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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 73 records · Page 4
All sourcesNASA NTRSDOE OSTI
NASA NTRS1969

Design of printed circuit coils

Spiral-like coil is printed with several extra turns which increase the realizable coil inductance. Included are shorting connections which not only short the extra turns, but also short out several turns of the main body. Coil tuning is accomplished by removing the shorts until the desired inductance is obtained.

Higgins, W. T.↗
NASA NTRSDate not supplied

A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed Circuit Boards↗
NASA NTRS1971

Development of nondestructive testing techniques for plated-through holes in multilayer printed circuit boards

The development of a nondestructive test with the capability to interrogate plated-through holes as small as 0.51 millimeters inside diameter is discussed. The system can detect defects such as holes, voids, cracks, and thin spots that reduce the current carrying capability of plates-through interconnects by 20 percent or more. Efforts were directed toward the design and fabrication of magnetic circuitry mutual coupling probes and to evaluate the effectiveness of these devices for detecting in multilayer board plated-through holes.

Anthony, P. L.↗
NASA NTRS1976

Printed-circuit solar-cell array

Flexible solar-cell array is made thinner and lighter by placing array on substrate which is a lamination of two sheets of plastic film with etched electrical connector for cells between films.

Currier, R. F.↗
NASA NTRS1983

Printed Circuit Converts RF Energy to dc Power

Ultra-light-weight, large area, antenna/rectifier has 85 percent conversion efficiency. System consists of large number of repetitive circuits called "rectenna elements." Each element produces 2 W of power, comprises half-wave dipole, input filter, and Schottky barrier dipole. Two-wire microwave transmission lines act as dc power collecting buses.

Triner, J.↗
NASA NTRS1985

Crossover Concept for Optical Printed Circuits

It is possible to reduce crosstalk between optical signals in intersecting optical conductors by taking two steps: Minimize amount of light diffracted into wrong conductor by selecting optimum conductor width, and place light traps in each conductor. How well techniques work depends in part on quality of optical conductors (partically surface smoothness) and on how closely optical-signal mode of propagation approaches ideal. Nature of signals also important: With digital signals, less crosstalk attenuation required than for analog signals.

Jamieson, R. S.↗
NASA NTRS2004

Printed Circuit Board Design (PCB) with HDL Designer

Contents include the following: PCB design with HDL designer, design process and schematic capture - symbols and diagrams: 1. Motivation: time savings, money savings, simplicity. 2. Approach: use single tool PCB for FPGA design, more FPGA designs than PCB designers. 3. Use HDL designer for schematic capture.

Winkert, Thomas K.↗