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Reverberant and direct acoustic test comparisons were analyzed in this viewgraph presentation. The acoustic test data set includes: 1) CloudSat antenna subjected to PF reverberant chamber acoustic test; 2) CloudSat subjected to a PF direct speaker acoustic test; and 3) DAWN flight spacecraft subjected to PF direct speaker and a workmanship reverberant chamber acoustic test.
The U.S. Department of Energy (DOE), Lockheed Martin Corporation (LM), and NASA Glenn Research Center (GRC) have been developing the Advanced Stirling Radioisotope Generator (ASRG) for use as a power system for space science missions. As part of the extended operation testing of this power system, the Advanced Stirling Convertors (ASC) at NASA GRC undergo a vibration test sequence intended to simulate the vibration history that an ASC would experience when used in an ASRG for a space mission. This sequence includes testing at workmanship and flight acceptance levels interspersed with periods of extended operation to simulate prefueling and post fueling. The final step in the test sequence utilizes additional testing at flight acceptance levels to simulate launch. To better replicate the acceleration profile seen by an ASC incorporated into an ASRG, the input spectra used in testing the convertors was modified based on dynamic testing of the ASRG Engineering Unit (ASRG EU) at LM. This paper outlines the overall test approach, summarizes the test results from the ASRG EU, describes the incorporation of those results into the test approach, and presents the results of applying the test approach to the ASC-1 #3 and #4 convertors. The test results include data from several accelerometers mounted on the convertors as well as the piston position and output power variables.
Presentation discusses: (1) Why Multi-Layer Ceramic Capacitors(MLCCs) crack during manual soldering? Workmanship and parts issues. (2) Do existing qualification requirements assure crack-free soldering? MIL-spec Thermal Shock (TS) testing. MIL-spec Resistance to Soldering Heat (RSH) test. (3) What test can assure reliable soldering? Mechanical characteristics of ceramics. Comparison of three TS techniques: LND, TSD, and IWT. (4) Simulation of TS conditions.
NASA Glenn Research Center (GRC) has been supporting development of free-piston Stirling conversion technology for spaceflight electrical power generation since 1999. GRC has also been supporting the development of the Advanced Stirling Radioisotope Generator (ASRG) since 2006. A key element of the ASRG project is providing life, reliability, and performance data for the Advanced Stirling Convertor (ASC). The Thermal Energy Conversion branch at GRC is conducting extended operation of several free-piston Stirling convertors. The goal of this effort is to generate long-term performance data (tens of thousands of hours) on multiple units to build a life and reliability database. Currently, GRC is operating 18 convertors. This hardware set includes Technology Demonstration Convertors (TDCs) from Infinia Corporation, of which one pair (TDCs #13 and #14) has accumulated over 60,000 hr (6.8 years) of operation. Also under test are various Sunpower, Inc. convertors that were fabricated during the ASC development activity, including ASC-0, ASC-E (including those in the ASRG engineering unit), and ASC-E2. The ASC-E2s also completed, or are in progress of completing workmanship vibration testing, performance mapping, and extended operation. Two ASC-E2 units will also be used for durability testing, during which components will be stressed to levels above nominal mission usage. Extended operation data analyses from these tests are covered in this paper.
The U.S. Department of Energy (DOE), Lockheed Martin Space Company (LMSC), Sun power Inc., and NASA Glenn Research Center (GRC) have been developing an Advanced Stirling Radioisotope Generator (ASRG) for use as a power system on space science missions. This generator will make use of free-piston Stirling convertors to achieve higher conversion efficiency than currently available alternatives. NASA GRC's support of ASRG development includes extended operation testing of Advanced Stirling Convertors (ASCs) developed by Sunpower Inc. In the past year, NASA GRC has been building a test facility to support extended operation of a pair of engineering level ASCs. Operation of the convertors in the test facility provides convertor performance data over an extended period of time. Mechanical support hardware, data acquisition software, and an instrumentation rack were developed to prepare the pair of convertors for continuous extended operation. Short-term tests were performed to gather baseline performance data before extended operation was initiated. These tests included workmanship vibration, insulation thermal loss characterization, low-temperature checkout, and fUll-power operation. Hardware and software features are implemented to ensure reliability of support systems. This paper discusses the mechanical support hardware, instrumentation rack, data acquisition software, short-term tests, and safety features designed to support continuous unattended operation of a pair of ASCs.
The U.S. Department of Energy (DOE), Lockheed Martin (LM), and NASA Glenn Research Center (GRC) have been developing the Advanced Stirling Radioisotope Generator (ASRG) for use as a power system for space science missions. As part of the extended operation testing of this power system, the Advanced Stirling Converters (ASC) at NASA John H. Glenn Research Center undergo a vibration test sequence intended to simulate the vibration history of an ASC used in an ASRG for a space mission. This sequence includes testing at Workmanship and Flight Acceptance levels interspersed with periods of extended operation to simulate pre and post fueling. The final step in the test sequence utilizes additional testing at Flight Acceptance levels to simulate launch. To better replicate the acceleration profile seen by an ASC incorporated into an ASRG, the input spectra used in testing the convertors was modified based on dynamic testing of the ASRG Engineering Unit ( ASRG-EU) at Lockheed Martin. This paper presents the vibration test plan for current and future ASC units, including the modified input spectra, and the results of recent tests using these spectra. The test results include data from several accelerometers mounted on the convertors as well as the piston position and output power variables.
This assessment was initiated by the NASA Engineering & Safety Center (NESC) after a number of recent "high profile" connector problems, the most visible and publicized of these being the problem with the Space Shuttle's Engine Cut-Off System cryogenic feed-thru connector. The NESC commissioned a review of NASA's connector selection and application processes for space flight applications, including how lessons learned and past problem records are fed back into the processes to avoid recurring issues. Team members were primarily from the various NASA Centers and included connector and electrical parts specialists. The commissioned study was conducted on spacecraft connector selection and application processes at NASA Centers. The team also compared the NASA spacecraft connector selection and application process to the military process, identified recent high profile connector failures, and analyzed problem report data looking for trends and common occurrences. The team characterized NASA's connector problem experience into a list of top connector issues based on anecdotal evidence of a system's impact and commonality between Centers. These top issues are as follows, in no particular rank order: electrically shorted, bent and/or recessed contact pins, contact pin/socket contamination leading to electrically open or intermittencies, connector plating corrosion or corrosion of connector components, low or inadequate contact pin retention forces, contact crimp failures, unmated connectors and mis-wiring due to workmanship errors during installation or maintenance, loose connectors due to manufacturing defects such as wavy washer and worn bayonet retention, damaged connector elastomeric seals and cryogenic connector failure. A survey was also conducted of SAE Connector AE-8C1 committee members regarding their experience relative to the NASA concerns on connectors. The most common responses in order of occurrence were contact retention, plating issues, worn-out or damaged coupling mechanisms, bent pins, contact crimp barrel cracking and torn seals. In addition to these common themes, responses included issues with markings, dimensional errors on the build, contact/socket damage (handling), manufacturing defects and customer misapplication and mishandling. The NESC team concluded that considering the large quantity and wide variety of connectors successfully flown on human and robotic space applications, the number of failures is quite low. However, "high profile" failures with significant cost, schedule, safety, and/or mission success impacts continue to occur. It was also concluded that connector failures occur throughout a system's life-cycle with the majority of connector issues application related. A number of recommendations were identified for improving NASA connector selection processes and overall space connector reliability and performance.
NASA Glenn Research Center has been supporting the development of Stirling energy conversion for use in space. Lockheed Martin has been contracted by the Department of Energy to design and fabricate flight-unit Advanced Stirling Radioisotope Generators, which utilize Sunpower, Inc., free-piston Advanced Stirling Convertors. The engineering unit generator has demonstrated conversion efficiency in excess of 20 percent, offering a significant improvement over existing radioisotope-fueled power systems. NASA Glenn has been supporting the development of this generator by developing the convertors through a technology development contract with Sunpower, and conducting research and experiments in a multitude of areas, such as high-temperature material properties, organics testing, and convertor-level extended operation. Since the generator must undergo launch, several launch simulation tests have also been performed at the convertor level. The standard test sequence for launch vibration exposure has consisted of workmanship and flight acceptance levels. Together, these exposures simulate what a flight convertor will experience. Recently, two supplementary tests were added to the launch vibration simulation activity. First was a vibration durability test of the convertor, intended to quantify the effect of vibration levels up to qualification level in both the lateral and axial directions. Second was qualification-level vibration of several heater heads with small oxide inclusions in the material. The goal of this test was to ascertain the effect of the inclusions on launch survivability to determine if the heater heads were suitable for flight.
C-mode scanning acoustic microscopy (C-SAM) is a nondestructive inspection technique that uses ultrasound to show the internal feature of a specimen. A very high or ultra-high-frequency ultrasound passes through a specimen to produce a visible acoustic microimage (AMI) of its inner features. As ultrasound travels into a specimen, the wave is absorbed, scattered or reflected. The response is highly sensitive to the elastic properties of the materials and is especially sensitive to air gaps. This specific characteristic makes AMI the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. C-SAM analysis, which is a type of AMI, was widely used in the past for evaluation of plastic microelectronic circuits, especially for detecting delamination of direct die bonding. With the introduction of the flip-chip die attachment in a package; its use has been expanded to nondestructive characterization of the flip-chip solder bumps and underfill. Figure 1.1 compares visual and C-SAM inspection approaches for defect detection, especially for solder joint interconnections and hidden defects. C-SAM is specifically useful for package features like internal cracks and delamination. C-SAM not only allows for the visualization of the interior features, it has the ability to produce images on layer-by-layer basis. Visual inspection; however, is only superior to C-SAM for the exposed features including solder dewetting, microcracks, and contamination. Ideally, a combination of various inspection techniques - visual, optical and SEM microscopy, C-SAM, and X-ray - need to be performed in order to assure quality at part, package, and system levels. This reports presents evaluations performed on various advanced packages/assemblies, especially the flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. Both external and internal equipment was used for evaluation. The outside facility provided images of the key features that could be detected using the most advanced C-SAM equipment with a skilled operator. Investigation continued using in-house equipment with its limitations. For comparison, representative X-rays of the assemblies were also gathered to show key defect detection features of these non-destructive techniques. Key images gathered and compared are: Compared the images of 2D X-ray and C-SAM for a plastic LGA assembly showing features that could be detected by either NDE technique. For this specific case, X-ray was a clear winner. Evaluated flip-chip CGA and FCBGA assemblies with and without heat sink by C-SAM. Only the FCCGA package that had no heat sink could be fully analyzed for underfill and bump quality. Cross-sectional microscopy did not revealed peripheral delamination features detected by C-SAM. Analyzed a number of fine pitch PBGA assemblies by C-SAM. Even though the internal features of the package assemblies could be detected, C-SAM was unable to detect solder joint failure at either the package or board level. Twenty times touch ups by solder iron with 700degF tip temperature, each with about 5 second duration, did not induce defects to be detected by C-SAM images. Other techniques need to be considered to induce known defects for characterization. Given NASA's emphasis on the use of microelectronic packages and assemblies and quality assurance on workmanship defect detection, understanding key features of various inspection systems that detect defects in the early stages of package and assembly is critical to developing approaches that will minimize future failures. Additional specific, tailored non-destructive inspection approaches could enable low-risk insertion of these advanced electronic packages having hidden and fine features.
NASA Glenn Research Center has been supporting the development of Stirling energy conversion for use in space. Lockheed Martin has been contracted by the Department of Energy to design and fabricate flight-unit Advanced Stirling Radioisotope Generators, which utilize Sunpower, Inc., free-piston Advanced Stirling Convertors. The engineering unit generator has demonstrated conversion efficiency in excess of 20 percent, offering a significant improvement over existing radioisotope-fueled power systems. NASA Glenn has been supporting the development of this generator by developing the convertors through a technology development contract with Sunpower, and conducting research and experiments in a multitude of areas, such as high-temperature material properties, organics testing, and convertor-level extended operation. Since the generator must undergo launch, several launch simulation tests have also been performed at the convertor level. The standard test sequence for launch vibration exposure has consisted of workmanship and flight acceptance levels. Together, these exposures simulate what a flight convertor will experience. Recently, two supplementary tests were added to the launch vibration simulation activity. First was a vibration durability test of the convertor, intended to quantify the effect of vibration levels up to qualification level in both the lateral and axial directions. Second was qualification-level vibration of several heater heads with small oxide inclusions in the material. The goal of this test was to ascertain the effect of the inclusions on launch survivability to determine if the heater heads were suitable for flight.
James Webb Space Telescope Optical Telescope Element (OTE) is a three mirror anastigmat consisting of a 6.5 m primary mirror (PM), secondary mirror (SM) and a tertiary mirror. The primary mirror is made out of 18 segments. The telescope and instruments will be assembled at Goddard Space Flight Center (GSFC) to make it the Optical Telescope Element-Integrated Science Instrument Module (OTIS). The OTIS will go through environmental testing at GSFC before being transported to Johnson Space Center for testing at cryogenic temperature. The objective of the primary mirror Center of Curvature test (CoC) is to characterize the PM before and after the environmental testing for workmanship. This paper discusses the CoC test including both a surface figure test and a new method for characterizing the state of the primary mirror using high speed dynamics interferometry.
This specification covers the general workmanship requirements and procedures for the complete installation and assembly of electrical ground support equipment (EGSE) such as terminal distributors, junction boxes, conduit and fittings, cable trays and accessories, interconnecting cables (including routing requirements), motor-control equipment, and necessary hardware as specified by the applicable contract and drawings.
We describe a certification approach for software development that has been adopted at our organization. JPL develops robotic spacecraft for the exploration of the solar system. The flight software that controls these spacecraft is considered to be mission critical. We argue that the goal of a software certification process cannot be the development of "perfect" software, i.e., software that can be formally proven to be correct under all imaginable and unimaginable circumstances. More realistically, the goal is to guarantee a software development process that is conducted by knowledgeable engineers, who follow generally accepted procedures to control known risks, while meeting agreed upon standards of workmanship. We target three specific issues that must be addressed in such a certification procedure: the coding process, the code that is developed, and the skills of the coders. The coding process is driven by standards (e.g., a coding standard) and tools. The code is mechanically checked against the standard with the help of state-of-the-art static source code analyzers. The coders, finally, are certified in on-site training courses that include formal exams.
NASA-HDBK-7008 Spacecraft Level Dynamic Environments Testing discusses the approaches, benefits, dangers, and recommended practices for spacecraft level dynamic environments testing, including vibration testing. This paper discusses in additional detail the benefits and actual experiences of vibration testing spacecraft for NASA Goddard Space Flight Center (GSFC) and Jet Propulsion Laboratory (JPL) flight projects. JPL and GSFC have both similarities and differences in their spacecraft level vibration test approach: JPL uses a random vibration input and a frequency range usually starting at 5 Hz and extending to as high as 250 Hz. GSFC uses a sine sweep vibration input and a frequency range usually starting at 5 Hz and extending only to the limits of the coupled loads analysis (typically 50 to 60 Hz). However, both JPL and GSFC use force limiting to realistically notch spacecraft resonances and response (acceleration) limiting as necessary to protect spacecraft structure and hardware from exceeding design strength capabilities. Despite GSFC and JPL differences in spacecraft level vibration test approaches, both have uncovered a significant number of spacecraft design and workmanship anomalies in vibration tests. This paper will give an overview of JPL and GSFC spacecraft vibration testing approaches and provide a detailed description of spacecraft anomalies revealed.
Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.
During test and verification planning for the Altair lunar lander project, a National Aeronautics and Space Administration (NASA) study team identified several ground transportation and test issues related to the large payload diameter. Although the entire Constellation Program-including Altair-has since been canceled, issues identified by the Altair project serve as important lessons learned for payloads greater than 7 m diameter being considered for NASA's new Space Launch System (SLS). A transportation feasibility study found that Altair's 8.97 m diameter Descent Module would not fit inside available aircraft. Although the Ascent Module cabin was only 2.35 m diameter, the long reaction control system booms extended nearly to the Descent Module diameter, making it equally unsuitable for air transportation without removing the booms and invalidating assembly workmanship screens or acceptance testing that had already been performed. Ground transportation of very large payloads over extended distances is not generally permitted by most states, so overland transportation alone would not be an option. Limited ground transportation to the nearest waterway may be possible, but water transportation could take as long as 66 days per production unit, depending on point of origin and acceptance test facility; transportation from the western United States would require transit through the Panama Canal to access the Kennedy Space Center launch site. Large payloads also pose acceptance test and ground processing challenges. Although propulsion, mechanical vibration, and reverberant acoustic test facilities at NASA's Plum Brook Station have been designed to accommodate large spacecraft, special handling and test work-arounds may be necessary, which could increase cost, schedule, and technical risk. Once at the launch site, there are no facilities currently capable of accommodating the combination of large payload size and hazardous processing such as hypergolic fuels, pyrotechnic devices, and high pressure gasses. Ironically, the limiting factor to a national heavy lift strategy may not be the rocket technology needed to throw a heavy payload, but rather the terrestrial infrastructure-roads, bridges, airframes, and buildings-necessary to transport, acceptance test, and process large spacecraft. Failure to carefully consider where and how large spacecraft are manufactured, tested, and launched could result in unforeseen cost to modify existing (or develop new) infrastructure, or incur additional risk due to increased handling operations or eliminating key verifications.
Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.
The James Webb Space Telescope is a large infrared telescope with a 6.5-meter primary mirror, designed as a successor to the Hubble Space Telescope when launched in 2018. Three of the four science instruments contained within the Integrated Science Instrument Module (ISIM) are passively cooled to their operational temperature range of 36K to 40K with radiators, and the fourth instrument is actively cooled to its operational temperature of approximately 6K. Thermal-vacuum testing of the flight science instruments at the ISIM element level has taken place in three separate highly challenging and extremely complex thermal tests within a gaseous helium-cooled shroud inside Goddard Space Flight Centers Space Environment Simulator. Special data acquisition software was developed for these tests to monitor over 1700 flight and test sensor measurements, track over 50 gradients, component rates, and temperature limits in real time against defined constraints and limitations, and guide the complex transition from ambient to final cryogenic temperatures and back. This extremely flexible system has proven highly successful in safeguarding the nearly $2B science payload during the 3.5-month-long thermal tests. Heat flow measurement instrumentation, or Q-meters, were also specially developed for these tests. These devices provide thermal boundaries o the flight hardware while measuring instrument heat loads up to 600 mW with an estimated uncertainty of 2 mW in test, enabling accurate thermal model correlation, hardware design validation, and workmanship verification. The high accuracy heat load measurements provided first evidence of a potentially serious hardware design issue that was subsequently corrected. This paper provides an overview of the ISIM-level thermal-vacuum tests and thermal objectives; explains the thermal test configuration and thermal balances; describes special measurement instrumentation and monitoring and control software; presents key test thermal results; lists problems encountered during testing and lessons learned.