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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
DOE OSTI2023

Digital fabrication of a small diameter polymer optical waveguide

A novel polymer optical waveguide and method of manufacturing is presented herein. A digitally manufactured process is described which utilizes a micro-dispensed UV optical adhesive as the contour guiding cladding, a fused deposition modeling technology for creating a core, and a subtractive laser process to finish the two ends of the optical interconnect. The optical waveguide can be printed directly on a circuit board in some embodiments. Alternatively, using a slightly modified process including a step to bond the optical fiber to the substrate, the optical interconnect can be manufactured on a flexible substrate.

Bhethanabotla, Venkat Rama↗
DOE OSTI2023

High Performing Inverted Flexible Perovskite Solar Cells via Solution Phase Deposition of Yttrium-Doped SnO 2 Directly on Perovskite

Solution processing of flexible perovskite solar cells (f-PSCs) provides an avenue for scalable, high-throughput printing of lightweight, scalable, and cost-effective flexible solar cells. However, the deposition of fully solution-processed metal oxide charge transport layers on perovskites has been limited by solvent incompatibilities and high processing temperatures for metal oxide nanoparticles. In this study, we present high-performance, inverted f-PSCs from the direct deposition of yttrium doped SnO 2 nanoparticles functionalized with acetate on top of perovskite as an ink in anhydrous ethanol via blade coating. Yttrium doping improved device performance by improving the charge extraction leading with a decreased series resistance leading to improvements in the open-circuit voltage and fill factor. Furthermore, the champion power conversion efficiency for 0.1 cm 2 devices increased from 14.3% for undoped SnO 2 to 18.2% with 2% Y:SnO 2 doping, which is unprecedented for f-PSCs on ITO-PET substrate employing SnO 2 as an ETL.

14 SOLAR ENERGY↗
DOE OSTI2021

Capacitively Coupled LAPPDs with 2D Pixelated Readout Planes for Time of Flight and Ring Imaging Cherenkov Applications

Large Area Picosecond Photon Detectors (LAPPDs) are micro-channel plate based photosensors featuring hundreds of square centimeters of sensitive area in a single package and capable of providing timing resolution on the order of 50 ps for single photon detection. However, LAPPDs currently do not exist in finely pixelated 2D readout configurations which, in addition to ighresolution timing, would also provide high spatial resolution required for Ring Imaging CHerenkov (RICH) detectors. One of the recent LAPPD models (Gen II) provides the opportunity to overcome the lack of pixellation by coupling an external readout to the sealed detector itself. The readout plane in this case is a simple printed circuit board (PCB) that can be laid out in a custom application-specific way for 1D or 2D sensitive area pixellation. This allows for a much shorter readout-plane prototyping cycle and provides unprecedented flexibility in choosing an appropriate segmentation that can be optimized for any particular detector need in terms of pad size, orientation, and shape.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
DOE OSTI2025

Direct writing of PVBVA/Ti 3 C 2 T x (MXene) triboelectric nanogenerators for energy harvesting and sensing applications

Triboelectric nanogenerators (TENGs) have gained recognition for their potential to convert mechanical energy into electrical energy, making them attractive for applications in healthcare, robotics, and human-device interfaces. However, many TENG devices rely on fluorinated polymers for high charge generation and involve complex fabrication processes, which limit their practicality and environmental sustainability. Here, we developed an eco-friendly composite of poly (vinyl butyral-co-vinyl alcohol-co-vinyl acetate) (PVBVA) and Ti 3 C 2 T x MXene for extrusion printing onto aluminum foil substrates, enabling the additive manufacturing of TENGs. Experimental results indicate that integrating 5.5 mg mL -1 of MXene (P-MX 5.5) into PVBVA resulted in a power density of 760 mW·m -2 , with simultaneous improvements in open-circuit voltage (129 %) and short-circuit current (250 %), demonstrating enhanced charge transfer efficiency. Beyond aluminum foil-based devices, we further explored the fully printed P-MX 5.5 TENG by utilizing silver ink electrodes, eliminating the need for aluminum foil. This fully printed, flexible TENG was successfully used for real-time human motion sensing, demonstrating its ability to detect activities such as walking, running, knee bending, and jumping. Collectively, our additively manufactured and sustainable PVBVA-MXene TENG composites, including both aluminum-based and fully printed versions, show promise for future energy harvesters, sensors, wearable electronics, healthcare, and robotic applications.

Additive manufacturing↗
DOE OSTI2022

Detecting Hardware Trojans in PCBs Using Side Channel Loopbacks

Malicious modifications to printed circuit boards (PCBs) are known as hardware Trojans. These may arise when malafide third parties alter PCBs premanufacturing or postmanufacturing and are a concern in safety-critical applications, such as industrial control systems. In this research, we examine how data-driven detection can be utilized to detect such Trojans at run-time. We develop a flexible and reconfigurable PCB test bed derived from the popular open-source programmable logic controller (PLC) platform “OpenPLC.” We then develop a Trojan detection framework, which utilizes and analyzes multimodal side channels (e.g., timing, magnetic signals, power, and hardware performance counters). We consider defender-configurable input/output (I/O) loopback test, comparison with design-document baselines, and magnetometer-aided monitoring of system behavior under defender-chosen excitations. Our approach can extend to golden-free environments. Golden (known-good) versions of the PCBs are assumed not available, but design information, datasheets, and component-level data are available. We demonstrate the efficacy of our approach on a range of Trojans instantiated in the test bed.

42 ENGINEERING↗
NASA NTRS1995

Digital Pulse-Width-Modulation Circuit

Digital pulse-width-modulation circuit provides programmable duration from 1 microsecond to full on, at repetition rate of 1 kHz. Designed for use in controlling CO2 laser, also used in applications in which precision and flexibility of digital control of pulse durations needed. Circuit incorporates low-power Schottky transistor/transistor-logic (TTL) devices in critical high-speed parts. Designed in TTL to make it compatible with Pro-Log 7914 (or equivalent) decoder input/output (I/O) utility printed-circuit card.

Wenzler, Carl J.↗
DOE OSTI2022

System for providing dynamic feedback for selective adhesion PCB production

A system for providing selective adhesion printed circuit board (PCB) production comprises a conveyor mechanism, a curing system, and a computer. The conveyor mechanism is configured to convey a series of selective adhesion blanks, wherein each selective adhesion blank is utilized to produce a PCB and includes a flexible film, a substrate, a conductive layer, and a curable adhesive. The conductive layer is formed from electrically conductive material and adhered to the substrate. The curable adhesive is positioned between the flexible film and the conductive layer and is configured to selectively bond with the conductive layer when the curable adhesive is cured. The curing system is configured to cure the curable adhesive. The computer includes a processing element configured or programmed to: receive a plurality of PCB designs, and direct the curing system to cure the curable adhesive of a plurality of selective adhesion blanks for each PCB design.

Hatch, Jonathan Douglas↗
DOE OSTI2021

Tamper-Indicating Enclosures with Visually Obvious Tamper Response

Sandia National Laboratories is developing a way to visualize molecular changes that indicate penetration of a tamper-indicating enclosure (TIE). Such "bleeding" materials (analogous to visually obvious, colorful bruised skin that doesn't heal) allows inspectors to use simple visual observation to readily recognize that penetration into a material used as a TIE has been attempted, without providing adversaries the ability to repair damage. Such a material can significantly enhance the current capability for TIEs, used to support treaty verification regimes. Current approaches rely on time-consuming and subjective visual assessment by an inspector, external equipment, such as eddy current or camera devices, or active approaches that may be limited due to application environment. The complexity of securing whole volumes includes: (1) enclosures that are non-standard in size/shape; (2) enclosures that may be inspectorate- or facility-owned; (3) tamper attempts that are detectable but difficult or timely for an inspector to locate; (4) the requirement for solutions that are robust regarding reliability and environment (including facility handling); and (5) the need for solutions that prevent adversaries from repairing penetrations. The approach is based on a transition metal ion solution within a microsphere changing color irreversibly when the microsphere is ruptured. Investigators examine 3D printing of the microspheres as well as the spray coating formulation. The anticipated benefits of this work are passive, flexible, scalable, cost-effective TIEs with obvious and robust responses to tamper attempts. This results in more efficient and effective monitoring, as inspectors will require little or no additional equipment and will be able to detect tamper without extensive time-consuming visual examination. Applications can include custom TIEs (cabinets or equipment enclosures), spray-coating onto facility-owned items, spray-coating of walls or structures, spray-coatings of circuit boards, and 3D-printed seal bodies. The paper describes research to-date on the sensor compounds and microspheres.

98 NUCLEAR DISARMAMENT, SAFEGUARDS, AND PHYSICAL P↗
DOE OSTI2026

Development of a Test-Bed for Testing and Refining EarthEn’s Supercritical CO 2 Based Energy Storage System

EarthEn’s energy storage concept leverages supercritical carbon dioxide (sCO 2 ) as a working fluid and relies on compact, high-performance components operating at elevated pressures and temperatures. To accelerate component development and reduce technical risk prior to larger-scale demonstrations, Oak Ridge National Laboratory (ORNL) developed a 100 kW-scale sCO 2 test-bed under a Cooperative Research and Development Agreement with EarthEn (CRADA NO. NFE-24-10050). The objective of the work was to design and construct a flexible experimental facility capable of reproducing key thermodynamic state points and heat-transfer conditions relevant to EarthEn’s thermal energy storage (TES) cycle, with particular emphasis on enabling development and evaluation of next-generation heat exchangers and TES concepts. The test-bed consists of a closed-loop sCO 2 circulation system housed within an open-topped enclosure. In its as-installed configuration, dense-phase sCO 2 is recirculated through a printed circuit recuperator, an electrically heated section, a throttling device used to simulate turbine expansion, and a water-cooled printed circuit heat exchanger that rejects heat to the building chilled-water system before returning to the pump. The pump is driven by a variable frequency drive, enabling controlled adjustment of flow and operating point. A comprehensive instrumentation suite was integrated to support both safe operation and high-quality data collection. Installed sensors include Coriolis flow meters for sCO 2 flow rate and density, resistance temperature detectors and thermocouples distributed throughout the loop (including the heated section and key heat exchanger ports), and pressure transducers for absolute and differential pressure measurements. The facility was designed to support high-pressure (19 MPa nominal) and high-temperature (575°C nominal) operation with credited overpressure protection provided by a rupture disk. Nominal operating conditions were selected to support 100 kW-class testing while maintaining flexibility for non-heated and heated shakedown, control development, and future integration of advanced TES test sections. In parallel with facility development, a system-level thermal-hydraulic model was created using Modelica-based tools to support component sizing, anticipate performance over targeted test conditions, and establish a framework for future model calibration against experimental data. At the conclusion of the project performance period, the facility was in final assembly, and the pressure boundary was nearly completed. However, several practical challenges associated with high-pressure/high-temperature systems and specialized component procurement impacted schedule and prevented initial pump-driven operation and full commissioning within the available resources. This report documents the as-built design, operating capabilities, and instrumentation, and it summarizes key lessons learned related to heater fabrication and testing, first-of-a-kind assembly factors, specialty flange supply constraints, and fill pump corrective actions. Finally, it outlines a phased plan for future commissioning and experimental campaigns, including control and instrumentation shakedown, heater characterization, model calibration, and testing at state points representative of EarthEn’s TES cycle.

25 ENERGY STORAGE↗
NASA NTRS1995

MEMS Technology for Space Applications

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

vandenBerg, A.↗
NASA NTRS2022

Solid-State Ultracapacitor Polymer Composite

An ultracapacitor made from a polymer loaded with ceramic powder would have several advantages over current ultracapacitors and batteries. First is the possibility of it being printable, which would allow for printing the energy storage device along with the circuit instead of having to find a way to add one later without damaging the rest of the components. When not printed in a specific design for use on a printed wiring board, this type of ultracapacitor could still be cured via a mold to a shape suitable to specific applications. Many polymers maintain some flexibility even after curing, such as the silicone used in this study. The manufacturing process would also be far simpler than that of conventional ultracapacitors.In this work, solid-state ultracapacitors were made by adding the dielectric powder to a two-part polymer (resin and hardener) at the same time. The mixture was then cured in the desired shape at a low temperature until completely set. The addition of the powder to the polymer increased its dielectric properties while leaving most of its physical properties unaltered. At higher powder loading percentages, there were some physical changes as the maximum loading point was approached. To determine the efficiency of these solid-state ultracapacitors, their capacitances were tested, and their dielectric constants (DCs) were measured and compared.

energy storage↗
NASA NTRS1994

Document analysis with neural net circuits

Document analysis is one of the main applications of machine vision today and offers great opportunities for neural net circuits. Despite more and more data processing with computers, the number of paper documents is still increasing rapidly. A fast translation of data from paper into electronic format is needed almost everywhere, and when done manually, this is a time consuming process. Markets range from small scanners for personal use to high-volume document analysis systems, such as address readers for the postal service or check processing systems for banks. A major concern with present systems is the accuracy of the automatic interpretation. Today's algorithms fail miserably when noise is present, when print quality is poor, or when the layout is complex. A common approach to circumvent these problems is to restrict the variations of the documents handled by a system. In our laboratory, we had the best luck with circuits implementing basic functions, such as convolutions, that can be used in many different algorithms. To illustrate the flexibility of this approach, three applications of the NET32K circuit are described in this short viewgraph presentation: locating address blocks, cleaning document images by removing noise, and locating areas of interest in personal checks to improve image compression. Several of the ideas realized in this circuit that were inspired by neural nets, such as analog computation with a low resolution, resulted in a chip that is well suited for real-world document analysis applications and that compares favorably with alternative, 'conventional' circuits.

Graf, Hans Peter↗
NASA NTRS2016

Command and Data Handling Branch Internship

Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.

Billings, Rachel Mae↗
NASA NTRS2003

Signal-Conditioning Amplifier Recorders

Signal-conditioning amplifier recorders (SCAmpRs) have been proposed as a means of simplifying and upgrading the Kennedy Space Center (KSC) Ground Measurement System (GMS), which is a versatile data-acquisition system that gathers and records a variety of measurement data before and during the launch of a space shuttle. In the present version of the GMS system, signal conditioning amplifiers digitize and transmit data to a VME chassis that multiplexes up to 416 channels. The data is transmitted via a high-speed data bus to a second VME chassis where it is available for snapshots. The data is passed from the second VME chassis to a high-speed data recorder. This process is duplicated for installations at two launch pads and the Vehicle Assembly Building (VAB). Since any failure of equipment in the data path results in loss of data, much of the system is redundant. The architecture of the existing GMS limits expansion or any modification to the system to meet changing requirements because of the cost and time required. A SCAmpR-based system is much more flexible. The basis of the simplification, flexibility, and reliability is the shifting of the recording function to the individual amplifier channels. Each SCAmpR is a self-contained single channel data acquisition system, which in its current implementation, has a data storage capacity of up to 30 minutes when operating at the fastest data sampling rates. The SCAmpR channels are self-configuring and self-calibrating. Multiple SCAmpR channels are ganged on printed circuit boards and mounted in a chassis that provides power, a network hub, and Inter-Range Instrument Group (IRIG) time signals. The SCAmpR channels share nothing except physical mounting on a circuit board. All circuitry is electrically separate for each channel. All that is necessary to complete the data acquisition system is a single master computer tied to the SCAmpR channels by standard network equipment. The size of the data acquisition system dictates the requirements for the specific network equipment.

Medelius, Pedro J.↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origamiinspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigidflex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL’s Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

de la Croix, Jean-Pierre↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origami-inspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigid-flex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL's Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

John Bell↗
NASA NTRS1977

A lightweight solar array study

A sample module was assembled to model a portion of a flexible extendable solar array, a type that promises to become the next generation of solar array design. The resulting study of this module is intended to provide technical support to the array designer for lightweight component selection, specifications, and tests. Selected from available lightweight components were 127-micron-thick wrap-around contacted solar cells, 34- micron-thick sputtered glass covers, and as a substrate a 13-micron-thick polyimide film clad with a copper printed circuit. Each component displayed weaknesses. The thin solar cells had excessive breakage losses. Sputtered glass cover adhesion was poor, and the covered cell was weaker than the cell uncovered. Thermal stresses caused some cell delamination from the model solar array substrate.

Josephs, R. H.↗
DOE OSTI2026

Higher Efficiency, Demand Flexible Refrigerator with On-Demand Micro-Vibrational De-icing Technology

Refrigerator technology has advanced significantly over the last couple of decades. Today’s refrigerators use only about 25% of the energy that was required to power models built in 1975. Even as they continually improve efficiency to meet standards, refrigerators have increased in size by almost 20%, added energy-consuming features such as through-the-door ice, and provide more benefits than ever before. However, a few challenges and technology gaps are preventing further improvement of the demand responsiveness and efficiency of the refrigerators. One of the major technology gaps in existing refrigerators is their outdated de-icing process. When the evaporator generates frost, an old-fashioned resistive heating element melts the ice. Most refrigerators have a timed defrost cycle, rather than an active system that could monitor the state of the frost. In these systems, not only is the precious electricity used at its least efficient form of conversion (direct conversion of electricity to heat), but also all the latent heat associated with the ice is wasted during the melting process. On top of that, the refrigerator needs to work harder to pull the temperature down after defrosting, and, last but not least, the food quality is severely impacted by the temperature swings during the defrost cycle. According to a study, the EU alone wastes 89 million tons of food in the supply chain every year. Any temperature swing during defrosting (about 6F according to Emerson for low-temperature cases) can negatively impact the shelf life of meat and other products for multiple days. All these issues can happen during the peak demand time of the electric grid. Unlike the conventional systems, the proposed novel advanced micro-vibrational deicing process uses no heat for defrosting. Instead, it uses the micro vibrations generated by a piezoelectric or vibration-generating module to mechanically break ice from the heat exchanger almost instantaneously. The project titled “Higher Efficiency, Demand Flexible Refrigerator with On-Demand Micro-Vibrational De-icing Technology, performed by Ultrasonic Technology Solutions, LLC (UTS) of Knoxville, TN, in collaboration with Emerson (now Copeland), represents the final phase of a multi-year effort funded under the U.S. Department of Energy’s Building Technologies Office (BTO) BENEFIT FOA 2020. Initiated on October 1, 2021, and completed after a nine-month no-cost extension ending September 30, 2025, this project aimed to develop and validate a novel micro-vibrational mechanical defrosting system, achieving more than 25% improvement in defrosting energy efficiency over conventional baseline defrosting technologies. Over sixteen quarters, the project advanced from fundamental ice-mechanical characterization and prototype development to full-scale system integration and validation. Initial efforts established project management infrastructure and characterized ice adhesion properties, followed by the design and fabrication of early aluminum-based prototypes for resonance frequency testing. Subsequent quarters saw rapid technical progression, including the identification of optimal piezoelectric and motor-based vibration mechanisms, the demonstration of effective de-icing over 6x6-inch aluminum surfaces. The team achieved its Go/No-Go milestone by exceeding the 25% energy-efficiency improvement target—reaching up to 3,340% under optimized conditions—and later confirmed that motor-driven systems offered superior performance and energy efficiency compared to piezoelectric alternatives. Continued refinement led to the development of amplifier systems on printed circuit boards, improved control and instrumentation hardware, and integration into full-scale heat exchanger (HX) prototypes at both UTS and Copeland facilities. Multiple vibration-mounting studies and frost-growth experiments guided mechanical optimization and noise-mitigation strategies, achieving a 17.5 dB reduction in sound pressure level and verifying robust mechanical performance. Advanced analyses, including modal and harmonic simulations, established a quantitative understanding of vibrational behavior and de-icing efficiency across >1000 cm² systems. The final project phase successfully demonstrated scalable integration within reach-in and chest freezer prototypes, confirmed >25% efficiency improvements in large-area systems, and completed a comprehensive business model and scale-up strategy identifying electric defrost systems as the primary beachhead market. The culmination of this DOE-supported effort establishes micro-vibrational defrosting as a viable, high-efficiency, low-noise, and demand-flexible de-icing technology, paving the way for commercial deployment and broader application in next-generation refrigeration systems.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗