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Efficient parallel processing used to implement complex decoders. Hypercube multiprocessor connection scheme practical to decode long convolutional codes with efficient use of hardware. Hypercube design reduces both communication time among processors and space needed for interconnection. Decoding concept applicable to concurrent processing of digital signals using convolutional codes for error correction.
Plasma-enhanced chemical vapor deposition (PECVD) and high-throughput manufacturing techniques for integrating single, aligned carbon nanotubes (CNTs) into novel 3D nanoscale architectures have been developed. First, the PECVD growth technique ensures excellent alignment of the tubes, since the tubes align in the direction of the electric field in the plasma as they are growing. Second, the tubes generated with this technique are all metallic, so their chirality is predetermined, which is important for electronic applications. Third, a wafer-scale manufacturing process was developed that is high-throughput and low-cost, and yet enables the integration of just single, aligned tubes with nanoscale 3D architectures with unprecedented placement accuracy and does not rely on e-beam lithography. Such techniques should lend themselves to the integration of PECVD grown tubes for applications ranging from interconnects, nanoelectromechanical systems (NEMS), sensors, bioprobes, or other 3D electronic devices. Chemically amplified polyhydroxystyrene-resin-based deep UV resists were used in conjunction with excimer laser-based (lambda = 248 nm) step-and-repeat lithography to form Ni catalyst dots = 300 nm in diameter that nucleated single, vertically aligned tubes with high yield using dc PECVD growth. This is the first time such chemically amplified resists have been used, resulting in the nucleation of single, vertically aligned tubes. In addition, novel 3D nanoscale architectures have been created using topdown techniques that integrate single, vertically aligned tubes. These were enabled by implementing techniques that use deep-UV chemically amplified resists for small-feature-size resolution; optical lithography units that allow unprecedented control over layer-to-layer registration; and ICP (inductively coupled plasma) etching techniques that result in near-vertical, high-aspect-ratio, 3D nanoscale architectures, in conjunction with the use of materials that are structurally and chemically compatible with the high-temperature synthesis of the PECVD-grown tubes. The techniques offer a wafer-scale process solution for integrating single PECVD-grown nanotubes into novel architectures that should accelerate their integration in 3D electronics in general. NASA can directly benefit from this technology for its extreme-environment planetary missions. Current Si transistors are inherently more susceptible to high radiation, and do not tolerate extremes in temperature. These novel 3D nanoscale architectures can form the basis for NEMS switches that are inherently less susceptible to radiation or to thermal extremes.
We have developed manufacturable approaches to form single, vertically aligned carbon nanotubes, where the tubes are centered precisely, and placed within a few hundred nm of 1-1.5 micron deep trenches. These wafer-scale approaches were enabled by chemically amplified resists and inductively coupled Cryo-etchers for forming the 3D nanoscale architectures. The tube growth was performed using dc plasma-enhanced chemical vapor deposition (PECVD), and the materials used for the pre-fabricated 3D architectures were chemically and structurally compatible with the high temperature (700 C) PECVD synthesis of our tubes, in an ammonia and acetylene ambient. Tube characteristics were also engineered to some extent, by adjusting growth parameters, such as Ni catalyst thickness, pressure and plasma power during growth. Such scalable, high throughput top-down fabrication techniques, combined with bottom-up tube synthesis, should accelerate the development of PECVD tubes for applications such as interconnects, nano-electromechanical (NEMS), sensors or 3D electronics in general.
Aerosol Jet Printing (AJP) and other additive electronics technologies will enable new detector assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument and electronics concepts by reducing trace widths down to 10 microns, printing on complex geometries, and allowing new concept production. This poster summarizes development efforts of printed interconnects for space applications.
The deep underground neutrino experiment (DUNE) is a next-generation neutrino experiment that will probe the properties of these elusive particles with unparalleled precision. It will also act as an observatory for neutrino bursts caused by nearby supernovae, in the event that one occurs, while the experiment is in operation. Given these goals, the DUNE trigger and DAQ system must be able to maintain extremely high uptime and provide a path for full readout of the detectors for very long times (up to 100 s). To achieve these ends, we have designed the DUNE DAQ system around a flexible “application framework,” which provides a modular interface for specific tasks while handling the interconnections between them. The application framework collects modules into applications, which can then be interacted with as units by the control, configuration, and monitoring systems. One of the key features of the framework is its communication abstraction layer, which allows for modules to interact with both internal queues and external network connections with a single transport-agnostic interface. We will report on the architecture and features of the framework.
The Deep Underground Neutrino Experiment (DUNE) is a next-generation neutrino experiment that will probe the properties of these elusive particles with unparalleled precision. It will also act as an observatory for neutrino bursts caused by nearby supernovae, in the event that one occurs while the experiment is in operation. Given these goals, the DUNE trigger and DAQ system must be able to maintain extremely high uptime and provide a path for full readout of the detectors for very long times (up to 100s). To achieve these ends, we have designed the DUNE DAQ system around a flexible “application framework”, which provides a modular interface for specific tasks while handling the interconnections between them. The application framework collects modules into applications which can then be interacted with as units by the control, configuration and monitoring systems. One of the key features of the framework is its communications abstraction layer, which allows for modules to interact with both internal queues and external network connections with a single transport-agnostic interface. We will report on the architecture and features of the framework.
Processor arrays can provide an attractive architecture for some applications. Featuring modularity, regular interconnection and high parallelism, such arrays are well-suited for VLSI/WSI implementations, and applications with high computational requirements, such as real-time signal processing. Preserving the integrity of results can be of paramount importance for certain applications. In these cases, fault tolerance should be used to ensure reliable delivery of a system's service. One aspect of fault tolerance is the detection of errors caused by faults. Concurrent error detection (CED) techniques offer the advantage that transient and intermittent faults may be detected with greater probability than with off-line diagnostic tests. Applying time-redundant CED techniques can reduce hardware redundancy costs. However, most time-redundant CED techniques degrade a system's performance.
An expandable stochastic digital architecture for recurrent (Hopfield like) neural networks is proposed. The main features and basic principles of stochastic processing are presented. The stochastic digital architecture is based on a chip with n full interconnected neurons with a pipeline, bit processing structure. For large applications, a flexible way to interconnect many such chips is provided.
Electric transmission system operators (ISOs, RTOs, or utilities) require new large generators seeking to connect to the grid to undergo a series of impact studies before they can be built. This process establishes what new transmission equipment or upgrades may be needed before a project can connect to the system and assigns the costs of that equipment. Berkeley Lab has collected interconnection cost data from interconnection studies for the Midcontinent Independent System Operator (MISO), representing nearly 50% of all projects requesting interconnection from 2010 to 2020. Project-level cost summary data are available for download on this page. We find: -Average interconnection costs have grown as the number of interconnection requests have escalated -Projects that have completed all required interconnection studies have the lowest cost compared to applicants still actively working through the interconnection process or those that have withdrawn. -Broader network upgrade costs are the primary driver of recent cost increase. -Potential interconnection costs for wind, storage, and solar are larger than for natural gas -Larger generators have greater interconnection costs in absolute terms, but economies of scale exist on a per kW basis. -Interconnection costs vary by location Berkeley Lab will publish a series of short analytical papers of generator interconnection costs to the transmission system for MISO, PJM, SPP, ISO-NE and NYISO, which you can find at https://emp.lbl.gov/interconnection_costs.
Electric transmission system operators (ISOs, RTOs, or utilities) require new large generators seeking to connect to the grid to undergo a series of impact studies before they can be built. This process establishes what new transmission equipment or upgrades may be needed before a project can connect to the system and assigns the costs of that equipment. Berkeley Lab has collected interconnection cost data from interconnection studies for the PJM Territory, representing nearly 86% of all new unique generators requesting interconnection from 2000 to 2022. Project-level cost summary data are available for download on this page. We find: -Average interconnection costs have grown as the number of interconnection requests have escalated -Projects that have completed all required interconnection studies have the lowest cost compared to applicants still actively working through the interconnection process or those that have withdrawn. -Broader network upgrade costs are the primary driver of recent cost increase. -Potential interconnection costs for wind, storage, and solar are larger than for natural gas -Larger generators have greater interconnection costs in absolute terms, but economies of scale exist on a per kW basis. -Interconnection costs vary by location Berkeley Lab will publish a series of short analytical papers of generator interconnection costs to the transmission system for MISO, PJM, SPP, ISO-NE and NYISO, which you can find at https://emp.lbl.gov/interconnection_costs.
This paper introduces new applications and design trade-offs anticipated for free-space optical interconnections of VLSI chips. New implementation s of VLSI functions are described that use the capability of making optical inputs at any point on a chip and take advantage of greater flexibility in on-chip signal routing. These include n-port addressable memories, CPU clock phase distribution, hardware multipliers, and dynamic memory refresh, as well as enhanced testability. Fault tolerance and production yields may be improved by reprogramming the optical imaging system to circumvent defective elements. These attributes, as well as those related to performance alone, will affect the design methodology of future VLSI ICs. This paper focuses on identifying the design issues, their possible solutions, and their impact on VLSI design techniques and, finally, presents some preliminary measurements on various system components.
Of the three primary sources of spatially contiguous precipitation observations (surface networks, ground-based radar, and satellite-based radar/radiometers), only the last is a viable source over ocean and much of the Earth's land. As recently as 15 years ago, users needing quantitative detail of precipitation on anything under a monthly time scale relied upon products derived from geostationary satellite thermal infrared (IR) indices. The Special Sensor Microwave Imager (SSMI) passive microwave (PMW) imagers originated in 1987 and continue today with the SSMI sounder (SSMIS) sensor. The fortunate longevity of the joint National Aeronautics and Space Administration (NASA) and Japan Aerospace Exploration Agency (JAXA) Tropical Rainfall Measuring Mission (TRMM) is providing the environmental science community a nearly unbroken data record (as of April 2012, over 14 years) of tropical and sub-tropical precipitation processes. TRMM was originally conceived in the mid-1980s as a climate mission with relatively modest goals, including monthly averaged precipitation. TRMM data were quickly exploited for model data assimilation and, beginning in 1999 with the availability of near real time data, for tropical cyclone warnings. To overcome the intermittently spaced revisit from these and other low Earth-orbiting satellites, many methods to merge PMW-based precipitation data and geostationary satellite observations have been developed, such as the TRMM Multisatellite Precipitation Product and the Climate Prediction Center (CPC) morphing method (CMORPH. The purpose of this article is not to provide a survey or assessment of these and other satellite-based precipitation datasets, which are well summarized in several recent articles. Rather, the intent is to demonstrate how the availability and continuity of satellite-based precipitation data records is transforming the ways that scientific and societal issues related to precipitation are addressed, in ways that would not be otherwise possible. These developments have taken place in parallel with the growth of an increasingly interconnected scientific environment. Scientists from different disciplines can easily interact with each other via information and materials they encounter online, and collaborate remotely without ever meeting each other in person. Likewise, these precipitation datasets are quickly and easily available via various data portals and are widely used. Within the framework of the NASA/JAXA Global Precipitation Measurement (GPM mission, these applications will become increasingly interconnected. We emphasize that precipitation observations by themselves provide an incomplete picture of the state of the atmosphere. For example, it is unlikely that a richer understanding of the global water cycle will be possible by standalone missions and algorithms, but must also involve some component of data, where model analyses of the physical state are constrained alongside multiple observations (e.g., precipitation, evaporation, radiation). The next section provides examples extracted from the many applications that use various high-resolution precipitation products. The final section summarizes the future system for global precipitation processing.
As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.
The definition of some modern high demanding space systems requires a different approach to system definition and design from that adopted for traditional missions. System functionality is strongly coupled to the operational analysis, aimed at characterizing the dynamic interactions of the flight element with its surrounding environment and its ground control segment. Unambiguous functional, operational and performance requirements are to be defined for the system, thus improving also the successive development stages. This paper proposes a Petri Nets based methodology and two related prototype applications (to ARISTOTELES orbit control and to Hermes telemetry generation) for the operational analysis of space systems through the dynamic modeling of their functions and a related computer aided environment (ISIDE) able to make the dynamic model work, thus enabling an early validation of the system functional representation, and to provide a structured system requirements data base, which is the shared knowledge base interconnecting static and dynamic applications, fully traceable with the models and interfaceable with the external world.
It is demonstrated that use of the square root information filter (SRIF) can reduce the storage and computation required for estimation of certain classes of large-scale interconnected systems. The SRIF uses an information array that is related to the Kalman filter covariance and estimate. The SRIF algorithm, which is optimal, is a direct application of matrix partitioning to some optimal filtering algorithms described in the literature. The SRIF algorithm is able to reduce the storage requirements of a 40-subsystem 10-state problem by a full order of magnitude.
We believe that the next evolutionary step in supporting wide-area application and services delivery to customers is a network framework that provides for collocation of applications and services at distinct sites in the network, an interconnection between these sites that is performance optimized for these applications, and value-added services for applications. We use the term IsoWAN to describe an advanced, isolated network interconnect services framework that will enable applications to be more secure, and able to access and be in use in both local and remote environments. The main functions of an IsoWAN are virtual localization of application services, an application service interface, coordinated delivery of applications and associated data to the customer, and supporting collaborative application development for customers. An initial pilot network between three NASA Centers: Ames Research Center, the Jet Propulsion Laboratory, and Marshall Space Flight Center, has been built and its properties will be discussed.
The monolithic, tunnel-junction-interconnected tandem combination of a GaInP2 top cell and a GaAs bottom cell has achieved a one-sun, AM1.5 efficiency of 27.3 percent. With proper design of the top cell, air mass zero (AM0) efficiencies greater than 25 percent are possible. A description and the advantages of this device for space applications are presented and discussed. The advantages include high-voltage, low-current, two-terminal operation for simple panel fabrication, and high conversion efficiency with low-temperature coefficient. Also, because the active regions of the device are Al-free, the growth of high efficiency devices is not affected by trace levels of O2 or H2O in the MOCVD growth system.
Porous materials have attracted considerable attention due to their versatile applications, especially in water purification. Interconnected nanoporous structures are distinguished by their high degree of porosity and resistance to clogging, as well as their insensitivity to nanostructural orientation. Previous works on randomly linked copolymer systems have shown that they can effectively produce disordered cocontinuous nanostructures, which upon removal of one component yield interconnected nanoporous materials. However, the cocontinuous nanomaterials previously developed using polystyrene (PS) and poly(d,l-lactic acid) (PLA) strands, and the resulting interconnected nanoporous PS monoliths, were far too brittle to enable practical use as membranes. Here, we study the self-assembly of randomly linked copolymer networks prepared using blocks of the engineering polymer polysulfone (PSU). A wide cocontinuous regime (spanning 40 wt %) was found for randomly end-linked copolymer networks (RECNs) constructed from PSU and PLA strands, via a combination of mechanical testing, gravimetry, small-angle X-ray scattering, and scanning electron microscopy. The PSU/PLA cocontinuous nanomaterial with symmetric composition showed 2.4 times higher Young’s modulus and ~100 times greater toughness than the corresponding PS/PLA sample. The interconnected nanoporous PSU fabricated after etching of PLA even exhibited 1.6 times greater toughness than PS/PLA prior to PLA removal. To facilitate the production of thin films of cocontinuous nanomaterials, we applied solution-processable randomly linked linear PSU/PLA multiblock polymers onto ultrafiltration membranes. Here, the interconnected nanoporous PSU thin film generated by etching PLA was found to effectively reject 50 nm diameter particles without significantly compromising permeability. This discovery presents a valuable addition to the existing techniques used to fabricate PSU membranes. In contrast to traditional methods, which are sensitive to processing conditions, produce a wide range of pore sizes, and offer limited adjustability of pore size, the current technique is anticipated to enable interconnected PSU membranes with more uniform and tailorable porosity.