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At least 73 records · Page 4

All sources NASA NTRS DOE OSTI

NASA NTRS2015

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗

DOE OSTI2024

AEcroscopy: A Software–Hardware Framework Empowering Microscopy Toward Automated and Autonomous Experimentation

Microscopy has been pivotal in improving the understanding of structure-function relationships at the nanoscale and is by now ubiquitous in most characterization labs. However, traditional microscopy operations are still limited largely by a human-centric click-and-go paradigm utilizing vendor-provided software, which limits the scope, utility, efficiency, effectiveness, and at times reproducibility of microscopy experiments. Here, in this work, a coupled software–hardware platform is developed that consists of a software package termed AEcroscopy (short for Automated Experiments in Microscopy), along with a field-programmable-gate-array device with LabView-built customized acquisition scripts, which overcome these limitations and provide the necessary abstractions toward full automation of microscopy platforms. The platform works across multiple vendor devices on scanning probe microscopes and electron microscopes. It enables customized scan trajectories, processing functions that can be triggered locally or remotely on processing servers, user-defined excitation waveforms, standardization of data models, and completely seamless operation through simple Python commands to enable a plethora of microscopy experiments to be performed in a reproducible, automated manner. This platform can be readily coupled with existing machine-learning libraries and simulations, to provide automated decision-making and active theory-experiment optimization to turn microscopes from characterization tools to instruments capable of autonomous model refinement and physics discovery.

47 OTHER INSTRUMENTATION↗

NASA NTRS1993

Micro-video display with ocular tracking and interactive voice control

In certain space-restricted environments, many of the benefits resulting from computer technology have been foregone because of the size, weight, inconvenience, and lack of mobility associated with existing computer interface devices. Accordingly, an effort to develop a highly miniaturized and 'wearable' computer display and control interface device, referred to as the Sensory Integrated Data Interface (SIDI), is underway. The system incorporates a micro-video display that provides data display and ocular tracking on a lightweight headset. Software commands are implemented by conjunctive eye movement and voice commands of the operator. In this initial prototyping effort, various 'off-the-shelf' components have been integrated into a desktop computer and with a customized menu-tree software application to demonstrate feasibility and conceptual capabilities. When fully developed as a customized system, the interface device will allow mobile, 'hand-free' operation of portable computer equipment. It will thus allow integration of information technology applications into those restrictive environments, both military and industrial, that have not yet taken advantage of the computer revolution. This effort is Phase 1 of Small Business Innovative Research (SBIR) Topic number N90-331 sponsored by the Naval Undersea Warfare Center Division, Newport. The prime contractor is Foster-Miller, Inc. of Waltham, MA.

Miller, James E.↗

NASA NTRS2016

Galaxy Evolution Spectroscopic Explorer: Scientific Rationale

GESE is a mission concept consisting of a 1.5-m space telescope and UV multi-object slit spectrograph designed to help understand galaxy evolution in a critical era in the history of the universe, where the rate of star-formation stopped increasing and started to decline. To isolate and identify the various processes driving the evolution of these galaxies, GESE will obtain rest-frame far-UV spectra of 100,000 galaxies at redshifts, z approximately 1-2. To obtain such a large number of spectra, multiplexing over a wide field is an absolute necessity. A slit device such as a digital micro-mirror device (DMD) or a micro-shutter array (MSA) enables spectroscopy of a hundred or more sources in a single exposure while eliminating overlapping spectra of other sources and blocking unwanted background like zodiacal light. We find that a 1.5-m space telescope with a MSA slit device combined with a custom orbit enabling long, uninterrupted exposures (approximately 10 hr) are optimal for this spectroscopic survey. GESE will not be operating alone in this endeavor. Together with x-ray telescopes and optical/near-IR telescopes like Subaru/Prime Focus Spectrograph, GESE will detect "feedback" from young massive stars and massive black holes (AGN's), and other drivers of galaxy evolution.

digital micro-mirror device (DMD)↗

DOE OSTI2026

Characterization of lateral amorphous selenium photodetectors for low-photon and VUV detection at cryogenic temperatures

The performance of amorphous selenium (a-Se) as a cryogenic photodetector material is evaluated through a series of experiments using laterally structured devices operated in a custom optical test stand. These studies investigate the response of a-Se detectors to low-photon fluxes at high electric fields near avalanche conditions, the linearity of the photoconductive response over a wide dynamic range and the direct detection of narrowband 130 nm vacuum ultraviolet (VUV) illumination. At 87 K, matched-filter analysis shows reliable single-shot detection with efficiencies ≥80% and area under the curve (AUC) ≥ 0.85 using as few as ∼ 6800 incident 401 nm photons, corresponding to ∼ 3400 photons within field-active regions after accounting for geometric constraints. Measurements are performed at cryogenic temperatures using calibrated photon fluxes derived from a silicon photomultiplier reference and a characterized optical filter stack. Additional experiments using a tellurium-doped a-Se (a-SeTe) device explore the material's behavior under identical test conditions and demonstrate that avalanche is achievable in a-SeTe at cryogenic temperatures. The results demonstrate reproducible low-noise operation, VUV sensitivity and field-dependent gain behavior in a lateral a-Se architecture, representing the first reported observation of avalanche multiplication in laterally structured a-Se and a-SeTe devices at cryogenic temperatures. These findings support the potential integration of laterally structured a-Se devices into next-generation pixelated liquid-argon time projection chambers (TPCs) requiring scalable, high-field-compatible photon detection systems.

Amorphous selenium↗

DOE OSTI2025

Characterization of Lateral Amorphous Selenium Photodetectors for Low-Photon and VUV Detection at Cryogenic Temperatures

The performance of amorphous selenium (a-Se) as a cryogenic photodetector material is evaluated through a series of experiments using laterally structured devices operated in a custom optical test stand. These studies investigate the response of a-Se detectors to low-photon fluxes at high electric fields near avalanche conditions, the linearity of the photoconductive response over a wide dynamic range and the direct detection of narrowband 130 nm vacuum ultraviolet (VUV) illumination. At 87 K, matched-filter analysis shows reliable single-shot detection with efficiencies greater than or equal to 80 percent and area under the curve (AUC) greater than or equal to 0.85 using as few as approximately 6800 incident 401 nm photons, corresponding to approximately 3400 photons within field-active regions after accounting for geometric constraints. Measurements are performed at cryogenic temperatures using calibrated photon fluxes derived from a silicon photomultiplier reference and a characterized optical filter stack. Additional experiments using a tellurium-doped a-Se (a-SeTe) device explore the material's behavior under identical test conditions and demonstrate that avalanche is achievable in a-SeTe at cryogenic temperatures. The results demonstrate reproducible low-noise operation, VUV sensitivity and field-dependent gain behavior in a lateral a-Se architecture, representing the first reported observation of avalanche multiplication in laterally structured a-Se and a-SeTe devices at cryogenic temperatures. These findings support the potential integration of laterally structured a-Se devices into next-generation pixelated liquid-argon time projection chambers (TPCs) requiring scalable, high-field-compatible photon detection systems.

FOS: Physical sciences↗

DOE OSTI2026

Impedance Based Fixture Neutralization (FINE) Method to Replicate Field Environments in Laboratory Settings

Test article vibration test responses will vary from one test laboratory to another due to differences in shaker and fixture dynamic characteristics. This is also seen between the field and laboratory due to the differing dynamic characteristics between field assembly loading and boundary conditions compared to the laboratory configuration. This work introduces a technique called Impedance Fixture Neutralization which customizes input forces to cause consistent responses for the Device Under Test across different vibration testing conditions. The customized force neutralizes the dynamic variations between configurations for the Device Under Test. The device responses can be replicated in several situations: when using a different fixture with the same attachment points, when the test article mounting location on the fixture changes, when the force location changes, or any combination of these situations. Impedance Fixture Neutralization uses the uncoupled dynamic characteristics of the test article and excitation fixtures to customize the input thereby causing the same test article responses between two mounting configurations (either field to laboratory or two different laboratory configurations). The application of the technique is shown using an analytical model of a two-beam system and analytically using experimental FRFs from plate and frame component hardware characterization tests. In both cases a device under test is attached to two test fixtures wherein the dynamic differences in the configurations are neutralized.

Laboratory↗

DOE OSTI2024

Defect‐Free Nanowelding of Bilayer SnSe Nanoplates

Nanowelding is a bottom‐up technique to create custom‐designed nanostructures and devices beyond the precision of lithographic methods. Here, a new technique is reported based on anisotropic lubricity at the van der Waals interface between monolayer and bilayer SnSe nanoplates and a graphene substrate to achieve precise control of the crystal orientation and the interface during the welding process. As‐grown SnSe monolayer and bilayer nanoplates are commensurate with graphene's armchair direction but lack commensuration along graphene's zigzag direction, resulting in a reduced friction along that direction and a rail‐like, 1D movement that permits joining nanoplates with high precision. This way, molecular beam epitaxially grown SnSe nanoplates of lateral sizes 30–100 nm are manipulated by the tip of a scanning tunneling microscope at room temperature. In situ annealing is applied afterward to weld contacting nanoplates without atomic defects at the interface. This technique can be generalized to any van der Waals interfaces with anisotropic lubricity and is highly promising for the construction of complex quantum devices, such as field effect transistors, quantum interference devices, lateral tunneling junctions, and solid‐state qubits.

2D ferroelectrics↗

NASA NTRS1999

Plug and Play Integration through Space Object Standardization

Plug and play is an industry standard promoted by Intel and Microsoft, and others that allows users to add and remove various input and output devices without making specific customizations to their systems. The idea behind concept is that using standard products eases integration of components and promotes capabilities of conforming products. The concept works because vendors comply with a standard specification. This paper reports the development of a reference architecture for the mission control domain, which is leveraging off this revolutionary concept. Standards are being developed at the application layer, which enable "plug and play" of mission software products. A Mission Control, reference architecture has been defined. For each sub-domain, the interfaces are modeled in Interface Definition Language (IDL). A subset of the IDL has been developed within both commercial off-the-shelf (COTS) and government (GOTS) products. Selected vendors have agreed to modify their products to be compatible with the defined IDL. The plug and play integration of these different products has been validated in a demonstration testbed.

Boyce, Leslye↗

NASA NTRS2014

Improved Measurement of Ejection Velocities From Craters Formed in Sand

A typical impact crater is formed by two major processes: compression of the target (essentially equivalent to a footprint in soil) and ejection of material. The Ejection-Velocity Measurement System (EVMS) in the Experimental Impact Laboratory has been used to study ejection velocities from impact craters formed in sand since the late 1990s. The original system used an early-generation Charge-Coupled Device (CCD) camera; custom-written software; and a complex, multicomponent optical system to direct laser light for illumination. Unfortunately, the electronic equipment was overtaken by age, and the software became obsolete in light of improved computer hardware.

Cintala, Mark J.↗

NASA NTRS2021

Customized Science Carrier Modules and Accessories Developed for Microgravity Simulation Devices

Because the access to the true weightless environment of the ISS and other Low Earth Orbit (LEO) vehicles is limited and cost prohibitive, the need for ground-based microgravity simulation analogs to bridge the gravity continuum gap between 1g gravity and costly space flight studies with true weightlessness was realized. As such, the Microgravity Simulation Support Facility (MSSF) was established at NASA John F. Kennedy Space Center (KSC) to fulfill the need of the scientific community. Our facility provides the US science community with a focal point in the field of gravitational research by granting access to an array of two-dimensional(2D) and three-dimensional (3D)clinostats, and Random Positioning Machine (RPM) platforms developed by teams throughout the world. The availability of these capabilities will allow further understanding the role of altered gravity vectors from “functional weightlessness”, partial gravity conditions (1 x 10-3to 0.9g, and Moon and Mars ‘g vectors), to hypergravity (up to3g) on biological processes. We have designed and 3D printed a variety of specialized attachments(and associated “static control” hardware)to allow researchers to mount their samples onto these microgravity simulation devices to meet their unique science requirements. A summary of each attachment module will be presented below. Note: All software or code information should be requested to the author Ye Zhang, Kennedy Space Center ye.zhang-1@nasa.gov

Ye Zhang↗

NASA NTRSDate not supplied

Customized Science Carrier Modules and Accessories Developed for Microgravity Simulation Devices

Explore the source record for details and available documents.

Ye Zhang↗

DOE OSTI2023

Asymmetric Electrode Work Function Customization via Top Electrode Replacement in Ferroelectric and Field–Induced Ferroelectric Hafnium Zirconium Oxide Thin Films

Non-volatile memory device structures such as ferroelectric random-access memory and ferroelectric tunnel junctions employ switchable spontaneous polarization to hold binary states. These devices can potentially benefit from the imposition of spontaneous internal biases and their resulting effect on the polarization properties of the ferroelectric (or field-induced ferroelectric/ antiferroelectric) layer. While HfO 2 -based thin films are ideal candidates for implementation into these devices due to their scalability and silicon compatibility, the phase purity of these oxides is sensitive to the selection of electrode material, preventing incorporation of asymmetric electrode layers into such structures. Within this work, electrode replacement following post-metallization anneal processing is introduced as a route to achieve ferroelectric and field-induced ferroelectric Hf x Zr 1–x O 2 (HZO) thin films with electrode-independent phase constitutions. The effects of this process and the corresponding internal biases imposed across the HZO layers due to asymmetric work functions are investigated. It is shown that internal biases vary in magnitude in accordance with prediction based on the work functions of the replaced electrode layers and affect remanent polarization magnitudes. Accordingly, electrode replacement presents a processing route that can readily produce HZO films with spontaneous internal biases and electrode- independent phase constitutions, facilitating implementation of these ferroelectrics into the next generation device structures.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Electric component including custom metal grain orientation

An electrical device includes an electromagnetic component configured to generate a magnetic flux. The electromagnetic component includes a soft magnetically-conductive material configured to pass magnetic flux therethrough along a flux path. The soft magnetically-conductive material includes at least one grain oriented portion having metal grains that are oriented parallel with respect to the magnetic flux.

42 ENGINEERING↗

DOE OSTI2022

Electric component including custom metal grain orientation

42 ENGINEERING↗

NASA NTRS2004

High-Temperature Probe Station Developed to Characterize Microwave Devices Through 500 C

A photograph and a block diagram of the high-temperature probe station are shown. The system consists of the ceramic heater mounted on a NASA shuttle tile insulator, a direct current power supply, a personal-computer-based data acquisition and temperature controller, microwave probes, a microscope, and a network analyzer. The ability to perform microwave tests at high temperatures is becoming necessary. There is now a need for sensors and communication circuits that can operate at 500 C and above for aircraft engine development and monitoring during flight. To address this need, researchers have fabricated devices using wide bandgap semiconductors such as SiC with targeted operating temperatures of 500 to 600 C. However, the microwave properties of these devices often change drastically with temperature, so any designs that are intended to be used in such an environment must be characterized at high temperatures. For some reliability, lifetime, and direct-current testing, the device under test can be packaged and characterized in an oven. However, for RF and microwave measurements, it is usually not possible to establish a calibrated reference plane at the device terminals within a package. In addition, the characteristics of the package would vary over a 500 C temperature range, and this would have to be accounted for when the data were analyzed. A high temperature probe station allows circuits and devices to be characterized through on wafer measurements across a broad temperature range with known reference plane. The conventional, commercially available thermal wafer-probe stations that are used to evaluate microwave devices across a controlled temperature range have a typical upper limit of 200 C. Standalone thermal heating chucks are available with an extended upper temperature range of 300 to 400 C. To effectively characterize devices at temperatures up to and surpassing 500 C, Glenn researchers developed a custom probe station. In the past, custom probe stations have been developed to test devices under other extreme environments, such as cryogenic temperatures as low as 37 K. Similarly, this custom probe station was specifically modified for high-temperature use. It allows devices to be measured quickly and flexibly, without the use of wire bonds and test fixtures. The probe station is shown making scattering parameter measurements from 1 to 50 GHz with a Hewlett-Packard 8510C Network Analyzer. There is a half-wafer of silicon directly on top of the heater to provide a uniform heated platform for our sample. A quarter wafer of silicon carbide forms the substrate for our test circuit of several transmission lines.

Downey, Alan N.↗

DOE OSTI2025

AC to AC Solid State Transformer with Bidirectional Switches

This report details the work of the 3-year project for the AC-to-AC Solid State Transformer with Bidirectional Switches project devoted to developing and demonstrated a Type I Solid State Transformer. This report details the design, fabrication, and evaluation of both three-phase and single-phase versions of this solid state transformer operating as a single module, modules in parallel, and modules in cascade. Additionally, this report details the fabrication and evaluation of custom Silicon Carbide bidirectional switches to enable this topology with a comparison between monolithically integrated bidirectional switches as well as co-packaged back-to-back unidirectional devices. Finally, results for custom-fabricated Fe 4 N/ferrite laminated toroidal cores for high frequency transformers are present.

42 ENGINEERING↗

DOE OSTI2020

Thermophotovoltaic Heat Engine

This project was aimed at developing a thermophotovoltaic device that efficiently converts thermal radiation to electrical power. Historically, TPV devices have been plagued by poor robustness; this project sought to overcome this by merging innovations in nanophotonics, photovoltaics, and robust thermal engineering. Efforts were focused on developing high efficiency TPV devices which may drastically alter the electricity sector by enabling efficient (> 20%), fuel-flexible (any combustion fuel), distributed (< 10 kW) power generation. The project research identified the technical performance limits, technology differentiator, and customer value proposition for TPV devices and established technical performance requirements for a minimum viable product.

30 DIRECT ENERGY CONVERSION↗