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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRSDate not supplied

Progress Towards Prolonged Deployment of SiC JFET-R ICs Into Previously Inaccessible Hostile Environments

This invited presentation describes demonstration of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. SiC junction field effect transistor-resistor (JFET-R) ICs with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient [1], 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber [2], and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes [3]. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C T-span) without significant change in signal (input /output) or power supply voltages [4]. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards this end, the processing that forms the SiC JFETs and resistors (without interconnect) for the NASA Glenn “Generation 12” design prototype JFET-R ICs was conducted at GE Research. Once the COVID-delayed IC interconnect and bond pad fabrication processing on these wafers is completed at NASA Glenn, the resulting chips will be packaged and oven-tested [5]. It is expected that further technology transfer to complete commercial production will lower investment and risk barriers to useful application deployment. For NASA, an initial high-value deployment is opening the Venus surface to extended missions for robotic scientific exploration.

Silicon Carbide↗
NASA NTRS1989

A helmet mounted display demonstration unit for a Space Station application

Under NASA guidance an advanced development helmet mounted display (HMD) has been designed and fabricated. Delivery has been made of an extravehicular mobility unit (EMU) HMD demonstration unit as an alternative to the current low-resolution, chest-mounted display, and cuff-mounted checklists. Important design goals achieved with this HMD include the use of transmissive liquid display image sources with fairly high resolution (text, graphics, and video compatible), binocular viewing with total image overlap, virtual image projection, low profile packaging, low power design, and demonstration of voice control of the HMD data. Test results showed that the HMD program successfully demonstrated the feasibility of the concept and operated as designed, meeting the necessary program requirements.

Gernux, Carolyn G.↗
NASA NTRS2016

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗
NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗
NASA NTRS1999

Experimental Verification of the Use of Metal Filled Via Hole Fences for Crosstalk Control of Microstrip Lines in LTCC Packages

Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior 3D-FEM electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal Strip, coupling is reduced. In this paper, experimental verification of the 3D-FEM simulations Is demonstrated for commercially fabricated LTCC packages.

Ponchak, George E.↗
NASA NTRS2014

IVGEN Post Flight Analysis

The Intravenous Fluid Generation (IVGEN) Experiment was a technology demonstration experiment that purified ISS potable water, mixed it with salt, and transferred it through a sterilizing filter. On-orbit performance was verified as appropriate and two 1.5 l bags of normal saline solution were returned to earth for post-flight testing by a FDA certified laboratory for compliance with United States Pharmacopiea (USP) standards. Salt concentration deviated from required values and an analysis identified probable causes. Current efforts are focused on Total Organic Content (TOC) testing, and shelf life.The Intravenous Fluid Generation (IVGEN) Experiment demonstrated the purification of ISS potable water, the mixing of the purified water with sodium chloride, and sterilization of the solution via membrane filtration. On-orbit performance was monitored where feasible and two 1.5-liter bags of normal saline solution were returned to earth for post-flight testing by a FDA-registered laboratory for compliance with United States Pharmacopeia (USP)standards [1]. Current efforts have been focused on challenge testing with identified [2] impurities (total organic-carbon), and shelf life testing. The challenge testing flowed known concentrations of contaminants through the IVGEN deionizing cartridge and membrane filters to test their effectiveness. One finding was that the filters and DI-resin themselves contribute to the contaminant load during initial startup, suggesting that the first 100 ml of fluid be discarded. Shelf life testing is ongoing and involves periodic testing of stored DI cartridges and membrane filters that are capped and sealed in hermetic packages. The testing is conducted at six month intervals measuring conductivity and endotoxins in the effluent. Currently, the packaging technique has been successfully demonstrated for one year of storage testing. The USP standards specifies that the TOC be conducted at point of generation as opposed to point of consumption. Samples were generated and shipped to an FDA facility however, testing determined that the samples failed the TOC specification with most likely due to leaching from the sample container. Shelf life testing is examining packaging techniques and periodic testing of samples of DI cartridges that are capped and sealed in hermetic packages. Periodic testing of the purified water output will be conducted at six month intervals.

microgravity applications↗
NASA NTRS2018

Fiber-Based Laser Transmitter Technology Maturation for Spectroscopic Measurements from Space

NASA's Goddard Space Flight Center has been developing lidar to remotely measure CO2 in the Earth's atmosphere. We have advanced the tunable laser technology to enable high-fidelity measurements from space. In this paper, we will report on the progress of fiber-based, 1.57-micron wavelength, laser transmitter that has demonstrated the optical performance required for a low earth orbiting instrument. The laser transmitter has been packaged and is undergoing environmental testing to demonstrate its technology readiness for space.

Laser and Masers↗
NASA NTRS2018

Fiber-Based Laser Transmitter Technology Maturation for Spectroscopic Measurements from Space

NASA's Goddard Space Flight Center has been developing lidar to remotely measure CO2 in the Earth's atmosphere. We have advanced the tunable laser technology to enable high-fidelity measurements from space. In this paper, we will report on the progress of fiber-based, 1.57-micron wavelength, laser transmitter that has demonstrated the optical performance required for a low earth orbiting instrument. The Laser transmitter has been packaged and is undergoing environmental testing to demonstrate its technology readiness for space.

Stephen, Mark↗
NASA NTRS1973

High data rate optical transceiver terminal

The objectives of this study were: (1) to design a 400 Mbps optical transceiver terminal to operate from a high-altitude balloon-borne platform in order to permit the quantitative evaluation of a space-qualifiable optical communications system design, (2) to design an atmospheric propagation experiment to operate in conjunction with the terminal to measure the degrading effects of the atmosphere on the links, and (3) to design typical optical communications experiments for space-borne laboratories in the 1980-1990 time frame. As a result of the study, a transceiver package has been configured for demonstration flights during late 1974. The transceiver contains a 400 Mbps transmitter, a 400 Mbps receiver, and acquisition and tracking receivers. The transmitter is a Nd:YAG, 200 Mhz, mode-locked, CW, diode-pumped laser operating at 1.06 um requiring 50 mW for 6 db margin. It will be designed to implement Pulse Quaternary Modulation (PQM). The 400 Mbps receiver utilizes a Dynamic Crossed-Field Photomultiplier (DCFP) detector. The acquisition receiver is a Quadrant Photomultiplier Tube (QPMT) and receives a 400 Mbps signal chopped at 0.1 Mhz.

Clarke, E. S.↗
NASA NTRS1978

An experiment for Shuttle aerodynamic force coefficient determination from inflight dynamical and atmospheric measurements

A two-phase experiment is proposed which utilizes the Shuttle Orbiter and its unique series of repeated entries into the earth's atmosphere as an airborne in situ aerodynamic testing laboratory. The objective of the experiment is to determine static aerodynamic force coefficients, first of the orbiter, and later of various entry configurations throughout the high speed flight regime, including the transition from free molecule to continuum fluid flow. The objective will be accomplished through analysis of inflight measurements from both shuttle-borne and shuttle-launched instrumented packages. Results are presented to demonstrate the feasibility of such an experiment.

Compton, H. R.↗
NASA NTRS1992

Estimation of propulsion-induced effects on transonic flows over a hypersonic configuration

Boundary conditions are formulated for treating selected patches of a subject configuration as inlet or nozzle areas. For subsonic inflow, the mass flow through the inlet is controlled by the exhaust conditions and the effects of mass and heat addition. For supersonic inflow, the exhaust conditions are based on the inlet conditions and on combustion data. These formulations were included into an existing Euler/Navier-Stokes solver. Comparisons with experimental data demonstrate that the resulting software package efficiently permits the assessment of propulsion-induced effects on external flow fields, particularly around highly blended configurations.

Hartwich, Peter M.↗
NASA NTRS1992

Applications of multigrid software in the atmospheric sciences

Elliptic partial differential equations from different areas in the atmospheric sciences are efficiently and easily solved utilizing the multigrid software package named MUDPACK. It is demonstrated that the multigrid method is more efficient than other commonly employed techniques, such as Gaussian elimination and fixed-grid relaxation. The efficiency relative to other techniques, both in terms of storage requirement and computational time, increases quickly with grid size.

Adams, J.↗
NASA NTRS1993

Laser-based firing systems for prompt initiation of secondary explosives

Motivated by issues of weapon safety and security, laser based firing systems for promptly initiating secondary explosives have been under active development at Sandia National Laboratories for more than four years. Such a firing system consists of miniaturized, Q-switched, solid-state laser, optical detonators, optical safety switches, and elements for splitting, coupling, and transmitting the laser output. Potential system applications pose significant challenges in terms of server mechanical and thermal environments and packaging constraints, while requiring clear demonstration of safety enhancements. The Direct Optical Initiation (DOI) Program at Sandia is addressing these challenges through progress development phases during which the design, fabrication, and testing of prototype hardware is aimed at more difficult application requirements. A brief history of the development program, and a summary of current and planned activities, will be presented.

Meeks, Kent D.↗
NASA NTRS1994

Advanced End-to-end Simulation for On-board Processing (AESOP)

Developers of data compression algorithms typically use their own software together with commercial packages to implement, evaluate and demonstrate their work. While convenient for an individual developer, this approach makes it difficult to build on or use another's work without intimate knowledge of each component. When several people or groups work on different parts of the same problem, the larger view can be lost. What's needed is a simple piece of software to stand in the gap and link together the efforts of different people, enabling them to build on each other's work, and providing a base for engineers and scientists to evaluate the parts as a cohesive whole and make design decisions. AESOP (Advanced End-to-end Simulation for On-board Processing) attempts to meet this need by providing a graphical interface to a developer-selected set of algorithms, interfacing with compiled code and standalone programs, as well as procedures written in the IDL and PV-Wave command languages. As a proof of concept, AESOP is outfitted with several data compression algorithms integrating previous work on different processors (AT&T DSP32C, TI TMS320C30, SPARC). The user can specify at run-time the processor on which individual parts of the compression should run. Compressed data is then fed through simulated transmission and uncompression to evaluate the effects of compression parameters, noise and error correction algorithms. The following sections describe AESOP in detail. Section 2 describes fundamental goals for usability. Section 3 describes the implementation. Sections 4 through 5 describe how to add new functionality to the system and present the existing data compression algorithms. Sections 6 and 7 discuss portability and future work.

Mazer, Alan S.↗
NASA NTRS2003

High Energy Boundary Conditions for a Cartesian Mesh Euler Solver

Inlets and exhaust nozzles are common place in the world of flight. Yet, many aerodynamic simulation packages do not provide a method of modelling such high energy boundaries in the flow field. For the purposes of aerodynamic simulation, inlets and exhausts are often fared over and it is assumed that the flow differences resulting from this assumption are minimal. While this is an adequate assumption for the prediction of lift, the lack of a plume behind the aircraft creates an evacuated base region thus effecting both drag and pitching moment values. In addition, the flow in the base region is often mis-predicted resulting in incorrect base drag. In order to accurately predict these quantities, a method for specifying inlet and exhaust conditions needs to be available in aerodynamic simulation packages. A method for a first approximation of a plume without accounting for chemical reactions is added to the Cartesian mesh based aerodynamic simulation package CART3D. The method consists of 3 steps. In the first step, a components approach where each triangle is assigned a component number is used. Here, a method for marking the inlet or exhaust plane triangles as separate components is discussed. In step two, the flow solver is modified to accept a reference state for the components marked inlet or exhaust. In the third step, the flow solver uses these separated components and the reference state to compute the correct flow condition at that triangle. The present method is implemented in the CART3D package which consists of a set of tools for generating a Cartesian volume mesh from a set of component triangulations. The Euler equations are solved on the resulting unstructured Cartesian mesh. The present methods is implemented in this package and its usefulness is demonstrated with two validation cases. A generic missile body is also presented to show the usefulness of the method on a real world geometry.

Pandya, Shishir↗
NASA NTRS2005

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Ngo, Quoc↗
NASA NTRS2005

Step 1: Human System Integration Simulation and Flight Test Progress Report

The Access 5 Human Systems Integration Work Package produced simulation and flight demonstration planning products for use throughout the program. These included: Test Objectives for Command, Control, Communications; Pilot Questionnaire for Command, Control, Communications; Air Traffic Controller Questionnaire for Command, Control, Communications; Test Objectives for Collision Avoidance; Pilot Questionnaire for Collision Avoidance; Plans for Unmanned Aircraft Systems Control Station Simulations Flight Requirements for the Airspace Operations Demonstration

Source record↗