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At least 73 records · Page 4

Piezoelectric enhancement by surface effect in hydrofluorinated graphene bilayer

We investigated the piezoelectricity of dipolar hydrofluorinated graphene (C{sub 2}HF){sub n} multilayers with first-principles calculations. Our results reveal that the dipole moment decreases as the number of layers increases, because electron and hole carriers are induced at the top and bottom layers due to the depolarization field. These carriers make (C{sub 2}HF){sub n} multilayers more stable by decreasing the depolarization field in the material. Through the calculation of the average layer piezoelectric stress constant e{sub 31}/ℓ in ℓ-layer chair (C{sub 2}HF){sub n} multilayers, we confirmed that the piezoelectricity of the bilayer is about three times larger than that of the monolayer and bulk material. Moreover, we found that the electron and hole carriers on the top and bottom layers played a significant role in the piezoelectric enhancement of the bilayer.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Surface Effects on the Dynamic Behavior of Vortices in Type II Superconducting Strips with Periodic and Conformal Pinning Arrays

Using molecular dynamics techniques, we simulate the vortex behavior in a type II superconducting strip in the presence of triangular and two types of conformal pinning arrays, one with a pinning gradient perpendicular to the driving force (C1) and the other parallel (C2), at zero temperature. A transport force is applied in the infinite direction of the strip, and the magnetic field is increased until the rate between the density of vortices (n{sub v}) and pinning (n{sub p}) reaches n{sub v}/n{sub p} = 1.5. Our results show a monotonic increase, by steps, of the vortex density with the applied magnetic field. Besides, each pinning lattice presents a different vortex penetration delay. For the triangular pinning array, different than the case of infinite films, here the system exhibits only one pronounced depinning force peak at n{sub v}/n{sub p} = 1. However, the depinning force peak is present for only one value of field, in the range of fields where n{sub v}/n{sub p} = 1 is stable. For the case of conformal pinning arrays, in analogy to what is observed in infinite films, no commensurability depinning force peaks were found. In the present case, the C1 array is more efficient at low fields, all arrays are equivalent in the intermediate fields, and the C2 array is more efficient for high fields. We also show that for the C1 array at high fields, vortices depin following the conformal arches, from the edge to the center. For the C2 array, the depinning force is higher when compared to that of C1, because this particular conformal structure prevents the formation of easy vortex flow channels.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Novel and effective surface passivation for high efficiency n- and p-type Silicon solar cell

The project objective was to develop a novel Si surface passivation method using chalcogens, sulfur (S) and/or selenium (Se), as passivating elements, to withstand industry-standard high temperature contacting and metallization schemes for p-type Si based passivated emitter and rear contact (p-PERC) solar cells. The back surface passivation of PERC cells has been improved drastically with the invention and successful application of an Al 2 O 3 passivation layer. However, the front n + diffused junction surface is still poorly passivated by the standard amorphous silicon nitride (SiNx) anti-reflection coating (ARC) layer. This project sought to address the passivation challenges of both front n+ emitter and undiffused p-Si back surface. Improved p-PERC solar cell performance with open circuit voltage (V OC ) > 680 mV and efficiency of 22% were targeted to validate superior defect passivation properties as compared to standard SiO 2 / Al 2 O 3 passivation. During this project, we systematically investigated process-structure-properties-performance relationships of this novel advanced defect passivation approach. The S/Se passivation was carried out by reacting industrial Czochralski (Cz) Si wafers in H 2 S and H 2 Se gases in a chemical vapor deposition (CVD) reactor at temperatures up to 700°C. After an exhaustive optimization of the process parameters (temperature, time, and gas concentration), we established an optimized process and demonstrated extremely low surface recombination velocities (SRVs) of 1.5 cm/s and 8 cm/s on n-type and p-type Si, respectively, by S-passivation. In-depth surface and interface characterization were performed using soft x-ray and photoelectron spectroscopies (XPS, UPS, XES), combined with capacitance-voltage-frequency (C-V-f) measurements, to decipher the surface chemical/electronic structure and interface defect state densities. These measurements provided critical understanding of the defect passivation mechanism and elucidated the presence of surface S-Si bonds, a reduction of surface dipoles, and low interface state densities (D it ) < 10 11 cm -2 ev -1 . We also found that the Se-passivation is inferior to the S-passivation (by at least one order of magnitude in SRV). Application of the optimized S-passivation to the n+ diffused emitter surface led to a low surface recombination current density, J0 ≈ 40 fA/cm 2 (~ 1/4 of the industry-standard SiNx-passivation), and high implied V OC (686 mV) in p-PERC solar cell structures. The S-passivation process also was found to improve the bulk quality of the p-type Si, better than the SiO 2 or Al 2 O 3 passivation processes. After successful demonstration of efficient passivation of Si surface defects by S, we extensively studied the air, thermal, and illumination stability of the passivation structure. S-passivation itself degrades in air due to competing reactions with moisture and oxygen to form oxides, which can be eliminated by a SiNx capping layer (also acting as a anti-reflective coating). After SiNx process optimization, we demonstrated illumination and thermally stable S-passivation with SRV < 5 cm/s and J 0 < 80 fA/cm 2 . These enhancements in Si passivation, incorporated into p-PERC cells, achieved an efficiency of 19.93% with V OC = 649 mV, using manufacturing metallization and contacting schemes. The low cell performance (cell V OC is much less than the implied V OC = 686 mV, anticipated from surface passivation) was identified due to degradation of S-passivation during the metal firing step (out-diffusion of S from the Si interface to the SiNx surface). The S-passivation of Si surfaces shows significant promise with excellent passivation quality, essential for high performance (high V OC , high efficiency) solar cells. Integration of this innovative defect passivation into devices, however, demands further development of the capping layer, low temperature (<700°C) metallization process, and/or engineering of advanced device structures. Surface passivation-dominated advanced Si solar cells, such as tunnel oxide passivated contacts and Si heterojunctions, are increasingly of interest due to their high-performance potential and will have a growing photovoltaic market share in the near future.

14 SOLAR ENERGY↗