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At least 73 records · Page 4

All sources NASA NTRS DOE OSTI

NASA NTRS2016

Optimized Heat Pipe Backup Cooling System Tested with a Stirling Convertor

In a Stirling Radioisotope Power System (RPS), heat must be continuously removed from the General Purpose Heat Source (GPHS) modules to maintain the modules and surrounding insulation at acceptable temperatures. The Stirling convertor normally provides this cooling. If the Stirling convertor stops in the current system, the insulation is designed to spoil, preventing damage to the GPHS at the cost of an early termination of the mission. An alkali-metal variable conductance heat pipe (VCHP) can be used to passively allow multiple stops and restarts of the Stirling convertor by bypassing the heat during stops. In a previous NASA Small Business Innovation Research (SBIR) Program, Advanced Cooling Technologies, Inc. (ACT) developed a series of sodium VCHPs as backup cooling systems for the Stirling RPS. In 2012, one of these VCHPs was successfully tested at NASA Glenn Research Center with a Stirling convertor as an Advanced Stirling Radioisotope Generator (ASRG) backup cooling system. The prototype; however, was not optimized and did not reflect the final heat rejection path. ACT through further funding has developed a semioptimized prototype with the finalized heat path for testing at Glenn with a Stirling convertor. The semioptimized system features a two-phase radiator and is significantly smaller and lighter than the prior prototype to reflect a higher level of flight readiness. The VCHP is designed to activate and remove heat from the GPHS during stoppage with a small temperature increase from the nominal vapor temperature. This small temperature increase from nominal is low enough to avoid risking standard ASRG operation and spoiling of the multilayer insulation (MLI). The VCHP passively allows the Stirling convertor to be turned off multiple times during a mission with potentially unlimited off durations. Having the ability to turn the Stirling off allows for the Stirling to be reset and reduces vibrations on the platform during sensitive measurements or procedures. This paper presents the design of the VCHP and its test results with a Stirling convertor at Glenn. Tests were carried for multiple on and off cycles to demonstrate repeatability. The impacts associated with the addition of the VCHP to the system are also addressed in terms of mass and additional heat losses due to the presence of the VCHP.

Heat Pipe↗

DOE OSTI2021

Sustainable and Inexpensive Polydimethylsiloxane Sponges for Daytime Radiative Cooling

Radiative cooling is an emerging cooling technology that can passively release heat to the environment. To obtain a subambient cooling effect during the daytime, chemically engineered structural materials are widely explored to simultaneously reject sunlight and preserve strong thermal emission. However, many previously reported fabrication processes involve hazardous chemicals, which can hinder a material’s ability to be mass produced. In order to eliminate the hazardous chemicals used in the fabrication of previous works, this article reports a white polydimethylsiloxane (PDMS) sponge fabricated by a sustainable process using microsugar templates. By substituting the chemicals for sugar, the manufacturing procedure produces zero toxic waste and can also be endlessly recycled via methods widely used in the sugar industry. The obtained porous PDMS exhibits strong visible scattering and thermal emission, resulting in an efficient temperature reduction of 4.6 °C and cooling power of 43 W m –2 under direct solar irradiation. In addition, due to the air-filled voids within the PDMS sponge, its thermal conductivity remains low at 0.06 W (m K) –1 . This unique combination of radiative cooling and thermal insulation properties can efficiently suppress the heat exchange with the solar-heated rooftop or the environment, representing a promising future for new energy-efficient building envelope material.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2022

Multiphysics Analysis of Load Following and Safety Transients for MicroReactors

The tools developed within the U.S. Department of Energy (DOE) Office of Nuclear Energy’s Nuclear Energy Advanced Modeling and Simulation (NEAMS) program aim at providing high fidelity multiphysics modeling capabilities to support design and licensing of various types of advanced nuclear reactors, including the technologies being developed by U.S. microreactor vendors relying on heat pipe and gas-cooled technologies. In FY-2022, the NEAMS Multiphysics Applications team made significant progress both in demonstrating capabilities applied to microreactor problems, and in supporting NEAMS developers.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

DOE OSTI2022

Advanced Power Electronics and Electric Machines [Slides]

The presentation provides an overview of NREL's Advanced Power Electronics and Electric Machines (APEEM) group and its research activities. Power electronics thermal management systems for electric-drive vehicles are described and performance metrics are provided. Additionally, advanced cooling technologies developed at NREL are presented. Finally, an overview is provided for electric machine cooling, integrated drives, and thermomechanical research.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2023

LA100 Equity Strategies. Chapter 6: Universal Access to Safe and Comfortable Home Temperatures

The LA100 Equity Strategies project integrates community guidance with robust research, modeling, and analysis to identify strategy options that can increase equitable outcomes in Los Angeles' clean energy transition. This chapter focuses on housing weatherization and cooling technologies as means to increase access to safe and comfortable home temperatures. Lack of cooling access and use can have severe health impacts on building occupants during heat waves. Specifically, NREL developed and used a residential building stock model to simulate the energy use of 50,000 dwellings representing the diversity of housing types, appliances, climate zones, and household incomes across Los Angeles. We compared a baseline scenario with seven upgrade scenarios. Five scenarios cooled the entire household and featured cooling systems at varying efficiency levels with various improvements to the envelope, roof, and shading, and two scenarios cooled a single room in a household with no prior cooling using either a room air-conditioning or a heat pump system. For each scenario, we evaluated impacts on utility bills, payback periods, and changes in energy burdens, as well as ability to achieve safe and comfortable temperatures. We also examined the effects of building types (multifamily vs. single-family) on indoor air temperatures. Based on the results of modeling, analysis, and community guidance, we identified six short-term and two long-term strategies for improving access to building envelope upgrades and cooling strategies that could save lives and maintain safe home temperatures for Los Angeles' low-income households during heat waves. Research was guided by input from the community engagement process, and associated equity strategies are presented in alignment with that guidance.

air conditioning↗

DOE OSTI2024

Compatibility of LaFe13−x−yMnxSiyH1.6 and Eutectic Liquid GaInSn Alloy

The heat transfer rate of magnetocaloric regenerators is a topic of extensive research and the cyclability of these regenerators is critical to the operation of systems with a high coefficient of performance (e.g., potentially >22, significantly higher than typical vapor compression cooling technologies). To enable a high operating frequency that will result in a high specific cooling power, the heat transfer fluid should have high thermal conductivity and lower specific heat, i.e., higher thermal diffusivity. Eutectic metal alloys possess these qualities, such as gallium–indium–tin (Galinstan), whose thermal diffusivity has been found to be approximately an order of magnitude higher than water. For this study, the effects of eutectic liquid Galinstan exposure on the phase stability of LaFe13−x−yMnxSiyH1.6 magnetocaloric powders in an active magnetic regenerator device were investigated. The powders were characterized before and after exposure to Galinstan using X-ray diffraction, in which the phases were determined using the Rietveld refinement technique and X-ray fluorescence. It was found that after Galinstan exposure, hydrogen containing phases were present in the powder, suggesting that the hydrogen was lost from the magnetocaloric phase. The magnetocaloric phase degradation indicates that the powder was incompatible with the Galinstan metal in an environment with moisture.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

NASA NTRS1999

Thermal and Mechanical Microspacecraft Technologies for X-2000 Future Deliveries

Thermal and mechanical technologies are an important part of the X-2000 Future Delivery (X-2000 FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by the X-2000 FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The X2000 FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. One of the key ideas used in the development of these technologies and architecture is that several functions be in included in each of the thermal and mechanical elements. One of the thermal architecture being explored for the X-2000 FD microspacecraft is integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to X-2000 FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper to be presented at the 1999 conference, will describe the progress made so far in the microspacecraft thermal and mechanical technologies and approaches for the X2000 Future Deliveries microspacecraft.

Birur, Gaj↗

NASA NTRS1999

Thermal and Mechanical Microspacecraft Technologies for Deep Space Systems Program X2000 Future Deliveries

Thermal and mechanical technologies are an important part of the Deep Space Systems Technology (DSST) Program X2000 Future Deliveries (FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by DSST FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The DSST FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. Two of the key ideas used in the development of thermal and mechanical technologies and architectures are: 1) to include several of the thermal and mechanical functions in any given single spacecraft element and 2) the architecture be modular so that it can easily be adapted to any of the future missions. One of the thermal architectures being explored for the DSST FD microspacecraft is the integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to DSST FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper describes the current state of the technologies and progress to be made in the thermal and mechanical technologies and approaches for the DSST Future Deliveries microspacecraft.

Birur, Gajanana C.↗

NASA NTRS1981

An experimental investigation of the aerodynamics and cooling of a horizontally-opposed air-cooled aircraft engine installation

A flight-test based research program was performed to investigate the aerodynamics and cooling of a horizontally-opposed engine installation. Specific areas investigated were the internal aerodynamics and cooling mechanics of the installation, inlet aerodynamics, and exit aerodynamics. The applicable theory and current state of the art are discussed for each area. Flight-test and ground-test techniques for the development of the cooling installation and the solution of cooling problems are presented. The results show that much of the internal aerodynamics and cooling technology developed for radial engines are applicable to horizontally opposed engines. Correlation is established between engine manufacturer's cooling design data and flight measurements of the particular installation. Also, a flight-test method for the development of cooling requirements in terms of easily measurable parameters is presented. The impact of inlet and exit design on cooling and cooling drag is shown to be of major significance.

Miley, S. J.↗

DOE OSTI2024

A One-dimensional Heat Transfer Model for a Cooled Airfoil in a Direct-fired Supercritical CO 2 Turbine

A one-dimensional (1-D) heat transfer model was developed to predict the performance of a cooled airfoil for a supercritical carbon dioxide (sCO 2 ) turbine. The model included the effects of film cooling effectiveness, thermal barrier coating thickness, and internal Nusselt number augmentation. Trends for overall cooling effectiveness versus heat load parameter were obtained for over twelve unique thermal management schemes. The study found that adding a thermal barrier coating was the most effective scheme for increasing the airfoil overall cooling effectiveness. Internal cooling technologies have diminishing returns as the heat transfer coefficient augmentation increases past a factor of five, however the sensitivity of overall cooling effectiveness to heat transfer augmentation scales by a factor of 1.3 when a thermal barrier coating is introduced. Film cooling is seen as a long-term research area which will be inevitably explored as direct sCO 2 systems develop a market presence. However, the model indicates that realizable film cooling effectiveness levels yield a smaller improvement in overall cooling effectiveness than a thermal barrier coating.

42 ENGINEERING↗

NASA NTRS2008

Intelligent Engine Systems: Thermal Management and Advanced Cooling

The objective is to provide turbine-cooling technologies to meet Propulsion 21 goals related to engine fuel burn, emissions, safety, and reliability. Specifically, the GE Aviation (GEA) Advanced Turbine Cooling and Thermal Management program seeks to develop advanced cooling and flow distribution methods for HP turbines, while achieving a substantial reduction in total cooling flow and assuring acceptable turbine component safety and reliability. Enhanced cooling techniques, such as fluidic devices, controlled-vortex cooling, and directed impingement jets, offer the opportunity to incorporate both active and passive schemes. Coolant heat transfer enhancement also can be achieved from advanced designs that incorporate multi-disciplinary optimization of external film and internal cooling passage geometry.

Bergholz, Robert↗

DOE OSTI2023

Power Electronics Thermal Management

The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).

ADVANCED PROPULSION SYSTEMS↗

DOE OSTI2020

Performance of Public Film Cooling Geometries Produced Through Additive Manufacturing

Abstract Film cooling is an essential cooling technology to allow modern gas turbines to operate at high temperatures. For years, researchers in this community have worked to improve the effectiveness of film cooling configurations by maximizing the coolant coverage and minimizing the heat flux from the hot gas into the part. Working toward this goal has generated many promising film cooling concepts with unique shapes and configurations. However, until recently, many of these designs were challenging to manufacture in actual turbine hardware due to limitations with legacy manufacturing methods. Now, with the advances in additive manufacturing, it is possible to create turbine parts using high-temperature nickel alloys that feature detailed and unique geometry features. Armed with this new manufacturing power, this study aims to build and test the promising designs from the public literature that were previously difficult or impossible to implement. In this study, different cooling hole designs were manufactured in test coupons using a laser powder bed fusion process. Each nickel alloy coupon featured a single row of engine scale cooling holes, fed by a microchannel. To evaluate performance, the overall cooling effectiveness of each coupon was measured using a matched Biot test at engine relevant conditions. The results showed that certain hole shapes are better suited for additive manufacturing than others and that the manufacturing process can cause significant deviations from the performance reported in the literature.

Engineering↗

NASA NTRS2018

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

microchannel↗

NASA NTRS2013

Silicon Heat Pipe Array

Improved methods of heat dissipation are required for modern, high-power density electronic systems. As increased functionality is progressively compacted into decreasing volumes, this need will be exacerbated. High-performance chip power is predicted to increase monotonically and rapidly with time. Systems utilizing these chips are currently reliant upon decades of old cooling technology. Heat pipes offer a solution to this problem. Heat pipes are passive, self-contained, two-phase heat dissipation devices. Heat conducted into the device through a wick structure converts the working fluid into a vapor, which then releases the heat via condensation after being transported away from the heat source. Heat pipes have high thermal conductivities, are inexpensive, and have been utilized in previous space missions. However, the cylindrical geometry of commercial heat pipes is a poor fit to the planar geometries of microelectronic assemblies, the copper that commercial heat pipes are typically constructed of is a poor CTE (coefficient of thermal expansion) match to the semiconductor die utilized in these assemblies, and the functionality and reliability of heat pipes in general is strongly dependent on the orientation of the assembly with respect to the gravity vector. What is needed is a planar, semiconductor-based heat pipe array that can be used for cooling of generic MCM (multichip module) assemblies that can also function in all orientations. Such a structure would not only have applications in the cooling of space electronics, but would have commercial applications as well (e.g. cooling of microprocessors and high-power laser diodes). This technology is an improvement over existing heat pipe designs due to the finer porosity of the wick, which enhances capillary pumping pressure, resulting in greater effective thermal conductivity and performance in any orientation with respect to the gravity vector. In addition, it is constructed of silicon, and thus is better suited for the cooling of semiconductor devices.

Yee, Karl Y.↗

DOE OSTI2021

Baseline Airfoil Cooling Designs For 5-10MW Gas Turbines

This paper describes conventional cooling technologies that have been identified after a thorough review of public literature as a baseline for more detailed analysis and future testing. This effort is unique because the cooling features (i.e., leading edge, mid-chord, and trailing edge) are integrated together within an airfoil of realistic scale. The engineering models that have been developed to characterize the cooling performance for these baseline configurations will be described. It is believed that the cooling designs described in this paper are representative of gas turbines in the 5-10 MWe size range, but not identical to any commercial product. The present effort to establish a state-of-the-art cooling scheme is a first, and necessary, step in an on-going project to identify and test more advanced cooling concepts for CHP systems that are enabled by additive manufacturing.

Straub, Douglas↗

DOE OSTI2021

Baseline Airfoil Cooling Designs For 5-10MW Gas Turbines - Conference Paper

Straub, Douglas↗

NASA NTRS2019

Lynx X-Ray Microcalorimeter Cryogenic System

The Lynx x-ray microcalorimeter instrument on the Lynx X-ray Observatory requires a state-of-the-art cryogenic system to enable high-precision and high-resolution x-ray spectroscopy. The cryogenic system and components described provide the required environment using cooling technologies that are already at relatively high technology readiness levels and are progressing toward flight-compatible subsystems. These subsystems comprise a cryostat, a 4.5-K mechanical cryocooler, and an adiabatic demagnetization refrigerator that provides substantial cooling power at 50 mK.

DiPirro, Michael↗