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A monitor for the laboratory evaluation of control integrity in digital control systems operating in harsh electromagnetic environments

This paper presents a strategy for dynamically monitoring digital controllers in the laboratory for susceptibility to electromagnetic disturbances that compromise control integrity. The integrity of digital control systems operating in harsh electromagnetic environments can be compromised by upsets caused by induced transient electrical signals. Digital system upset is a functional error mode that involves no component damage, can occur simultaneously in all channels of a redundant control computer, and is software dependent. The motivation for this work is the need to develop tools and techniques that can be used in the laboratory to validate and/or certify critical aircraft controllers operating in electromagnetically adverse environments that result from lightning, high-intensity radiated fields (HIRF), and nuclear electromagnetic pulses (NEMP). The detection strategy presented in this paper provides dynamic monitoring of a given control computer for degraded functional integrity resulting from redundancy management errors, control calculation errors, and control correctness/effectiveness errors. In particular, this paper discusses the use of Kalman filtering, data fusion, and statistical decision theory in monitoring a given digital controller for control calculation errors.

Belcastro, Celeste M.↗

Silicon Carbide Nanotube Synthesized

Carbon nanotubes (CNTs) have generated a great deal of scientific and commercial interest because of the countless envisioned applications that stem from their extraordinary materials properties. Included among these properties are high mechanical strength (tensile and modulus), high thermal conductivity, and electrical properties that make different forms of single-walled CNTs either conducting or semiconducting, and therefore, suitable for making ultraminiature, high-performance CNT-based electronics, sensors, and actuators. Among the limitations for CNTs is their inability to survive in high-temperature, harsh-environment applications. Silicon carbon nanotubes (SiCNTs) are being developed for their superior material properties under such conditions. For example, SiC is stable in regards to oxidation in air to temperatures exceeding 1000 C, whereas carbon-based materials are limited to 600 C. The high-temperature stability of SiCNTs is envisioned to enable high-temperature, harsh-environment nanofiber- and nanotube-reinforced ceramics. In addition, single-crystal SiC-based semiconductors are being developed for hightemperature, high-power electronics, and by analogy to CNTs with silicon semiconductors, SiCNTs with single-crystal SiC-based semiconductors may allow high-temperature harsh-environment nanoelectronics, nanosensors, and nanoactuators to be realized. Another challenge in CNT development is the difficulty of chemically modifying the tube walls, which are composed of chemically stable graphene sheets. The chemical substitution of the CNTs walls will be necessary for nanotube self-assembly and biological- and chemical-sensing applications. SiCNTs are expected to have a different multiple-bilayer wall structure, allowing the surface Si atoms to be functionalized readily with molecules that will allow SiCNTs to undergo self-assembly and be compatible with a variety of materials (for biotechnology applications and high-performance fiber-reinforced ceramics).

Lienhard, Michael A.↗

Thin Film Ceramic Strain Sensor Development for High Temperature Environments

The need for sensors to operate in harsh environments is illustrated by the need for measurements in the turbine engine hot section. The degradation and damage that develops over time in hot section components can lead to catastrophic failure. At present, the degradation processes that occur in the harsh hot section environment are poorly characterized, which hinders development of more durable components, and since it is so difficult to model turbine blade temperatures, strains, etc, actual measurements are needed. The need to consider ceramic sensing elements is brought about by the temperature limits of metal thin film sensors in harsh environments. The effort at the NASA Glenn Research Center (GRC) to develop high temperature thin film ceramic static strain gauges for application in turbine engines is described, first in the fan and compressor modules, and then in the hot section. The near-term goal of this research effort was to identify candidate thin film ceramic sensor materials and provide a list of possible thin film ceramic sensor materials and corresponding properties to test for viability. A thorough literature search was conducted for ceramics that have the potential for application as high temperature thin film strain gauges chemically and physically compatible with the NASA GRCs microfabrication procedures and substrate materials. Test results are given for tantalum, titanium and zirconium-based nitride and oxynitride ceramic films.

Wrbanek, John D.↗

A Radiation Hard Multi-Channel Digitizer ASIC for Operation in the Harsh Jovian Environment

In 1995, the Galileo spacecraft arrived at Jupiter to conduct follow-up experiments on pathfinder Pioneer and key Voyager discoveries especially at Io, Europa, Ganymede and Callisto. These new observations helped expand our scientific knowledge of the prominent Galilean satellites; studies revealed diversity with respect to their geology, internal structure, evolution and degree of past and present activity. Jupiter's diverse Galilean satellites, of which three are believed to harbor internal oceans, are central to understanding the habitability of icy worlds. Galileo provided for the first time compelling evidence of a near-surface global ocean on Europa. Furthermore, by understanding the Jupiter system and unraveling the history of its evolution from initial formation to the emergence of possible habitats and life, gives insight into how giant planets and their satellite systems form and evolve. Most important, new light is shed on the potential for the emergence and existence of life in icy satellite oceans. In 2009, NASA released a detailed Jupiter Europa Mission Study (EJSM) that proposed an ambitious Flagship Mission to understand more fully the satellites Europa and Ganymede within the context of the Jovian system. Key to EJSM is the NASA led Jupiter Europa Orbiter (JEO) and the ESA led Jupiter Ganymede Orbiter (JGO). JEO and JGO would execute a choreographed exploration of the Jovian system before settling into orbit around Europa and Ganymede, respectively. The National Academies Planetary Decadal Survey, 2011 has listed the NASA-led JEO as the second highest priority mission for the decade 2013-2022, and if chosen it would be launched in 2020 with arrival at Jupiter in 2025. If the JEO mission is not chosen it is anticipated that there will be opportunities in future decadal cycles. Jupiter Orbit Insertion (JOI) begins a 30-month Jovian system tour followed by nine months of science mapping after Europa Orbit Insertion (EOI) in July 2028. The orbiter will ultimately impact the surface of Europa after the mission is completed. The current JEO mission concept includes a range of instruments on the payload, to monitor dynamic phenomena (such as Io's volcanoes and Jupiters atmosphere), map the Jovian magnetosphere and its interactions with the Galilean satellites, and characterize water oceans beneath the ice shells of Europa and Ganymede. The payload includes a low mass (3.7 Kg) and low power (< 5 W) Thermal Instrument (TI) concept for measuring possible warm thermal anomalies on Europa s cold surface caused by recent (< 10,000 years) eruptive activity. Regions of anomalously high heat flow will be identified by thermal mapping using a nadir pointing, push-broom filter radiometer that provides far-IR imagery in two broad band spectral wavelength regions, 8-20 m and 20-100 m, for surface temperature measurements with better than a 2 K accuracy and a spatial resolution of 250 m/pixel obtained from a 100 Km orbit. The temperature accuracy permits a search for elevated temperatures when combined with albedo information. The spatial resolution is sufficient to resolve Europa's larger cracks and ridge axial valleys. In order to accomplish the thermal mapping, the TI uses sensitive thermopile arrays that are readout by a custom designed low-noise Multi-Channel Digitizer (MCD) ASIC that resides very close to the thermopile linear array outputs. Both the thermopile array and the MCD ASIC will need to show full functionality within the harsh Jovian radiation environment, operating at cryogenic temperatures, typically 150 K to 170 K. In the following, a radiation mitigation strategy together with a low risk Radiation-Hardened-By-Design (RHBD) methodology using commercial foundry processes is given for the design and manufacture of a MCD ASIC that will meet this challenge.

Aslam, Shahid↗

Lander Lighting Solution to Reduce Pilot & Autonomous Approach Errors

The south pole lighting environment will have harsh low inclination sunlight, making overhead judgement of surface features difficult. Autonomous solutions are great, however, the need for visual monitoring and independent go/no-go decisions remain. Our project proposes that lunar landing systems will be better served by including a powerful landing light system that improves visibility of surfaces from overhead by illuminating the ground at critical distances for the crew to make last minute decisions regarding an approach. The project utilized computer-based optical modeling software to predict requirements for a potential landing light system. The analysis based the lamp prediction from commercially available LED chip sets and lamp optics. The goal was to illustrate a method to raise the surface contrast of a landing site within an acceptable contrast threshold for most camera systems and human observers to recognize hazards that would not be noticed with low inclination sunlight alone. The Apollo lunar landings benefitted from overhead sun or dark conditions. The surface lighting at the Lunar South Pole is a harsh environment where surfaces are lit from a low inclination angle by the sun (from the side). This change in lighting condition precipitates a need for updated lunar landing systems that facilitate improved recognition of landing sites, and thereby increase pilot awareness of landing hazards. The reliance on LIDAR and other autonomous mechanisms alone is risky given the known usage of visual monitoring for operator concurrence on current spacecraft programs and present-day autonomous land-based vehicles. Visual monitoring via cameras or windows requires the surface contrast to be within 3 orders of magnitude for reasonable recognition of objects. Artificial overhead illumination, when sufficiently sized, provides a means to even out contrast problems created by low inclination sunlight, potentially reducing piloting errors. Current vehicle requirements do not specify this type of guidance for the purpose of increasing mission success. An optical ray-trace simulation model was developed in Zemax Optics Studio to predict the best combination of LED power, LED optics, lamp quantity, and lamp location to raise the surface contrast to within 2 orders of magnitude from 3 orders required to further increased visibility and reduce risk. The project considered the following design constraints: potential base diameter of lander, approach distance(s) for a go-no-go decision point (200 meter), solar inclination angle (2-7), lunar surface reflectance (10%), LED chip sets, LED focusing optics, LED power, lamp quantity, lamp locations, and illumination diameter of lunar surface landing zone. The results can be used to establish minimum design constraints for vehicle landing light systems. With a solar inclination angle ranging from 2-7 degrees, the horizontal illumination of the lunar surface is attenuated by about 10% when compared to overhead illumination from the Sun. This modifies the sun's maximum of 130,000 lux to 13,000 lux horizontal illuminance. The artificial lighting system was designed to provide an 18-meter-wide illumination zone, to create viewing clearances around a 6-meter-wide lander. The system provides an average illuminance of 300 lux, meeting the 2 orders of magnitude criteria. The solution utilized modern Chip On Board LEDs, that each utilized 17 watts, with focusing Total Internal Reflection (TIR) lenses. A lighting system of 300 LEDs was arrayed along the "bottom" of a “lander”. With 17 watts per LED, the system is estimated to require 5100 watts. This is a large amount of power, but it would only be needed during critical phases during the landing. LED lighting systems can be dimmed, and it is assumed that as the lander arrives closer to the landing site, the lighting system power can be adjusted as needed to produce the necessary surface illuminance. The designed reduction of contrast improves reliability of safety assessments using real time visible light camera systems and out the window viewing by the crew.

T A Clark↗

Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus Environment

This paper presents experimental results of a prototype high temperature co-fired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with 60-day demonstration in simulated Venus surface environment of 465 degC with corrosive atmosphere at 90 bar pressure. The prototype package is based on previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide (SiC) high temperatures semiconductor integrated circuits (ICs) at NASA Glenn Research Center in 500 degC Earth air ambient for over ten thousands hours, and short-term tested at temperatures above 800 degC. The three-phase harsh environment test started with 48 hours in 465 degC Earth air, followed by 48 hours in 465 degC nitrogen at 90 bar pressure and 1400 hours in simulated Venus surface environment of 465 degC with corrosive atmosphere at 90 bar. Initial analytical results of the package materials and surfaces after exposure to Venus environment are discussed to assess the stability of the packaging materials in the tested environments. The test in simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig (GEER). The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help to improve electrical performance of a HTCC alumina packaging system in Venus environment.

Chen, Liangyu↗

Sixty Earth-Days Test of a Prototype Pt/HTCC Alumina Package in Simulated Venus Environment

This paper presents experimental results of a prototype high temperature co-fired ceramic (HTCC) package with Au/Pt metallization in a three-phase harsh environment test that culminated with 60-day demonstration in simulated Venus surface environment of 465 degrees Centigrade with corrosive atmosphere at 90 bars pressure. The prototype package is based on a previously developed and reported HTCC package successfully tested with multiple analog and digital silicon carbide (SiC) high temperatures semiconductor integrated circuits (ICs) at NASA Glenn Research Center in 500 degrees Centigrade Earth air ambient for over ten thousand hours, and short-term tested at temperatures above 800 degrees Centigrade. The three-phase harsh environment test started with 48 hours in 465 degrees Centigrade Earth air, followed by 48 hours in 465 degrees Centigrade nitrogen at 90-bar pressure and 1400 hours in simulated Venus surface environment of 465 degrees Centigrade with corrosive atmosphere at 90 bars. Initial analytical results of the package materials and surfaces after exposure to the Venus environment are discussed to assess the stability of the packaging materials in the tested environments. The test in a simulated Venus environment was implemented in the NASA Glenn Extreme Environment Rig (GEER). The results of this study suggest that an effective encapsulation of areas of surface metallization and vicinities may help to improve electrical performance of a HTCC alumina packaging system in Venus environment.

Chen, Liang-Yu↗

Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation

Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

4D Light Field Imaging System Using Programmable Aperture

Complete depth information can be extracted from analyzing all angles of light rays emanated from a source. However, this angular information is lost in a typical 2D imaging system. In order to record this information, a standard stereo imaging system uses two cameras to obtain information from two view angles. Sometimes, more cameras are used to obtain information from more angles. However, a 4D light field imaging technique can achieve this multiple-camera effect through a single-lens camera. Two methods are available for this: one using a microlens array, and the other using a moving aperture. The moving-aperture method can obtain more complete stereo information. The existing literature suggests a modified liquid crystal panel [LC (liquid crystal) panel, similar to ones commonly used in the display industry] to achieve a moving aperture. However, LC panels cannot withstand harsh environments and are not qualified for spaceflight. In this regard, different hardware is proposed for the moving aperture. A digital micromirror device (DMD) will replace the liquid crystal. This will be qualified for harsh environments for the 4D light field imaging. This will enable an imager to record near-complete stereo information. The approach to building a proof-ofconcept is using existing, or slightly modified, off-the-shelf components. An SLR (single-lens reflex) lens system, which typically has a large aperture for fast imaging, will be modified. The lens system will be arranged so that DMD can be integrated. The shape of aperture will be programmed for single-viewpoint imaging, multiple-viewpoint imaging, and coded aperture imaging. The novelty lies in using a DMD instead of a LC panel to move the apertures for 4D light field imaging. The DMD uses reflecting mirrors, so any light transmission lost (which would be expected from the LC panel) will be minimal. Also, the MEMS-based DMD can withstand higher temperature and pressure fluctuation than a LC panel can. Robotics need near complete stereo images for their autonomous navigation, manipulation, and depth approximation. The imaging system can provide visual feedback

Bae, Youngsam↗

Self-Healing RF/Microwave Communications Circuits/Systems for NASA Missions—A Review

The success of current and future NASA missions relies in great part on the performance reliability and robustness of the communication circuits and systems of said missions. Some of the manifestations of reliability and robustness are comprised by properties such as graceful degradation, which provide redundancy and potentially longer life to the mission, and the ability to perform efficiently in harsh environments destinations such as Venus and the Jovian and Saturnian moons Europa and Enceladus, respectively. While several approaches have been considered or are currently underway to develop communications circuitry capable of performing in harsh environments, they lack the flexibility to enable reconfigurability to preserve functionality under adverse or contingency scenarios. This paper discusses some examples of self-healing RF/Microwave communications circuits and systems that could provide advantageous options in support of NASA missions.

self-healing↗

Self-Healing RF/Microwave Communications Circuits/Systems for NASA Missions - A Review

The success of current and future NASA missions relies in great part on the performance reliability and robustness of the communication circuits and systems of said missions. Some of the manifestations of reliability and robustness are comprised by properties such as graceful degradation, which provide redundancy and potentially longer life to the mission, and the ability to perform efficiently in harsh environments destinations such as Venus and the Jovian and Saturnian moons Europa and Enceladus, respectively. While several approaches have been considered or are currently underway to develop communications circuitry capable of performing in harsh environments, they lack the flexibility to enable reconfigurability to preserve functionality under adverse or contingency scenarios. This paper discusses some examples of self-healing RF/Microwave communications circuits and systems that could provide advantageous options in support of NASA missions.

Self-healing↗

Testing of a Wireless Sensor System for Instrumented Thermal Protection Systems

Funded by NASA's Constellation Universities Institutes Project (CUIP), we have been developing and testing a system to wirelessly power and collect data from sensors on space platforms in general and, in particular, the harsh environment of spacecraft re-entry. The elimination of wires and associated failures such as chafing, sparking, ageing, and connector issues can increase reliability and design flexibility while reducing costs. These factors present an appealing case for the pursuit of wireless solutions for harsh environments, particularly for their use in space and on spacecraft. We have designed and built a prototype wireless sensor system. The system, with capabilities similar to that of a wired sensor system, was tested in NASA Ames Research Center s Aerodynamic Heating Facility and Interaction Heating Facility. This paper discusses the overall development effort, testing results, as well as future directions.

Kummer, Allen T.↗

New Oxide Ceramic Developed for Superior High-Temperature Wear Resistance

Ceramics, for the most part, do not have inherently good tribological properties. For example friction coefficients in excess of 0.7 have been reported for silicon nitride sliding on silicon nitride or on bearing steel (ref. 1). High friction is always accompanied by considerable wear. Despite their inherently poor tribological properties, the high strength and high toughness of silicon nitride (Si3N4) ceramics has led to their successful use in tribological applications (refs. 1 to 4). The upper temperature limit for the application of Si3N4 as wear-resistant material is limited by reaction with the tribological environment (ref. 3). Silicon nitride is known to produce a thin silicon dioxide film with easy shear capability that results in low friction and low wear in a moist environment (ref. 5). At elevated temperatures, the removal of the reaction product that acts as lubricant causes the friction coefficient to increase and, consequently, the wear performance to become poor. New materials are sought that will have wear resistance superior to that of Si3N4 at elevated temperatures and in harsh environments. A new class of oxide ceramic materials has been developed with potential for excellent high-temperature wear resistance. The new material consists of a multicomponent oxide with a two-phase microstructure, in which the wear resistance of the mixed oxide is significantly higher than that of the individual constituents. This is attributed to the strong constraining effects provided by the interlocking microstructures at different length scales, to the large aspect ratio of the phases, to the strong interphase bonding, and to the residual stresses. Fretting wear tests were conducted by rubbing the new ceramic material against boron carbide (B4C). The new ceramic material produced a wear track groove on B4C, suggesting significantly higher wear resistance for the oxide ceramic. The new material did not suffer from any microstructural degradation after the wear test. The wear rate of the new ceramic material at 600 C was determined to be on the order of 10-10 mm3/N-m, which is 3 to 5 orders of magnitude lower than that for the current state-of-theart wear-resistant materials (Si3N4and B4C). The friction coefficient of the new ceramic materials is on the order of 0.4, which is significantly lower than that of silicon nitride. This new class of oxide materials has shown considerable potential for applications requiring high wear resistance at high temperatures and in harsh environments. New understanding of the wear behavior of ceramic materials is emerging as a result of the surprisingly high wear resistance of two-phase oxide ceramics. There is excellent potential for further improvements in the wear resistance of oxide ceramics through optimizing the microstructure and altering the crystallographic properties of specific oxide materials as a second phase to reduce the coefficient of friction at elevated temperatures.

Sayir, Ali↗

Effective structural impact detection and localization using convolutional neural network and Bayesian information fusion with limited sensors

Due to their unpredictable nature, many impact events (e.g., overheight vehicles striking on bridges) go unnoticed or get reported many hours later. However, they can induce structural failures or hidden damage that accelerates the structure’s long-term degradation. Therefore, prompt impact detection and localization strategies are essential for early warning of impact events and rapid maintenance of structures. Most existing impact detection strategies are developed for aircraft composite panels utilizing high-rate synchronized measurement from densely deployed sensors. Limited efforts have been made for infrastructure or human habitats which generally require large-scale but low-rate measurement. In particular, due to harsh environments (e.g., deep space habitats under meteoroids), structural impact localization must be robust to limited sensors (e.g., sensor damage during impacts) and multi-source errors (e.g., measurement errors). In this study, an effective impact detection and localization strategy is proposed using a limited number of vibration measurements, especially in harsh environments (e.g. in deep space). Convolutional neural networks are trained for each sensor node and are fused using Bayesian theory to improve the accuracy of impact localization. Special considerations are paid to evaluate the effect of both measurement error and modeling error in the analysis. The proposed strategy is illustrated using 1D structure, and further validated in 3D geodesic dome structure numerically. The results demonstrate that it can detect and localize impact events accurately and robustly on structures.

Yuguang Fu↗

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗

A Brief Overview of Silicon Carbide Based Smart Sensor System Technologies for Planetary and Aeronautics Applications

A range of aerospace application related to planetary exploration and aeronautic engine operations require Smart Sensor System technologies operational in harsh environments. A Smart Sensor System as described here implies the use of sensors combined with electronics and other supporting technologies. For example, missions to the surface of planets like Venus or Mercury are challenged by extreme temperatures and environments, e.g., extended Venus operation 465°C [1]. In response, NASA has been developing capabilities for a small lander that is designed to operate for months in the extreme temperatures. These capabilities span electronics, sensors, communications, and power. Such a lander would enable new revolutionary science. Similar game changing capabilities are enabled by the introduction of high temperature smart systems into aeronautic engine applications to enable distributed intelligence within the engine system [2]. Core to meeting these applications is operational harsh environment electronics, corresponding sensor systems, and their integration. This presentation concentrates on the status of Smart System technologies emphasizing the role of Silicon Carbide (SiC) electronics and sensors. For example, SiC integrated circuit (IC) electronics have matured to a state where a simple long-life scientific probe is feasible for extended Venus surface operations [1, 3]. Maturation of these high temperature electronics and other technologies has been part of NASA projects to provide an operational system for in situ exploration of the Venus surface for up to 60 days [1,3-4]. This is in parallel to work expanding the capabilities of the sensor technology to provide science measurements on the Venus surface. This technology development, as well as that for other planetary applications and intelligent high temperature engine operations, will be discussed.

engine monitoring↗

PEM-INST-001: Instructions for Plastic Encapsulated Microcircuit (PEM) Selection, Screening, and Qualification

Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect poor-quality lots and screen out early random failures from use in space flight hardware. However, since it cannot be guaranteed that quality was designed and built into PEMs that are appropriate for space applications, users cannot screen in quality that may not exist. It must be understood that due to the variety of materials, processes, and technologies used to design and produce PEMs, this test process may not accelerate and detect all failure mechanisms. While the tests herein will increase user confidence that PEMs with otherwise unknown reliability can be used in space environments, such testing may not guarantee the same level of reliability offered by military microcircuits. PEMs should only be used where due to performance needs there are no alternatives in the military high-reliability market, and projects are willing to accept higher risk.

Teverovsky, Alexander↗

Thermal Radiometer Signal Processing Using Radiation Hard CMOS Application Specific Integrated Circuits for Use in Harsh Planetary Environments

Thermal radiometers such as proposed for the Europa Clipper flyby mission require low noise signal processing for thermal imaging with immunity to Total Ionizing Dose (TID) and Single Event Latchup (SEL). Described is a second generation Multi- Channel Digitizer (MCD2G) Application Specific Integrated Circuit (ASIC) that accurately digitizes up to 40 thermopile pixels with greater than 50 Mrad (Si) immunity TID and 174 MeV-sq cm/mg SEL. The MCD2G ASIC uses Radiation Hardened By Design (RHBD) techniques with a 180 nm CMOS process node.

Focal Plane Assembly↗