal deformation and load-biased thermal cycling data. The model is assessed against additional experimental data. Several experimental trends are captured - in particular, the transformation strain during thermal cycling monotonically increases and reaches a peak with increasing bias stress. This is achieved, in part, by modifying the martensite hardening matrix proposed by Patoor et al. [Patoor E, Eberhardt A, Berveiller M. J Phys IV 1996;6:277]. Some experimental trends are underestimated - in particular, the ratcheting of macrostrain during thermal cycling. This may reflect a model limitation that transformation-plasticity coupling is captured on a coarse (grain) scale but not on a fine (martensitic plate) scale.
Manchiraju, Sivom↗
Hubble Space Telescope solar cell module thermal cycle test
The Hubble Space Telescope (HST) solar array consists of two identical double roll-out wings designed after the Hughes flexible roll-up solar array (FRUSA) and was developed by the European Space Agency (ESA) to meet specified HST power output requirements at the end of 2 years, with a functional lifetime of 5 years. The requirement that the HST solar array remain functional both mechanically and electrically during its 5-year lifetime meant that the array must withstand 30,000 low Earth orbit (LEO) thermal cycles between approximately +100 and -100 C. In order to evaluate the ability of the array to meet this requirement, an accelerated thermal cycle test in vacuum was conducted at NASA's Marshall Space Flight Center (MSFC), using two 128-cell solar array modules which duplicated the flight HST solar array. Several other tests were performed on the modules. The thermal cycle test was interrupted after 2,577 cycles, and a 'cold-roll' test was performed on one of the modules in order to evaluate the ability of the flight array to survive an emergency deployment during the dark (cold) portion of an orbit. A posttest static shadow test was performed on one of the modules in order to analyze temperature gradients across the module. Finally, current in-flight electrical performance data from the actual HST flight solar array will be tested.
Douglas, Alexander↗
High Temperature W-band Complex Permittivity Measurements of Thermally Cycled Ceramic-Metal Composites: AlN:Mo with 0.25 vol% to 4.0 vol% Mo from 25 °C to 1000 °C in Air
An apparatus for measuring the W-band (75-110GHz) complex permittivity of dielectrics at 1000 °C was developed. This apparatus allows for measurements at approximately twice the temperature of previously published high temperature free-space measurement systems while maintaining similar precision. Challenges were addressed related to high temperature measurements, including temperature uniformity, the accuracy of temperature measurements, and preventing temperature related changes to mm-wave measurement systems. The details of complex permittivity extraction from the measured S-parameters are discussed. Sources of error related to permittivity measurement and mathematical models were identified and are discussed in detail herein. Thermally-cycled, mm-wave absorbing, aluminum nitride ceramic composites containing varying levels of molybdenum additives were measured over the range of 25-1000 °C. These measurements were compared to the same composites before thermal cycling. It was found that ceramic composites are largely stable after thermal cycling in terms of dielectric properties despite the presence of visible surface modifications.
Zane W Cohick↗
Effects of Thermal Cycling on Control and Irradiated EPC 2nd Generation GaN FETs
The power systems for use in NASA space missions must work reliably under harsh conditions including radiation, thermal cycling, and exposure to extreme temperatures. Gallium nitride semiconductors show great promise, but information pertaining to their performance is scarce. Gallium nitride N-channel enhancement-mode field effect transistors made by EPC Corporation in a 2nd generation of manufacturing were exposed to radiation followed by long-term thermal cycling in order to address their reliability for use in space missions. Results of the experimental work are presented and discussed.
field effect transistor↗
Impact of Total Ionizing Dose Radiation Testing and Long-Term Thermal Cycling on the Operation of CMF20120D Silicon Carbide Power MOSFET
Power systems designed for use in NASA space missions are required to work reliably under harsh conditions including radiation, thermal cycling, and extreme temperature exposures. Silicon carbide devices show great promise for use in future power electronics systems, but information pertaining to performance of the devices in the space environment is very scarce. A silicon carbide N-channel enhancement-mode power MOSFET called the CMF20120 is of interest for use in space environments. Samples of the device were exposed to radiation followed by long-term thermal cycling to address their reliability for use in space applications. The results of the experimental work are presentd and discussed.
thermal cycling tests↗
Effects of thermal cycling on magnetic properties of lunar analogs
An experimental study has been performed to determine whether stresses associated with thermal cycling cracks can affect the coercivity of remanence carried by iron in lunar samples. Initially, samples were cycled up to 100 times in a refrigerator over a period of about 30 min per cycle. In a second set of experiments, samples were dipped directly into liquid nitrogen up to 100 times at about 1 min per cycle. Comparison of AF demagnetization curves of weak field anhysteretic remanent magnetization before and after cycling revealed no systematic differences. Calculations based on a model of spherical iron grains within olivine or troilite indicate that it is unlikely that the iron will crack under thermal stress. Thus, thermal cycling does not appear to provide an explanation for increasing the stability of remanence in samples from the lunar surface.
Barron, A. M.↗
Effects of high temperature brazing and thermal cycling on mechanical properties of Hastelloy X.
Data are presented on the effects of brazing alloy, brazing operation, thermal cycling, and combinations of these on the yield strength, elongation, ultimate tensile strength, and fatigue life of thin gage Hastelloy X. These data show that brazing with a Ni-Pd-Au alloy at 1461 K resulted in reductions of 35 percent in yield strength and elongation, 6 percent in ultimate tensile strength, and 18 percent in fatigue limit of Hastelloy X, as compared with as-received material. Subsequent exposure to 200 thermal cycles between 533 K and 1144 K after brazing caused further losses of 4 percent in yield strength, 8 percent in ultimate tensile strength, and 6 percent in fatigue limit.
Dicus, D. L.↗
Thermal Cycling and High Temperature Reverse Bias Testing of Control and Irradiated Gallium Nitride Power Transistors
The power systems for use in NASA space missions must work reliably under harsh conditions including radiation, thermal cycling, and exposure to extreme temperatures. Gallium nitride semiconductors show great promise, but information pertaining to their performance is scarce. Gallium nitride N-channel enhancement-mode field effect transistors made by EPC Corporation in a 2nd generation of manufacturing were exposed to radiation followed by long-term thermal cycling and testing under high temperature reverse bias conditions in order to address their reliability for use in space missions. Result of the experimental work are presented and discussed.
thermal cycling tests↗
Quality concerns caused by quality control — deformation of silicon strip detector modules in thermal cycling tests
The ATLAS experiment at the Large Hadron Collider (LHC) is currently preparing to replace its present Inner Detector (ID) with the upgraded, all-silicon Inner Tracker (ITk) for its High-Luminosity upgrade (HL-LHC). The ITk will consist of a central pixel tracker and the outer strip tracker, consisting of about 19,000 strip detector modules. Each strip module is assembled from up to two sensors, and up to five flexes (depending on its geometry) in a series of gluing, wirebonding and quality control steps. During detector operation, modules will be cooled down to temperatures of about -35 °C (corresponding to the temperature of the support structures on which they will be mounted) after being initially assembled and stored at room temperature. In order to ensure compatibility with the detector's operating temperature range, modules are subjected to thermal cycling as part of their quality control process. Ten cycles between -35 °C and +40 °C are performed for each module, with full electrical characterisation tests at each high and low temperature point. As part of an investigation into the stress experienced by modules during cooling, it was observed that modules generally showed a change in module shape before and after thermal cycling. This paper presents a summary of the discovery and understanding of the observed changes, connecting them with excess module stress, as well as the resulting modifications to the module thermal cycling procedure.
47 OTHER INSTRUMENTATION↗
Finite Element Modeling of Thermal Cycling Induced Microcracking in Carbon/Epoxy Triaxial Braided Composites
The microcrack distribution and mass change in PR520/T700s and 3502/T700s carbon/epoxy braided composites exposed to thermal cycling was evaluated experimentally. Acoustic emission was utilized to record the crack initiation and propagation under cyclic thermal loading between -55 C and 120 C. Transverse microcrack morphology was investigated using X-ray Computed Tomography. Different performance of two kinds of composites was discovered and analyzed. Based on the observations of microcrack formation, a meso-mechanical finite element model was developed to obtain the resultant mechanical properties. The simulation results exhibited a decrease in strength and stiffness with increasing crack density. Strength and stiffness reduction versus crack densities in different orientations were compared. The changes of global mechanical behavior in both axial and transverse loading conditions were studied. Keywords: Thermal cycles; Microcrack; Finite Element Model; Braided Composite
Zhang, Chao↗
Effect of load voltage on thin film cuprous sulfide: Cadmium sulfide solar cells thermally cycled in a simulated space environment
Thin-film Cu2S-CdS solar cells, loaded at various fixed values of load resistance, were thermally cycled for 1429 cycles in a simulated space environment. Cell performance was measured under controlled conditions in air before and after thermal cycling. These data were used to determine the effect of load voltage on cell performance. The performance of the cells was relatively independent of load voltage up to about 0.39 volt. This appears to be a threshold voltage, beyond which there was a significant loss in cell performance. Fortunately, this threshold voltage appears to be sufficiently higher than the maximum power voltage of 0.33 volt so that it can be avoided in most applications.
Smithrick, J. J.↗
Solar panel thermal cycling testing by solar simulation and infrared radiation methods
For the solar panels of the European Space Agency (ESA) satellites OTS/MAROTS and ECS/MARECS the thermal cycling tests were performed by using solar simulation methods. The performance data of two different solar simulators used and the thermal test results are described. The solar simulation thermal cycling tests for the ECS/MARECS solar panels were carried out with the aid of a rotatable multipanel test rig by which simultaneous testing of three solar panels was possible. As an alternative thermal test method, the capability of an infrared radiation method was studied and infrared simulation tests for the ultralight panel and the INTELSAT 5 solar panels were performed. The setup and the characteristics of the infrared radiation unit using a quartz lamp array of approx. 15 sq and LN2-cooled shutter and the thermal test results are presented. The irradiation uniformity, the solar panel temperature distribution, temperature changing rates for both test methods are compared. Results indicate the infrared simulation is an effective solar panel thermal testing method.
Nuss, H. E.↗
Degradation of a two-layer thermal barrier coating under thermal cycling
A two-layer plasma-sprayed thermal barrier coating on a directionally solidified nickel-base eutectic alloy substrate was characterized prior to and after thermal cycling to 1095 C in an accelerated furnace test. The coating was comprised of an inner layer of Ni-16.4Cr-5.1Al-0.15Y (wt%) bond coat and an outer layer of ZrO2-7.9Y2O3 (wt%) thermal barrier. Characterization of the bond coat revealed that substantial amounts of yttrium and aluminum were oxidized during plasma-spraying in air. The oxidation of these elements reduced the protective capacity of the bond coat so that, on thermal exposure, severe degradation of the bond coat resulted and large amounts of nickel oxide formed. This nickel oxide was demonstrated to grow outward into the thermal barrier, which appears to have increased the stresses in the thermal barrier and contributed to its failure near the thermal barrier-bond coat interface.
Maier, R. D.↗
Thermal Cycling of Thin and Thick Ply Composites
An experimental study was conducted to determine the effects of ply thickness in composite laminates on thermally induced cracking and changes in the coefficient of thermal expansion (CTE). After a few thermal cycles, laminates with thick-plies cracked, resulting in large changes in CTE. CTE's of the thin-ply laminates were unaffected by microcracking during the first 500 thermal cycles, whereas, the CTE's of the thick-ply laminates changed significantly. After about 1500 cycles, microdamage had also reduced the CTE of the thin-ply laminates to a value of about half of their initial value.
Tompkins, Stephen S.↗