A Roadmap for Space Microelectronics Technology into the New Millennium
Advances in microelectronics technologies over the past several decades have truely revolutionized modern society in almost every aspect of human endeavor.
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Advances in microelectronics technologies over the past several decades have truely revolutionized modern society in almost every aspect of human endeavor.
Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies.
Describes the New Millenium Program, including the scope of the Microelectronics Systems IPDT as well as its current membership. Also summarizes the results of the IPDT technology roadmapping process. They describe the technologies selected as well as the avionics architecture chosen for validation of the first NMP spacecraft, to be launched inJauary 1998.
Material degradation during the fabrication of microelectronic devices has plagued the space industry for many years owing to the layering of many dissimilar metals to create these devices. Often, commonly used materials and systems are overlooked as potential sources of material degradation. This technical bulletin highlights extensive research to isolate probable causes of this degradation.
Slides providing an overview of microelectronics cybersecurity and research concepts at INL.
In the past, the role of strategic planning for semiconductor industry was met by the International Technology Roadmap for Semiconductors (ITRS), serving as a guiding light that provided manufacturers, designers, equipment suppliers, and researchers with direction years in advance. By providing a common framework for coordination across semiconductor industry stakeholders, technology development efforts were efficient and aligned. However, the dissolution of the ITRS in 2015 left a void, leading to years of disjointed efforts. Recognizing the need for unified guidance, the industry rallied for the creation of a new strategic plan, the Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap (2023) was developed, through the efforts of hundreds of industry, academic and government experts, to provide detailed strategies for achieving these goals. This comprehensive plan outlines ambitious goals for the industry's future.
The MicroEleX code package contains a variety of models and algorithms for physical modeling of microelectronic circuitry, including electrostatics, electrodynamics, superconducting physics, micromagnetics, multi-ferroic systems, and quantum transport. MicroEleX leverages the AMReX software framework to provide scalability on GPU-based supercomputing architectures. The code is open source and designed to be algorithmically flexible so developers can incorporate enhanced or customized physics.
A pulsed laser testing system for rapid screening of single-event latch-up (SEL) in microelectronics with real-time visualization of sensitive nodes via photo-emission is presented. We provide a detailed overview of the system, followed by SEL threshold measurements in an analog-to-digital converter (AD9240). We find that SEL thresholds are comparable to measurements taken with a low-repetition rate, fixed beam system, and demonstrate full-die scanning speeds can be an order of magnitude faster
Design philosophy and fabrication technology of microelectronic function blocks for spacecraft electronic equipment
Microelectronic function blocks and their use in low level amplifiers for space applications
Design, fabrication and performance of minimum power microelectronic circuits and subsystems
Failure analyses on eleven microelectronic devices subjected to temperature-stress cycling, and life testing
Failure analyses on microelectronic devices subjected to temperature-stress cycling, and life testing
Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.
Failure modes and mechanisms in integrated microcircuits and other microelectronic devices
Ion implementation for microelectronics
Microelectronics data bank pilot program, with directory and indexes on monolithic microcircuits
Pilot test evaluation of microelectronics data bank response to operational communication