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All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Energy Infrastructure Futures: A Multiscale Evaluation of Projected Power Plant Siting Across the Western Interconnection

Energy Infrastructure Futures: A Multiscale Evaluation of Projected Power Plant Siting Across the Western Interconnection Description This dataset contains input and output data for the manuscript Mongird, K. et al. (under review) titled "Energy Infrastructure Futures: A Multiscale Evaluation of Projected Power Plant Siting Across the Western Interconnection". Input data corresponds to gridded spatial siting attributes that are necessary to conduct a random forest machine learning analysis of siting feature importance. Output data includes SHAP feature analysis outputs, and classification report values. For data on power plant siting results referred to in the manuscript, please refer to the CERF: IM3 Projected Western US Power Plant Locations data download page. The downloadable data includes values for eight different future scenarios for the Western US. The scenarios include combinations of two Shared Socioeconomic Pathways (SSP3 and SSP5) with four high-resolution climate projections specific to the United States (see, https://tgw-data.msdlive.org/). These climate projections include "hotter" and "cooler" variants for two Representative Concentration Pathways (RCP4.5 and RCP8.5). The resulting eight simulations are: rcp45cooler_ssp3 rcp45cooler_ssp5 rcp45hotter_ssp3 rcp45hotter_ssp5 rcp85cooler_ssp3 rcp85cooler_ssp5 rcp85hotter_ssp3 rcp85hotter_ssp5 Technical Information The dataset includes two sets of data files: (1) CERF gridded siting parameters and (2) Feature analysis outputs and classification reports. All downloadable data is in csv file format. Files with x/y coordinate information use the Albers Equal Area Conic projection (ESRI:102003). 1. CERF Gridded Siting Parameters This directory provides a balanced sample of gridded CERF siting parameters data for eight different scenarios for the Western US through 2055, seven different technologies, and eight timesteps. This data serves as input to the feature analysis. It contains the following parameters. region_name - name of region (i.e., state) sited - binary value representing whether the grid cell received a siting of that technology type (1=True) rcp - binary value representing scenario resource concentration pathway (0 = RCP4.5, 1 = RCP8.5) ssp - binary value representing scenario shared socioeconomic pathway (0 = SSP3, 1 = SSP5) climate - binary value representing cooler (0) or hotter (1) GCM forcing tech_name - generation technology name sited_year - year that values correspond to transmission_cost - cost of transmission interconnection pipeline_cost - cost of natural gas pipeline interconnection interconnection_cost - total interconnection cost (sum of transmission cost and gas pipeline cost) lmp - associated locational marginal value ($/MWh) associated with the grid cell, timestep, scenario, and technology xcoord - x-coordinate of location ycoord - y-coordinate of location 2a. Feature Analysis Output The dataset includes the feature analysis shap output for locational marginal price and interconnection cost. It contains the following parameters. technology - generator technology name scenario - name of scenario feature - name of feature, either locational_marginal_price or interconnection_cost value - the mean of absolute value of SHAP values for given feature 2b. Feature Analysis Classification Report This download includes the classification report associated with each random forest model. The dataset contains the following parameters. technology - generation technology name scenario - name of scenario test - one of precision (the proportion of predicted positives that are actually correct), recall (the proportion of actual positives that were correctly identified), f1-score (the harmonic mean of precision and recall) 0.0 - value of test for classification of 0 (grid cell not chosen for siting) 1.0 - value of test for classification of 1 (grid cell chosen for siting) accuracy - accuracy of model (i.e., fraction of all predictions that were right) macro avg - Simple average of test values for all classes weighted avg - Weighted average of test values for all classes, weighted based on Acknowledgment IM3 is a multi-institutional effort led by Pacific Northwest National Laboratory and supported by the U.S. Department of Energy's Office of Science as part of research in MultiSector Dynamics, Earth and Environmental Systems Modeling Program. License This data is made available under a CCBY4 License Disclaimer This material was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government nor the United States Department of Energy, nor the Contractor, nor any or their employees, nor any jurisdiction or organization that has cooperated in the development of these materials, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness or any information, apparatus, product, software, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof, or Battelle Memorial Institute. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof. PACIFIC NORTHWEST NATIONAL LABORATORYoperated byBATTELLEfor theUNITED STATES DEPARTMENT OF ENERGYunder Contract DE-AC05-76RL01830

Mongird, Kendall [Pacific Northwest National Labor↗
DOE OSTI2021

Study of interconnect errors, network congestion, and applications characteristics for throttle prediction on a large scale HPC system

Today’s High Performance Computing (HPC) systems contain thousand of nodes which work together to provide performance in the order of petaflops. The performance of these systems depends on various components like processors, memory, and interconnect. Among all, interconnect plays a major role as it glues together all the hardware components in an HPC system. A slow interconnect can impact a scientific application running on multiple processes severely as they rely on fast network messages to communicate and synchronize frequently. Unfortunately, the HPC community lacks a study that explores different interconnect errors, congestion events and applications characteristics on a large-scale HPC system. In our previous work, we process and analyze interconnect data of the Titan supercomputer to develop a thorough understanding of interconnects faults, errors, and congestion events. In this work, we first show how congestion events can impact application performance. We then investigate application characteristics interaction with interconnect errors and network congestion to predict applications encountering congestion with more than 90% accuracy.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2013

Energy Zones Study: A Comprehensive Web-Based Mapping Tool to Identify and Analyze Clean Energy Zones in the Eastern Interconnection

This report describes the work conducted in support of the Eastern Interconnection States’ Planning Council (EISPC) Energy Zones Study and the development of the Energy Zones Mapping Tool performed by a team of experts from three National Laboratories. The multi-laboratory effort was led by Argonne National Laboratory (Argonne), in collaboration with the National Renewable Energy Laboratory (NREL) and Oak Ridge National Laboratory (ORNL). In June 2009, the U.S. Department of Energy (DOE) and the National Energy Technology Laboratory published Funding Opportunity Announcement FOA-0000068, which invited applications for interconnection-level analysis and planning. In December 2009, the Eastern Interconnection Planning Collaborative (EIPC) and the EISPC were selected as two award recipients for the Eastern Interconnection. Subsequently, in 2010, DOE issued Research Call RC-BM-2010 to DOE’s Federal Laboratories to provide research support and assistance to FOA-0000068 awardees on a variety of key subjects. Argonne was selected as the lead laboratory to provide support to EISPC in developing a methodology and a mapping tool for identifying potential clean energy zones in the Eastern Interconnection. In developing the EISPC Energy Zones Mapping Tool (EZ Mapping Tool), Argonne, NREL, and ORNL closely collaborated with the EISPC Energy Zones Work Group which coordinated the work on the Energy Zones Study. The main product of the Energy Zones Study is the EZ Mapping Tool, which is a web-based decision support system that allows users to locate areas with high suitability for clean power generation in the U.S. portion of the Eastern Interconnection. The mapping tool includes 9 clean (low- or no-carbon) energy resource categories and 29 types of clean energy technologies. The EZ Mapping Tool contains an extensive geographic information system database and allows the user to apply a flexible modeling approach for the identification and analysis of potential energy zones and is publicly available at http://eispctools.anl.gov. In addition to enabling EISPC members and other stakeholders to identify areas with a high concentration of clean energy resources that could provide significant power generation in the future, another objective of the study was to promote open and transparent collaboration among state-level energy planning and regulatory agencies and to foster consistent and coordinated direction for regional and interconnection-level electricity analyses and planning. Funding for the project was provided by DOE’s Office of Electricity Delivery and Energy Reliability (DOE/OE) under the American Recovery and Reinvestment Act. Page

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2018

Facile synthesis of interconnected mesoporous ZnMn2O4 nano-peanuts for Li-storage via distinct structure design

Highlights: • Interconnected mesoporous ZnMn{sub 2}O{sub 4} nano-peanuts were successfully synthesized. SS • Novel ZnMn{sub 2}O{sub 4} have three structural features: special mesoporous structure, high specific surface and interconnected walls. • The interconnected mesoporous structure can buffer volume change and avoid particle aggregation. • The ZnMn{sub 2}O{sub 4} nano-peanuts delivered high stable reversible lithium storage properties. - Abstract: The ZnMn{sub 2}O{sub 4} nano-peanuts with diameters of 16–25 nm have been successfully prepared through a simple one-step surfactant-assisted solvothermal process. The as-synthesized ZnMn{sub 2}O{sub 4} exhibits novel interconnected mesoporous hierarchical architecture, which possesses three advantages: special mesoporous structure, high specific surface and interconnected walls. On one hand, the interconnected structure can provide sufficient surface reaction sites to fully contact Li{sup +} with the electrolyte and improve Li{sup +} diffusion and electron transfer; On the other hand, the mesoporous hierarchical networks can buffer the volume change, accommodate or alleviate the strain during charge-discharge process, thus enhancing the conductivity and stability of the electrodes. Benefiting from the mesoporous design, the interconnected ZnMn{sub 2}O{sub 4} delivers a stable capacity (812 mA h g{sup −1} at 100 mA g{sup −1} after 200 cycles), and maintains a high capacity of 516 mA h g{sup −1} even at 2 A g{sup −1} after 200 cycles, which shows that the nanostructured ZnMn{sub 2}O{sub 4} has excellent cycling stability.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2021

Thermomechanical fatigue resistance of low temperature solder for multiwire interconnects in photovoltaic modules

Novel interconnect technologies leveraging low melting temperature solders, such as multiwire interconnects, are being deployed in photovoltaic (PV) modules for improved reliability through interconnect redundancy and lower thermal loads during interconnection and lamination. However, the equivalency of standardized accelerated testing to field conditions has not yet been established for these emerging technologies. In this study, the thermomechanical fatigue resistance of low temperature solder alloys is investigated and compared to that of conventional SnPb to assess the acceleration behavior of these alloys. While InSn is shown to have sufficient thermomechanical fatigue resistance on the order of that of SnPb, these results indicate Sn–Bi alloys may have poor thermomechanical fatigue resistance at field conditions. The results also show that Sn–Bi alloys have thermal cycling acceleration factors of less than one. This indicates that the standardized accelerated thermal cycling test, such as that in IEC 61215, will produce misleading results for Sn–Bi alloys and that unique testing is required for this PV module architecture. Though accelerated thermal cycling may be a meaningful qualification test for SnPb solder joints, these results suggest that mechanical loading may be a more appropriate test for Sn–Bi multiwire interconnects. This is due to the distinct processing and geometry of multiwire interconnects which may allow for mechanical, rather than strictly metallurgical interconnections.

14 SOLAR ENERGY↗
DOE OSTI2018

Understanding and Analyzing Interconnect Errors and Network Congestion on a Large Scale HPC System

Today's High Performance Computing (HPC) systems are capable of delivering performance in the order of petaflops due to the fast computing devices, network interconnect, and back-end storage systems. In particular, interconnect resilience and congestion resolution methods have a major impact on the overall interconnect and application performance. This is especially true for scientific applications running multiple processes on different compute nodes as they rely on fast network messages to communicate and synchronize frequently. Unfortunately, the HPC community lacks state-of-practice experience reports that detail how different interconnect errors and congestion events occur on large-scale HPC systems. Therefore, in this paper, we process and analyze interconnect data of the Titan supercomputer to develop a thorough understanding of interconnects faults, errors and congestion events. We also study the interaction between interconnect, errors, network congestion and application characteristics.

Kumar, Mohit↗
DOE OSTI2025

A Combined Computational and Mathematical Analysis of Interconnect Fatigue Potential in Photovoltaic Modules

A finite element model of a 60-cell monocrystalline silicon glass-polymer photovoltaic module was simulated with ±1.0 kPa and ±2.4 kPa loads applied to the glass to calculate the deformation under load. Cell-to-cell displacements were used to approximate interconnect strain and stress. A mathematical fatigue cycle life relation was fitted to data for the interconnect material (copper), to generate a life prediction at each interconnect location based on the local stress means, reversal extents, and amplitudes. Interconnect stress was found to be significantly asymmetric about zero despite symmetric positive and negative module loads due to laminate thickness offsets about the neutral plane and the effects of module framing. Cycle life results indicated that interconnect fatigue failure was unlikely to occur over a 30-year lifetime of conservative wind and snow load cycles since the typical cell design feature of leaving some unconstrained length between the cell edge and first solder pad increases the effective gauge length and decreases the stress levels below the material endurance limit. Follow-up analyses found that 3.6 mm and 6.4 mm were the minimum unconstrained lengths required to survive the assumed lifetime of wind and snow cycles, respectively, confirming that typical industrial module constructions with 8–15 mm unconstrained lengths should survive conservatively. Notably, large magnitude, low-cycle snow loading was consistently the limiting factor requiring a longer unconstrained interconnect length. Finally, insights and workflows from this study inform module interconnection design limits for survival against mechanical fatigue in deployment environments.

14 SOLAR ENERGY↗
DOE OSTI2021

R3IT, Rapid Rural Resilient Interconnection Toolkit, Final Technical Report

Utilities nationwide are beginning to experience multiple solar interconnection requests per day. This request volume will soon overwhelm utility engineers, especially at smaller utilities which serve the majority of the landmass of the United States. In this project, we developed open-source software tool that automates the interconnection approval process and removes 80% of the time required to approve an interconnection and hence allow more solar to be quickly and safely integrated with the grid. This software is accompanied by a guidebook detailing interconnection best practices and utility lessons learned. Competing solar interconnection software is extremely expensive at ten times the cost of typical distribution engineering tools, it’s closed source which makes it hard to integrate into utility workflows, and it doesn’t address the hardest power flow modeling challenges of interconnection screening. Our solution was built built with our utility partners who are already experiencing multiple interconnection requests per day and integrates best practices from our past work with DOE and the cooperative community on solar integration. The resulting free and open-source solution has been disseminated through our media channels and conferences that engage over 1,900 utilities nationwide.

14 SOLAR ENERGY↗
DOE OSTI2017

In-memory interconnect protocol configuration registers

Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2021

Working With Your Utility Series: Interconnection Basics

This training provided information on interconnection basics for federal agencies developing distributed energy projects. Considerations covered included: Understanding interconnection processes and timelines, interconnection siting considerations, technology-specific interconnection issues, and interconnect agreements. This webinar is the first in a multi-part series on working with electric utilities to develop distributed energy projects on federal sites.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2017

Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation

In advanced microelectronics, precise design of liner and capping layers become critical, especially when it comes to the fabrication of Cu interconnects with dimensions lower than its mean free path. Here in this paper, we demonstrate that direct-liquid-evaporation chemical vapor deposition (DLE-CVD) of Co is a promising method to make liner and capping layers for nanoscale Cu interconnects. DLE-CVD makes pure, smooth, nanocrystalline, and highly conformal Co films with highly controllable growth characteristics. This process allows full Co encapsulation of nanoscale Cu interconnects, thus stabilizing Cu against diffusion and electromigration. Electrical measurements and high-resolution elemental imaging studies show that the DLE-CVD Co encapsulation layer can improve the reliability and thermal stability of Cu interconnects. Also, with the high conductivity of Co, the DLE-CVD Co encapsulation layer have the potential to further decrease the power consumption of nanoscale Cu interconnects, paving the way for Cu interconnects with higher efficiency in future high-end microelectronics.

36 MATERIALS SCIENCE↗
DOE OSTI2022

High-Temperature RF Transmission Loss Characteristics of Platinum–Inconel 600 and Platinum–304 Steel Interconnects

Radio frequency (RF) transmission losses that occur at electronic interconnects is currently an important limitation of wireless sensors and other electronic device packages that must operate in high-temperature environments. Herein, in-situ RF transmission losses were measured for two types of interconnects: platinum (Pt) wire bonded to an Inconel 600 coaxial cable; and Pt-wire bonded to a block of 304 steel. Heating the Pt wire/Inconel interconnects at 800 °C for up to 200 hours were found to be very stable with no measurable transmission losses. In contrast, Pt wire/304 steel block interconnects examined over similar test periods at 800 °C exhibited gradual increases in transmission losses leveling off at 10, 38 and 85 mdB at 400 MHz, 700 MHz, and 1 GHz, respectively. Increasing the test temperature to 900 °C caused further elevated transmission losses of 30, 70 and 108 mdB at the same reported frequencies. By comparison, temperature cycling of the Pt wire/304 steel interconnects between room temperature and 900 °C was found to cause more significant degradation. In particular, four thermal cycles from room temperature to 900 °C resulted in losses of 75, 271, and 482 mdB at the same reported frequencies. Parabolic oxidation relative to the RF skin depth in the 304 steel block at the tested frequencies are discussed as possible reasons for the transmission losses during the isothermal soaks, whereas interconnect degradation due to differences in thermal expansion between Pt and 304 steel are primarily responsible for transmission losses caused by high temperature cycling.

304 steel↗
DOE OSTI2022

Graphene-Based Interconnect Exploration for Large SRAM Caches for Ultrascaled Technology Nodes

Graphene-based interconnects are considered promising replacements for traditional copper (Cu) interconnect due to their great electric properties. In this article, an interconnect-memory co- design framework is developed to efficiently optimize various graphene-based interconnect technologies. Four interconnect materials and heterogeneous design schemes are benchmarked against their traditional Cu counterparts to optimize large cache-level SRAM performance in terms of delay and energy per access, energy-delay product (EDP), and energy-delay-area product (EDAP). Here, a large design space exploration is performed based on realistic subarray design and device technology. Various interconnect- and array-level design parameters are studied to quantify the true potential of graphene-based wires for optimal memory performance.

42 ENGINEERING↗
DOE OSTI2017

Comparative Analysis and Considerations for PV Interconnection Standards in the United States and China

The main objectives of this report are to evaluate China's photovoltaic (PV) interconnection standards and the U.S. counterparts and to propose recommendations for future revisions to these standards. This report references the 2013 report Comparative Study of Standards for Grid-Connected PV System in China, the U.S. and European Countries, which compares U.S., European, and China's PV grid interconnection standards; reviews various metrics for the characterization of distribution network with PV; and suggests modifications to China's PV interconnection standards and requirements. The recommendations are accompanied by assessments of four high-penetration PV grid interconnection cases in the United States to illustrate solutions implemented to resolve issues encountered at different sites. PV penetration in China and in the United States has significantly increased during the past several years, presenting comparable challenges depending on the conditions of the grid at the point of interconnection; solutions are generally unique to each interconnected PV installation or PV plant.

14 SOLAR ENERGY↗
DOE OSTI2018

Review of Interconnection Practices and Costs in the Western States

The objective of this report is to evaluate the nature of barriers to interconnecting distributed PV, assess costs of interconnection, and compare interconnection practices across various states in the Western Interconnection. The report addresses practices for interconnecting both residential and commercial-scale PV systems to the distribution system. This study is part of a larger, joint project between the Western Interstate Energy Board (WIEB) and the National Renewable Energy Laboratory (NREL), funded by the U.S. Department of Energy, to examine barriers to distributed PV in the 11 states wholly within the Western Interconnection.

14 SOLAR ENERGY↗
DOE OSTI2019

New Approaches to Distributed PV Interconnection: Implementation Considerations for Addressing Emerging Issues

As the cost of installing distributed solar photovoltaics (PV) has fallen, the number of requests to interconnect PV systems to distribution grids has risen substantially in many utility service areas. In response, states and utilities are modifying their interconnection practices to address new DER challenges. This report examines emerging issues associated with interconnecting residential- and commercial-scale PV to facilitate sharing of lessons learned and best practices across jurisdictions. It covers issues related to allocating and understanding costs, understanding grid conditions to inform PV siting, interconnecting storage, automating processes, and requiring the availability of advanced inverter functions that can help increase PV hosting capacity. This report builds on an earlier study that reviews interconnection practices and costs across the western states (Bird et al. 2018). Both reports were developed as part of a larger, joint project between the Western Interstate Energy Board and the National Renewable Energy Laboratory, funded by the U.S. Department of Energy's Solar Energy Technologies Office, that examines barriers to distributed PV in the 11 states within the Western Interconnection.

14 SOLAR ENERGY↗
DOE OSTI2019

Software Defined Networking for HPC Interconnects and its Extension across Domains (Final Technical Report for DE-SC0016039)

This project seeks to incorporate OpenFlow-style Software Defined Networking capability into existing High Performance Computing (HPC) interconnect technology, InfiniBand, and to extend such capability beyond one domain. We develop SDN-enhanced InfiniBand that supports OpenFlow functionality for HPC interconnects, investigate the required techniques and the potential benefits for applying SDN on different types of HPC interconnects, and develop software to control the network and expose SDN capability to external networks through the OpenFlow interface. We have also developed techniques to evaluate communication characteristics of parallel applications, which determines the workload on interconnects, investigated newly proposed Interconnection network technologies including new network topologies and routing schemes, and designed novel interconnect routing and modeling techniques. Major activities and findings are summarized as follows.

97 MATHEMATICS AND COMPUTING↗
DOE OSTI2023

Characterization of Interconnects

Combined-accelerated stress testing (C-AST) simultaneously combines stress factors of the natural environment (including UV radiation, temperature, humidity, electrical current, and external mechanical force) into a single test that requires fewer modules, fewer chambers, and makes it possible to discover weaknesses in new designs that are not known a-priori. C-AST reduces risk, accelerates time to market, and improves bankability by reducing costly overdesign using test levels not exceeding those seen in the natural environment. This project seeks to evaluate strengths and weaknesses of modern cell interconnect designs with combined-accelerated stress testing (C-AST) to screen multiple climates along with finite element and failure analysis to determine the potential for a 50-year life. Supporting this, we seek to develop methods of characterization to assess the degradation of interconnects, enable predictive rate models with material forensics and FEA and show C-AST's ability to find interconnect failures and benchmark it relative to other accelerated stress test methods like temperature cycling and cyclic dynamic mechanical loading. Examples of modern interconnect designs covered are Canadian Solar Hetero Technology ribbon enabling closer cell interconnections, SmartWire (eg. Meyer-Berger technology), and shingled cells with new interconnect materials.

C-AST↗