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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1997

Development of High Temperature Gas Sensor Technology

The measurement of engine emissions is important for their monitoring and control. However, the ability to measure these emissions in-situ is limited. We are developing a family of high temperature gas sensors which are intended to operate in harsh environments such as those in an engine. The development of these sensors is based on progress in two types of technology: (1) The development of SiC-based semiconductor technology; and (2) Improvements in micromachining and microfabrication technology. These technologies are being used to develop point-contact sensors to measure gases which are important in emission control especially hydrogen, hydrocarbons, nitrogen oxides, and oxygen. The purpose of this paper is to discuss the development of this point-contact sensor technology. The detection of each type of gas involves its own challenges in the fields of materials science and fabrication technology. Of particular importance is sensor sensitivity, selectivity, and stability in long-term, high temperature operation. An overview is presented of each sensor type with an evaluation of its stage of development. It is concluded that this technology has significant potential for use in engine applications but further development is necessary.

Hunter, Gary W.↗
NASA NTRS1999

High Temperature Acoustic Liner Technology

This paper describes work currently in progress at Langley on liner concepts that employ structures that may be suitable for broadband exhaust noise attenuation in high speed flow environments and at elevated temperatures characteristic of HSCT applications. Because such liners will need to provide about 10 dB suppression over a 2 to 3 octave frequency range, conventional single-degree-of-freedom resonant structures will not suffice. Bulk absorbers have the needed broadband absorption characteristic; however, at lower frequencies they tend to be inefficient.

Parrott, Tony L.↗
NASA NTRS1991

High temperature NASP engine seals: A technology review

Progress in developing advanced high temperature engine seal concepts and related sealing technologies for advanced hypersonic engines are reviewed. Design attributes and issues requiring further development for both the ceramic wafer seal and the braided ceramic rope seal are examined. Leakage data are presented for these seals for engine simulated pressure and temperature conditions and compared to a target leakage limit. Basic elements of leakage flow models to predict leakage rates for each of these seals over the wide range of pressure and temperature conditions anticipated in the engine are also presented.

Steinetz, Bruce M.↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
DOE OSTI2024

Multilayer Silicon Carbide Composite Material Technology for High-Temperature Concentrated Solar-Thermal Power Components

In 2012, the U.S Department of Energy defined aggressive targets to achieve lower component costs and higher system efficiencies for concentrated solar-thermal power (CSP), and this, in turn, has led to the exploration of technology options that can operate at higher temperatures [1]. These next-generation CSP options, referred to as Generation 3 (a.k.a. Gen3), are targeting temperatures at or above 700 °C for the energy being delivered to the power cycle, and the more challenging plant conditions have necessitated a review and selection of alternative receiver heat transfer fluids as well as a search for materials that can meet the associated high-temperature component requirements. Nickel-based alloys are currently being considered, but these generally experience a significant drop in strength at temperatures > 775 °C [2] and may not be able to achieve corrosion and other lifetime requirements. Furthermore, these alloys are expensive, frequently have cost and schedule volatility, and offer little potential for lower cost at high production volumes. As an alternative, Ceramic Tubular Products, LLC (CTP) has developed a multilayer silicon carbide composite that can complement or replace alloys currently being considered for these Gen3 CSP applications.

14 SOLAR ENERGY↗
DOE OSTI2024

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.

42 ENGINEERING↗
NASA NTRS2009

Development of High Temperature Dissimilar Joint Technology for Fission Surface Power Systems

NASA is developing fission surface power (FSP) system technology as a potential option for use on the surface of the moon or Mars. The goal is to design a robust system that takes full advantage of existing materials data bases. One of the key components of the power conversion system is the hot-side Heat Exchanger (HX). One possible design for this heat exchanger requires a joint of the dissimilar metals 316L stainless steel and Inconel 718, which must sustain extended operation at high temperatures. This study compares two joining techniques, brazing and diffusion bonding, in the context of forming the requisite stainless steel to superalloy joint. The microstructures produced by brazing and diffusion bonding, the effect of brazing cycle on the mechanical tensile properties of the alloys, and the strength of several brazed joints will be discussed.

Locci, Ivan E.↗
DOE OSTI2024

Technology Feasibility of High-Temperature Heat Pumps for Industrial Drying Process in the US

High-temperature heat pumps are a prospective technology for electrifying and decarbonizing industrial drying processes. This study investigates the technological potential of HTHPs in replacing fossil-fuel burners or steam boilers in industrial spray dryers. The performance of HTHPs with three configurations was investigated, including high high-temperature heat pump boosted with an electric air heater, a steam-generating high-temperature heat pump with multi-stage mechanical vapor compressions, and transcritical high-temperature heat pumps. R1336mzz(Z) is used as the refrigerant in both subcritical and transcritical high-temperature heat pumps, and R717 is used as the working fluid in the mechanical vapor recompression and the heat transfer fluids. Thermodynamic models are built to evaluate the energy efficiency of HTHPs. A case study was carried out on an industrial spray dryer integrated with a waste heat recuperator, where the HTHPs are used to recover precooled air with a dew point of 40℃ and supply heat for drying air at 200℃. For a high-temperature heat pump boosted with an electric air heater, a higher system-level COP is achieved with a high supply temperature from high-temperature heat pump. For a high-temperature heat pump with mechanical vapor recompressions, larger temperature drops in the flashing tank provide higher heat capacities but almost constant values of the coefficient of performance. For a transcritical high-temperature heat pump, an optimum discharge pressure exists for the temperature profiles within the gas cooler and the coefficient of performance. The transcritical high-temperature heat pump provides the best energy efficiency among the three configurations. The theoretical results prove the technical feasibility of high-temperature heat pumps in industrial air-drying applications. .

Wang, Pengtao↗
NASA NTRS1995

Development of practical high temperature superconducting wire for electric power application

The technology of high temperature superconductivity has gone from beyond mere scientific curiousity into the manufacturing environment. Single lengths of multifilamentary wire are now produced that are over 200 meters long and that carry over 13 amperes at 77 K. Short-sample critical current densities approach 5 x 104 A/sq cm at 77 K. Conductor requirements such as high critical current density in a magnetic field, strain-tolerant sheathing materials, and other engineering properties are addressed. A new process for fabricating round BSCCO-2212 wire has produced wires with critical current densities as high as 165,000 A/sq cm at 4.2 K and 53,000 A/sq cm at 40 K. This process eliminates the costly, multiple pressing and rolling steps that are commonly used to develop texture in the wires. New multifilamentary wires with strengthened sheathing materials have shown improved yield strengths up to a factor of five better than those made with pure silver. Many electric power devices require the wire to be formed into coils for production of strong magnetic fields. Requirements for coils and magnets for electric power applications are described.

Hawsey, Robert A.↗
NASA NTRS1992

High temperature strain gage technology for hypersonic aircraft development applications

An experimental evaluation of Pd 13 percent Cr and of BCL-3 alloy wire strain gages was conducted on IN100 and Cu 0.15 percent Zr alloy substrates. Testing included apparent strain, drift, gage factor, and creep. Maximum test temperature was 1144 K (1600 F). The PdCr gages incorporated Pt temperature compensation elements. The PdCr gages were found to have good resistance stability below 866 K (1100 F). The BCL 3 gages were found to have good resistance stability above 800 K (981 F), but high drift around 700 K (800 F).

Anderson, W. L.↗
NASA NTRS1990

High temperature superconductors: A technological revolution

The objectives are to demonstrate the Meissner effect through magnetic levitation, to demonstrate one application of the Meissner effect, the low friction magnetic rotation bearing, and to demonstrate magnetic flux penetration and the Type II nature of ceramic superconductors via the stacking of the superconductor disks. Experimental equipment and procedures are described.

Source record↗
NASA NTRS1991

High temperature superconductive microwave technology for space applications

Progress being made on space application technology research on film fabrication, passive microwave circuits, and semiconductor devices for cryogenic circuits is reviewed. Achievements in YBCO and TCBCO films are addressed along with circuit evaluations of microstrip resonators, phase shifters, microstrip filters, dielectric resonator filters, and superconducting antennas.

Leonard, R. F.↗
NASA NTRS1994

High temperature strain gage technology for gas turbine engines

This report summarizes the results of a six month study that addressed specific issues to transfer the Pd-13Cr static strain sensor to a gas turbine engine environment. The application issues that were addressed include: (1) evaluation of a miniature, variable potentiometer for use as the ballast resistor, in conjunction with a conventional strain gage signal conditioning unit; (2) evaluation of a metal sheathed, platinum conductor leadwire assembly for use with the three-wire sensor; and (3) subjecting the sensor to dynamic strain cyclic testing to determine fatigue characteristics. Results indicate a useful static strain gage system at all temperature levels up to 1350 F. The fatigue characteristics also appear to be very promising, indicating a potential use in dynamic strain measurement applications. The procedure, set-up, and data for all tests are presented in this report. This report also discusses the specific strain gage installation technique for the Pd-13Cr gage because of its potential impact on the quality of the output data.

Fichtel, Edward J.↗
NASA NTRS2002

Packaging Technology for SiC High Temperature Circuits Operable up to 500 Degrees Centigrade

New high temperature low power 8-pin packages have been fabricated using commercial fabrication service. These packages are made of aluminum nitride and 96 percent alumina with Au metallization. The new design of these packages provides the chips inside with EM shielding. Wirebond geometry control has been achieved for precise mechanical tests. Au wirebond samples with 45 degree heel-angle have been tested using wireloop test module. The geometry control improves the consistency of measurement of the wireloop breaking point.Also reported on is a parametric study of the thermomechanical reliability of a Au thick-film based SiC die-attach assembly using nonlinear finite element analysis (FEA) was conducted to optimize the die-attach thermo-mechanical performance for operation at temperatures from room temperature to 500 degrees Centigrade. This parametric study centered on material selection, structure design and process control.

Chen, Lian-Yu↗
NASA NTRS2017

Packaging Technology for SiC High Temperature Electronics

High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.

Chen, Liang-Yu↗
NASA NTRS1993

MSFC nuclear thermal propulsion technology program

Viewgraphs on non-nuclear materials assessment, nuclear thermal propulsion (NTP) turbomachinery technologies, and high temperature superconducting magnetic bearing technology are presented. The objective of the materials task is to identify and evaluate candidate materials for use in NTP turbomachinery and propellant feed system applications. The objective of the turbomachinery technology task is to develop and validate advanced turbomachinery technologies at the component and turbopump assembly levels. The objective of the high temperature superconductors (HTS) task is to develop and validate advanced technology for HTS passive magnetic/hydrostatic bearing.

Swint, Shane↗