Macroscopic character of composite high-temperature superconducting wires
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Kivelson, S. A.↗
SEARCH · Engineering Papers
Results for “WIRES”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Measurement and analysis of ground‐level electric fields and wire‐base current during the rocket‐and‐wire lightning triggering process
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T. Ngin↗
DOUBLE PLANAR WIRE ARRAYS FROM MID-ATOMIC-NUMBER WIRES AS EFFICIENT RADIATORS AT ENHANCED CURRENT ON ZEBRA.
Abstract not provided.
Safronova, A. S.↗
Wiring assembly and method of forming a channel in a wiring assembly for receiving conductor and providing separate regions of conductor contact with the channel
A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first insulative layer tubular in shape and including a surface along which a conductor segment may be positioned. A channel formed in the surface of the insulative layer defines a first conductor path and includes a surface of first contour in cross section along a first plane transverse to the conductor path. A segment of conductor having a surface of second contour in cross section is positioned at least partly in the channel and extends along the conductor path. Along the first plane, contact between the conductor surface of second contour and the channel surface of first contour includes at least two separate regions of contact.
42 ENGINEERING↗
Wire Breakage in SLC Wire Profile Monitors
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Fields, C.↗
Wiring assembly and method of forming a channel in a wiring assembly for receiving conductor and providing separate regions of conductor contact with the channel
A conductor assembly and method for constructing an assembly of the type which, when conducting current, generates a magnetic field or which, in the presence of a changing magnetic field, induces a voltage. In one embodiment the method provides a first insulative layer tubular in shape and including a surface along which a conductor segment may be positioned. A channel formed in the surface of the insulative layer defines a first conductor path and includes a surface of first contour in cross section along a first plane transverse to the conductor path. A segment of conductor having a surface of second contour in cross section is positioned at least partly in the channel and extends along the conductor path. Along the first plane, contact between the conductor surface of second contour and the channel surface of first contour includes at least two separate regions of contact.
Stelzer, Gerald↗
Frequency response in short thermocouple wires
Theoretical expressions are derived for the steady state frequency response of a thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for a nonuniform wire with unequal material properties and wire diameters across the junction. The amplitude ratio at low frequency omega approaches 0 agrees with the results of Scadron and Warshawsky (1952) for a steady state temperature distribution. Moreover, the frequency response for a nonuniform wire in the limit of infinite length l approaches infinity is shown to reduce to a simple expression that is analogous to the classic first order solution for a thermocouple wire with uniform properties. Theoretical expressions are also derived for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire and a two material wire with unequal material properties across the junction. For the case of a one material supported wire, an exact solution is derived which compares favorably with an approximate expression that only matches temperatures at the support junction. Moreover, for the case of a two material supported wire, an analytical expression is derived that closely correlates numerical results. Experimental measurements are made for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire (type K) and a two material wire (type T) with unequal material properties across the junction. The data for the amplitude ratio and phase angle are correlated to within 10 pct. with the theoretical predictions of Forney and Fralick (1991). This is accomplished by choosing a natural frequency omega sub n for the wire data to correlate the first order response at large gas temperature frequencies. It is found that a large bead size, however, will increase the amplitude ratio at low frequencies but decrease the natural frequency of the wire. The phase angle data are also distorted for imperfect junctions.
Forney, L. J.↗
A simple numerical method for evaluating heat dissipation from curved wires with periodic applied heating
In many situations, the dual-purpose heater/thermometer wires used in the three-omega method – one of the most precise and sensitive techniques for measuring the thermal conductivity of thin films and interfaces – must include bends and curves to avoid obstructions on the surface of a sample. Although the three-omega analysis assumes that the heating wire is infinitely long and straight, recent experimental work has demonstrated that in some cases curved-wire geometries can be used without introducing detectable systematic error. We describe a general numerical method that can be used to calculate the temperature of three-omega heating wires with arbitrary wire geometries. Furthermore, this method provides experimentalists with a simple quantitative procedure for calculating how large the systematic error caused by a particular wire asymmetry will be. We show calculations of two useful cases: a straight wire with a single bend of arbitrary angle and a wire that forms a circle. We find that the amplitude of the in-phase temperature oscillations near a wire that forms a circle differs from the prediction using the analytic straight-line source solution by <12%, provided that the thermal penetration depth is less than ten times the radius of curvature of the wire path. The in-phase temperature amplitude 1.5 wire widths away from a 90° bend in a wire is within 11% of the straight-line source prediction for all penetration depths greater than the wire width. Our calculations indicate that the straight-line source solution breaks down significantly when the wire bend angle is less than 45°.
77 NANOSCIENCE AND NANOTECHNOLOGY↗
Plasma flows during the ablation stage of an over-massed pulsed-power-driven exploding planar wire array
We characterize the plasma flows generated during the ablation stage of an over-massed exploding planar wire array, fielded on the COBRA pulsed-power facility (1 MA peak current, 250 ns rise time). The planar wire array is designed to provide a driving magnetic field (80–100 T) and current per wire distribution (about 60 kA), similar to that in a 10 MA cylindrical exploding wire array fielded on the Z machine. Over-massing the arrays enables continuous plasma ablation over the duration of the experiment without implosion. The requirement to over-mass on the Z machine necessitates wires with diameters of 75–100μm, which are thicker than wires usually fielded on wire array experiments. To test ablation with thicker wires, we perform a parametric study by varying the initial wire diameter between 33 and 100 μm. The largest wire diameter (100 μm) array exhibits early closure of the cathode-wire gap, while the gap remains open over the duration of the experiment for wire diameters between 33 and 75 μm. Laser plasma interferometry and time-gated extreme-ultraviolet (XUV) imaging are used to probe the plasma flows ablating from the wires. The plasma flows from the wires converge to generate a pinch, which appears as a fast-moving (V≈100kms−1) column of increased plasma density (n¯e≈2×1018cm−3) and strong XUV emission. Finally, we compare the results with three-dimensional resistive-magnetohydrodynamic (MHD) simulations performed using the code GORGON, the results of which reproduce the dynamics of the experiment reasonably well.
70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗
Heat Transfer Analysis in Wire Bundles for Aerospace Vehicles
Design of wiring for aerospace vehicles relies on an understanding of "ampacity" which refers to the current carrying capacity of wires, either, individually or in wire bundles. Designers rely on standards to derate allowable current flow to prevent exceedance of wire temperature limits due to resistive heat dissipation within the wires or wire bundles. These standards often add considerable margin and are based on empirical data. Commercial providers are taking an aggressive approach to wire sizing which challenges the conventional wisdom of the established standards. Thermal modelling of wire bundles may offer significant mass reduction in a system if the technique can be generalized to produce reliable temperature predictions for arbitrary bundle configurations. Thermal analysis has been applied to the problem of wire bundles wherein any or all of the wires within the bundle may carry current. Wire bundles present analytical challenges because the heat transfer path from conductors internal to the bundle is tortuous, relying on internal radiation and thermal interface conductance to move the heat from within the bundle to the external jacket where it can be carried away by convective and radiative heat transfer. The problem is further complicated by the dependence of wire electrical resistivity on temperature. Reduced heat transfer out of the bundle leads to higher conductor temperatures and, hence, increased resistive heat dissipation. Development of a generalized wire bundle thermal model is presented and compared with test data. The steady state heat balance for a single wire is derived and extended to the bundle configuration. The generalized model includes the effects of temperature varying resistance, internal radiation and thermal interface conductance, external radiation and temperature varying convective relief from the free surface. The sensitivity of the response to uncertainties in key model parameters is explored using Monte Carlo analysis.
S L Rickman↗
Body of Knowledge (BOK) for Copper Wire Bonds
Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.
Body of Knowledge (BOK)↗
High-current density CORC® wires for use in accelerator magnets
Next generation accelerator magnets capable of generating magnetic fields in excess of 16 T require high-temperature superconductors (HTS) such as Conductor on Round Core (CORC®) cables and wires, wound from RE-Ba 2 Ca 3 O 7-δ (ReBCO, Re = rare earth) coated conductor tapes.1 The severe operating requirements of an engineering current density (J e ) of at least 400 Amm -2 at 4.2 K and 20 T, high operating currents of 5-20 kA, tolerance to Lorentz stresses in excess of 150 MPa, and in many cases cable bending diameters as small as 30 mm, make accelerator magnets one of the most challenging applications for any HTS material. Advanced Conductor Technologies (ACT) has been developing CORC® cables and wires wound from ReBCO tapes containing substrates of 30-50 µm thickness to meet these requirements. Although these requirements could each be met separately with current CORC® technology, meeting the requirements at the same time requires thinner, more powerful CORC® wires wound from tapes with even thinner substrates. The purpose of this Phase I SBIR program was to determine the feasibility to develop ReBCO tapes containing 25 µm thick substrates on an industrial scale and wind thinner CORC® wires from these tapes that could eventually meet the stringent performance specifications for accelerator magnets. The results of the Phase I program clearly demonstrated the feasibility of developing thinner, more powerful CORC® wires using ReBCO tapes with 25 µm substrate that would likely meet the stringent requirements for use in accelerator magnet by the end of the potential Phase II program. SuperPower Inc., as the subcontractor on the Phase I program, was successful in developing tapes with 25 µm substrate at minimum piece lengths of 30-40 m with a clear path towards industrial production. A total length exceeding 350 meters of 2 mm wide ReBCO tape with critical current (I c ) of between 45 and 65 A at 77 K was delivered to ACT during the Phase I program. The thinner tapes allowed us to reduce the CORC® core (former) from 2.5 mm to 2.0 mm, resulting in a higher current density conductor with enhanced flexibility. Several CORC® wires were manufactured to reach the Phase I goal of a Je of at least 300-400 Amm -2 at 20 T at a minimum bending diameter to less than 50 mm. Several CORC® wires were wound and analyzed after bending by identifying the location of peak stresses and causes of tape damage. Data was compared to 3D finite element models that included parametric studies to identify key parameters leading to the observed tape failure modes. The models suggest that flexibility is heavily dependent on the friction coefficient between tapes in a CORC® wire and the width of the tapes used. These studies provide a clear and straightforward path to improve conductor flexibility within the proposed Phase II program to reach our goal of minimum bending diameters below 30 mm with minimal I c reduction. We were successful in developing a flexible, 3.3 mm thick, high-J e CORC® wire containing 30 ReBCO tapes that carried > 80 % of its original I c after bending to diameters down to 44 mm. The CORC® wires showed no cyclic degradation due to in-field testing up to 57 stress cycles at 12 T. Another CORC® wire of 3.4 mm thickness had a J e as high as 451 Amm -2 when extrapolated to 20 T at a bending diameter of 63 mm, which is a new high-field performance record. We were also able to design a CORC® wire with increased tensile strength of 240 MPa at 76 K. The results of the Phase I program allow us to propose a very strong Phase II program with a high likelihood of reaching the ultimate goal of CORC® accelerator magnets wires with I c exceeding 8-10 kA and J e exceeding 600 Amm -2 at 20 T while bent to a 30 mm diameter.
43 PARTICLE ACCELERATORS↗
Calibration, Data Acquisition, and Post Analysis of Turbulent Fluid Flow in a Calibration Jet Using Hot-wire Anemometry
The Turbine Branch concentrates on the following areas: Computational Fluid Dynamics (CFD), and implementing experimental procedures to obtain physical modeling data. Hot-wire Anemometry is a valuable tool for obtaining physical modeling data. Hot-wire Anemometry is likely to remain the principal research tool for most turbulent air/gas flow studies. The Hot-wire anemometer consists of a fine wire heated by electric current. When placed in a fluid stream, the hot-wire loses heat to the fluid by forced convection. In forced convection, energy transfer is due to molecular motion imposed by an extraneous force moving fluid parcels. When the hot-wire is in "equilibrium", the rate of heat input to the wire is equal to the rate of heat loss at the wire ends. The equality between heat input and heat loss is the basis for King s equation, which relates the electrical parameters of the hot-wire to the flow parameters of the fluid. Hot-wire anemometry is based on convective heat transfer from a heated wire element placed in a fluid flow. Any change in the fluid flow condition that affects the heat transfer from the heated element will be detected virtually instantaneously by a constant-temperature Hot-wire anemometry system. The system implemented for this research is the IFA 300. The system is a fully-integrated, thermal anemometer-based system that measures mean and fluctuating velocity components in air, water, and other fluids. It also measures turbulence and makes localized temperature measurements. A constant-temperature anemometer is a bridge and amplifier circuit that controls a tiny wire at constant temperature. As a fluid flow passes over the heated sensor, the amplifier senses the bridge off-balance and adjusts the voltage to the top of the bridge, keeping the bridge in balance. The voltage on top of the bridge can then be related to the velocity of the flow. The bridge voltage is sensitive to temperature as well as velocity and so the built-in thermocouple circuit can be attached to a thermocouple that can measure the fluid temperature. Additional information is included in the original extended abstract.
Moreno, Michelle↗
In Situ Electrochemical Deposition of Microscopic Wires
A method of fabrication of wires having micron and submicron dimensions is built around electrochemical deposition of the wires in their final positions between electrodes in integrated circuits or other devices in which the wires are to be used. Heretofore, nanowires have been fabricated by a variety of techniques characterized by low degrees of controllability and low throughput rates, and it has been necessary to align and electrically connect the wires in their final positions by use of sophisticated equipment in expensive and tedious post-growth assembly processes. The present method is more economical, offers higher yields, enables control of wire widths, and eliminates the need for post-growth assembly. The wires fabricated by this method could be used as simple electrical conductors or as transducers in sensors. Depending upon electrodeposition conditions and the compositions of the electroplating solutions in specific applications, the wires could be made of metals, alloys, metal oxides, semiconductors, or electrically conductive polymers. In this method, one uses fabrication processes that are standard in the semiconductor industry. These include cleaning, dry etching, low-pressure chemical vapor deposition, lithography, dielectric deposition, electron-beam lithography, and metallization processes as well as the electrochemical deposition process used to form the wires. In a typical case of fabrication of a circuit that includes electrodes between which microscopic wires are to be formed on a silicon substrate, the fabrication processes follow a standard sequence until just before the fabrication of the microscopic wires. Then, by use of a thermal SiO-deposition technique, the electrodes and the substrate surface areas in the gaps between them are covered with SiO. Next, the SiO is electron-beam patterned, then reactive-ion etched to form channels having specified widths (typically about 1 m or less) that define the widths of the wires to be formed. Drops of an electroplating solution are placed on the substrate in the regions containing the channels thus formed, then the wires are electrodeposited from the solution onto the exposed portions of the electrodes and into the channels. The electrodeposition is a room-temperature, atmospheric-pressure process. The figure shows an example of palladium wires that were electrodeposited into 1-mm-wide channels between gold electrodes.
Yun, Minhee↗