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At least 73 records · Page 4

Screen printable copper pastes for silicon solar cells

The current work demonstrates the successful metallization of a PERC silicon solar cell with screen-printable copper (Cu) paste that is sintered at elevated temperature in air atmosphere. The existing state of the art in Silicon (Si) solar cell metallization is silver (Ag) paste; Cu cost is 1/100th the cost of Ag and has a comparable conductivity. However, Cu undergoes rapid oxidation at elevated temperatures and the high diffusion of Cu into Si restricts its usage in the metallization of silicon solar cells. In this paper, a Cu paste containing a proprietary mixture of antioxidant additives and diffusion inhibitors was used to make front gridlines on PERC cells. The Cu-printed cells were fired in an IR belt furnace with a peak temperature of 576°C in air atmosphere. The solar cells discussed here reached an efficiency of 19%, which is 88% of the efficiency measured for a commercial Ag-printed cell. The working devices were further characterized using STEM, EDX, ToF-SIMS and long-term suns-V oc studies demonstrating an absence of Cu diffusion. Furthermore, thermally stressing the Cu-printed solar cells yielded a reduction of less than 1.9% of the initial pseudo fill factor (pFF) after 1000 hours at 200°C. Here, the shunt resistance of cells monitored over 3 years remained within 2.5% of its initial value, which demonstrates the effectiveness of the Cu diffusion barrier.

14 SOLAR ENERGY↗

The effect of processing and compositional changes on the tribology of PM212 in air

The effects of processing and compositional variations on the tribological performance of PM212 were studied. PM212 is a self lubricating powder metallurgy composite, comprised of a wear resistant metal bonded chromium carbide matrix, containing the solid lubricants barium fluoride/calcium fluoride eutectic and silver. Several composites were formulated which had lubricant, matrix, and processing variations. Processing variations included sintering and hot isostatic pressing. Pins fabricated from the composites were slid against superalloys disks in a pin-on-disk tribometer to study the tribological properties. Several composites exhibited low friction and wear in sliding against a nickel based superalloy. The tribological performance by several different composites showed that the composition of PM212 can be altered without dramatically affecting performance.

Bogdanski, Michael S.↗

Effects of process variables on the properties of YBa2Cu3O(7-x) ceramics formed by investment casting

An investment casting process has been developed to produce net-shape, superconducting ceramics. In this work, a factorial experiment was performed to determine the critical process parameters for producing cast YBa2Cu3O7 ceramics with optimum properties. An analysis of variance procedure indicated that the key variables in casting superconductive ceramics are the particle size distribution and sintering temperature. Additionally, the interactions between the sintering temperature and the other process parameters (e.g., particle size distribution and the use of silver dopants) were also found to influence the density, porosity, and critical current density of the fired ceramics.

Hooker, M. W.↗

Influence of elevated temperature and oxygen on the capture of radioactive iodine by silver functionalized silica aerogel

Reprocessing is considered a competent strategy for spent nuclear fuel management, yet radioiodine ( 129 I) is emitted in reprocessing off-gas as a hazardous byproduct. Silver functionalized silica aerogel (Ag 0 -aerogel), a promising iodine capture material, experiences a reduction in its capacity after prolonged exposure to off-gas components at elevated temperatures, a phenomenon termed as aging. To fully understand this process, we isolated the contribution of each aging factor, exposing Ag 0 -aerogel samples to N 2 and dry air gas streams, respectively, at 150 °C for different time periods. Aged samples were loaded with I 2 to examine the capacity change and comprehensively characterized to investigate the evolution of their properties. Results show that temperature alone did not alter Ag 0 -aerogel's capacity but triggered Ag 0 nanoparticles sintering and generated organic sulfur species. The presence of O 2 reduced the capacity by ~20 %, causing (i) formation of silver sulfide (Ag 2 S) crystals and (ii) oxidation of Ag-thiolate (Ag-S-r) to Ag sulfonate (Ag-SO 3 -r). Given that Ag 2 S readily adsorbs I 2 , the formation of Ag-SO 3 -r is the major inhibitor for iodine adsorption. This hypothesis was supported by density functional theory (DFT) simulations. These findings unraveled key mechanisms of Ag 0 -aerogel aging, which are useful in the development of materials that withstand realistic spent-nuclear-fuel-reprocessing off-gas conditions.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Heat-sterilized silver oxide-zinc cells: Cycle life studies

A JPL study was conducted to evaluate the cell design parameters that contribute to the cycle life of sealed, heat-sterilized silver oxide-zinc cells. Test cells having a rated capacity of 4.2 A-h were fabricated using zinc oxide electrodes prepared by the sintered Teflon process. Two separator variations were evaluated, one having acrylic acid and the other methacrylic acid grafted to irradiated polyethylene film. Significant results of this study include the following: (1) cycle life in excess of 300 cycles was attained; (2) a zinc oxide/silver stoichiometric ratio of 1.5 resulted in greater cycle life than a ratio of 1.1, and similar cycle life to cells having a ratio of 2; (3) cells having methacrylic acid grafted separators suffered somewhat less in capacity loss due to zinc electrode shape change than cells having acrylic acid type; (4) use of acrylic acid grafted separators was slightly superior to the methacrylic acid type in respect to silver penetration; and (5) the inclusion of a layer of potassium titanate paper adjacent to the zinc electrodes resulted in cells that achieved higher cycle life before any of the group failed than that reached by cells of any other construction.

Arms, J. T.↗

MS212--A Homogeneous Sputtered Solid Lubricant Coating for Use to 800 C

Composite coatings containing chromium carbide, stable fluorides and silver were prepared by magnetron sputtering. The microstructure of the coatings is very homogeneous compared to that of plasma sprayed and sintered versions of the same chemical composition. Friction and wear of MS212-coated and baseline uncoated aluminum and Inconel X-750 are compared. At room temperature, the friction and wear of coated aluminum is dramatically better compared to the baseline. The acceptable load is limited by deformation of the soft aluminum substrate. In the case of the nickel alloy, lower friction is observed for the coated alloy at all temperatures up to the maximum test temperature of 800 C. Pin wear factors for sliding against the coated alloy are lower than the baseline at room temperature and 350 C, and comparable to baseline wear at higher test temperatures. Low baseline wear at high temperatures is due to the lubricious nature of the natural oxides formed on nickel-chromium alloys in a hot, oxidizing atmosphere. No load limit was found for coated Inconel X-750 at loads up to five times the load limit for coated aluminum.

Sliney, Harold E.↗

Screenable all-metal solar cell electrodes of nickel and copper

Screenable thick film solar cell electrodes are made using the all-metal electrode system, which eliminates the commonly used glass frit and substitutes an oxide scavenger such as silver fluoride. The low temperature firing copper metal systems give good results on solar cells obtaining cell efficiencies of 13% AM1, and adhering sintered structures are demonstrated with nickel systems. The potential effect of copper upon cell performance at elevated temperatures over long periods of time is determined, and it is found that the formation of a copper-silicon eutectic at 550 C produces needle-like structures with broad bases on the silicon, extending into and occasionally through the metallization layer.

Ross, B.↗

Tribological properties of PM212: A high-temperature, self-lubricating, powder metallurgy composite

This paper describes a research program to develop and evaluate a new high temperature, self-lubricating powder metallurgy composite, PM212. PM212 has the same composition as the plasma-sprayed coating, PS212, which contains 70 wt percent metal-bonded chromium carbide, 15 wt percent silver and 15 wt percent barium fluoride/calcium fluoride eutectic. The carbide acts as a wear resistant matrix and the silver and fluorides act as low and high temperature lubricants, respectively. The material is prepared by sequential cold press, cold isostatic pressing and sintering techniques. In this study, hemispherically tipped wear pins of PM212 were prepared and slid against superalloy disks at temperatures from 25 to 850 C in air in a pin-on-disk tribometer. Friction coefficients range from 0.29 to 0.38 and the wear of both the composite pins and superalloy disks was moderate to low in the 10(exp -5) to 10(exp -6) cubic mm/N-m range. Preliminary tests indicate that the material has a compressive strength of at least 130 MPa over the entire temperature range of 25 to 900 C. This material has promise for use as seal inserts, bushings, small inside diameter parts and other applications where plasma-sprayed coatings are impractical or too costly.

Dellacorte, Christopher↗

Tribological properties of PM212 - A high temperature, self-lubricating, powder metallurgy composite

This paper describes a research program to develop and evaluate a new high temperature, self-lubricating powder metallurgy composite, PM212. PM212 has the same composition as the plasma-sprayed coating, PS212, which contains 70 wt percent metal-bonded chromium carbide, 15 wt percent silver and 15 wt percent barium fluoride/calcium fluoride eutectic. The carbide acts as a wear resistant matrix and the silver and fluorides act as low and high temperature lubricants, respectively. The material is prepared by sequential cold press, cold isostatic pressing and sintering techniques. In this study, hemispherically tipped wear pins of PM212 were prepared and slid against superalloy disks at temperatures from 25 to 850 C in air in a pin-on-disk tribometer. Friction coefficients range from 0.29 to 0.38 and the wear of both the composite pins and superalloy disks was moderate to low in the 10(exp -5) to 10(exp -6) cubic mm/N-m range. Preliminary tests indicate that the material has a compressive strength of at least 130 MPa over the entire temperature range of 25 to 900 C. This material has promise for use as seal inserts, bushings, small inside diameter parts and other applications where plasma-sprayed coatings are impractical or too costly.

Dellacorte, Christopher↗

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗

Development of economical improved thick film solar cell contact

Materials were surveyed to provide candidates for an all metal electrode paste system. These consisted of a major constituent metal powder, a low melting metal powder suitable for a liquid phase sintering medium, and a powder material suitable as an etchant for silicon dioxide at sintering temperatures. By means of thermal gravimetric analysis a suitable binder was identified for low temperature fired inks. The all metal ink concept was first demonstrated with the silver system to avoid the problems of limited process windows encountered with base metal systems. A number of solid materials capable of selectively etching silicon dioxide at modest temperatures were identified. A paste with silver fluoride was screened onto N-type silicon with 5 ohm cm resistivity. The resulting contact pads had excellent adhesion but were not electrically ohmic. Metallurgically, these contacts have equal or better grain structure as commercial inks fired at the same temperatures.

Ross, B.↗

Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components

The successful adoption of additive manufacturing for the rapid prototyping of direct-write printed electronics requires the establishment of quantifiable metrics that can interrogate device performance. One measure of performance is the adhesion strength between the substrate and printed film interface, which is critical since the strength of this interface can dictate the accuracy and reliability of the printed device. In this work, a non-contact laser-induced spallation technique was used to quantify the adhesion of silver printed films on aluminum alloy substrates. The laser-based method was compared to a standardized pull-off adhesion test, which provided baseline measurements of adhesion strength. The sintering conditions were shown to play an important role in the film-substrate adhesion strength, as well as the cohesion and ductility of the film itself. The methods and results described in this work support the establishment of process control steps that are necessary for quickly verifying the reliability of printed devices prior to their deployment in critical experiments.

Adhesion test↗

Development of Quality Control Methods for Robust and Reliable Sensor Design

The successful adoption of additive manufacturing for the rapid prototyping of printed sensors requires the establishment of quantifiable metrics that can interrogate device performance. One measure of performance is the adhesion strength between the substrate and sensor interface, which is critical since the strength of this interface can dictate the accuracy and reliability of the printed sensor. In this work, a non-contact laser-induced spallation technique was used to quantify the adhesion of silver prints on an aluminum alloy substrate. The laser-based method was compared to a standardized pull-off adhesion test, which provided baseline measurements of adhesion strength. The sintering conditions were shown to play an important role in the film-substrate adhesion strength, as well as the cohesion and ductility of the film itself. The methods and results described in this work supports the establishment of process control steps that are necessary for verifying the reliability of printed devices prior to its deployment in critical experiments.

36 MATERIALS SCIENCE↗

Nanohybrid of Cu2O-Ti3C2Tx as a Silver-Free MXene Sorbent for Iodine Gas Capture from Nuclear Waste

The capture of volatile radioiodine from nuclear fuel reprocessing off-gas streams remains a critical challenge due to the high volatility, long half-life of 129I, and biological uptake of iodide from the environment. Although silver-based sorbents provide strong iodine chemisorption, their high cost and regulatory classification as mixed radioactive-hazardous waste motivate the development of alternative materials. Here, we report a silver-free Cu2O-Ti3C2Tx MXene hybrid for iodine gas capture at 150 °C. Structural and compositional analyses confirm the formation of Cu2O nanoparticles on Ti3C2Tx nanosheets and their subsequent conversion to thermodynamically stable CuI upon static iodine gas exposure, achieving an iodine mass loading of up to 1115 mg/g. These results demonstrate the potential of Cu2O-Ti3C2Tx MXene as a copper-based alternative to silver sorbents for elevated-temperature iodine gas capture.

iodine gas capture↗

Low resistance silver contacts to indium phosphide - Electrical and metallurgical considerations

The electrical and metallurgical behavior of the Ag-InP contact system has been investigated. Specific contact resistivity (Rc) values in the low 10 exp -6 Ohm sq cm range are readily achieved on n-InP (Si: 1.7 x 10 exp 18/cu cm) after sintering at 400 C for several minutes. The low Rc values, however, are shown to be accompanied by dissolution of InP into the metallization, resulting in device degradation. An analysis of the sinter-induced metallurgical interactions shows this system to be similar to the well-characterized Au-InP system, albeit with fundamental differences. The similarities include the dissociative diffusion of In, the reaction-suppressing effect of SiO2 capping, and especially, the formation of a phosphide layer at the metal-InP interface. The low post-sinter Rc values in the Ag-InP system may be due to the presence of a AgP2 layer at the metal-InP interface; low values of Rc can be achieved without incurring device degrading metallurgical interactions by introducing a thin AgP2 layer between the InP and the current carrying metallization.

Weizer, Victor G.↗

Atmospheric Pressure Plasma Jet as a Dry Alternative to Inkjet Printing in Flexible Electronics

We have developed an atmospheric pressure plasma jet printing system that works at room temperature to 50 deg C unlike conventional aerosol assisted techniques which require a high temperature sintering step to obtain desired thin films. Multiple jets can be configured to increase throughput or to deposit multiple materials, and the jet(s) can be moved across large areas using a x-y stage. The plasma jet has been used to deposit carbon nanotubes, graphene, silver nanowires, copper nanoparticles and other materials on substrates such as paper, cotton, plastic and thin metal foils.

Printable electronics↗

Aerosol jet printed 3 omega sensors for thermal conductivity measurement

The 3 omega (3ω) method is a trusted technique for measuring thermal conductivity—a fundamental material property of critical importance in a broad range of applications. However, traditional 3ω sensor processing requires some form of physical vapor deposition, such as metal evaporation or sputtering. These 3ω sensor deposition techniques limit the materials and sample sizes applicable to the 3ω method. This work demonstrates an aerosol jet printing method to directly print silver 3ω sensors that yield accurate temperature-dependent measurement up to 300 °C on materials with thermal conductivity ranging from 1 to 150 W/m K. The interrelationship between printed sensor geometry, sensor thermal stability, and applicability to the 3ω method is examined. Thermal conductivity measurement with 3ω sensors conventionally sintered at 300 °C agrees to independent laser flash measurement within 4% from room temperature to 150 °C. An unconventional rapid high-temperature sintering method is shown to produce sensors that agree within 3% of the laser flash measurements from room temperature to 300 °C. The rapid sintering profiles also reduced the sensor–substrate thermal boundary resistance of the printed sensors by as much as 88%. The direct printing of 3ω sensors creates opportunities for measurement of thermal transport properties in applications previously inapplicable to the 3ω method.

47 OTHER INSTRUMENTATION↗

Improvement of screen-printable metallization paste for low-cost silicon solar cells utilizing silver coated copper powders

This aims of this project were to develop low-cost screen-printable Ag|Cu metallization, as alternative to Ag paste, for contacting PERC solar cells with transparent emitter for high performance and reliability. The intended goal was to achieve 81% fill factor with a screen-printable Ag|Cu paste alternative. This was attempted through a three strand approach including Ag|Cu formulation by SVMT, production using cavitation technology by ACI and contact formation through the understanding of (i) the liquid phase sintering of the nano/macro particles of Ag|Cu to achieve bulk metal with very low series resistance, (ii) optimization of contact firing to avoid penetration of Cu into the silicon bulk, and finally (iii) proper analysis to quantify the contributions of each resistance component and keep the total series resistance at 0.2 Ω-cm2, which would result in high fill factor of 81% by UNC Charlotte. The objectives also involved i) the implementation of glass frit with Cu metal that will etch through the ARC for low contact resistance and adhesion, ii) development of Ag|Cu pastes with the optimized glass frit, iii) investigation of the impact of Cu particle size, morphology and loading on the gridline resistance, iv) narrow gridline screen designs along with narrow gridline prints, v) development of fast belt speeds of up to 375 inches per minute (ipm) sintering, and vi) stability study on Ag|Cu contact to high performance and reliability.

14 SOLAR ENERGY↗