Marshall Space Flight Center microelectronics program
Marshall Space Flight Center microelectronics program implementation, hardware development, and research and development
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Marshall Space Flight Center microelectronics program implementation, hardware development, and research and development
Metallurgical methods for detection and analysis of failure mechanisms in microelectronic devices
Microelectronic analog data and digital command control system for transonic dynamic wind tunnel tests of research aircraft models
Fast scan infrared microscope for measuring thermal and electromechanical parameters affecting reliability of microelectronic devices
Fabrication, packaging, and testing of microelectronic equipment for Applications Technology Satellite /ATS/ scientific experimental package
Microelectronics for air bearing gyro and accelerometer servo loops
Hybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
Ninety-eight-channel microelectronic PCM MULTIPLEXER-ENCODER design and development qualified to Apollo spacecraft environments
NASA program for microelectronic circuit and space vehicle reliability
IR techniques for reliability enhancement of microelectronics
Implant telemetry techniques and associated problems and potential of microelectronics
The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
Advances in microelectronics technologies over the past several decades have truely revolutionized modern society in almost every aspect of human endeavor.
Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies.
Describes the New Millenium Program, including the scope of the Microelectronics Systems IPDT as well as its current membership. Also summarizes the results of the IPDT technology roadmapping process. They describe the technologies selected as well as the avionics architecture chosen for validation of the first NMP spacecraft, to be launched inJauary 1998.
Material degradation during the fabrication of microelectronic devices has plagued the space industry for many years owing to the layering of many dissimilar metals to create these devices. Often, commonly used materials and systems are overlooked as potential sources of material degradation. This technical bulletin highlights extensive research to isolate probable causes of this degradation.
Securing defense-critical supply chains, built on resilient and sustainable microelectronics fabrication and deployment, is a national imperative and one that requires an investment in basic and applied research, development, and deployment into industries in (and out of) the Defense Industrial Base (DIB). Critical next steps include the development of pilots for revolutionary concepts in a new formal verification model and the Cyber-Physical Passport (CPP) concept for chain of custody. Critical infrastructure leadership should take action with a sense of urgency. Working in conjunction with the Under Secretary for Acquisition and Sustainment, the Assistant Secretary of Defense for Research and Engineering should establish pilot programs with the Defense Advanced Research Projects Agency and the service labs to build and test both concepts in legacy and new system development.. Additionally, the Pentagon may be aware that an existing Manufacturing Innovation Institute is piloting, with the semiconductor industry, cyber innovations to provide verifiable security properties and guarantees of physical functions to build a more cyber secure, resilient and efficient micro-electronics supply chain.
Unstructured meshes allow irregular or complex geometries to be modeled precisely in Monte Carlo radiation transport codes. Through this capability, it is possible to share an unstructured mesh model between multiple codes that use unstructured mesh geometry and thus improving coupled multi-physics simulations. In this work, unstructured meshes are used to model energy deposition from heavy ion strikes for single event effects on microelectronic devices as well as neutron flux mapping of nuclear reactor configurations. In each case, MCNP6.2's unstructured mesh functionality and applicability to the problem is demonstrated and analyzed. (authors)