Adhesive bonding for metal-lined filament-wound cryogenic pressure vessels.
Adhesives to bond metal linings to filament- wound cryogenic pressure vessels evaluated by test series simulating fabrication and service conditions
FILAMENT WINDING↗
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Results for “METAL BONDING”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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An XPS study of silicon/noble metal interfaces - Bonding trends and correlations with the Schottky barrier heights
This X-ray photoemission (XPS) study demonstrates a correlation of intrinsic TM-Si chemical bond formation with Schottky barrier heights for the near-noble transition metals (TM = Ni, Pd, Pt) and their corresponding silicides (TM2Si and TMSi) on Si(100). It is found that the barrier height correlates with the strength of the TM-Si orbital interaction as well as with the charge density around the Si atom. These observations suggest a dominant role for intrinsic chemical interactions in establishing the Schottky barrier heights in these TM-Si systems.
Grunthaner, P. J.↗
Ceramic susceptor for induction bonding of metals, ceramics, and plastics
A thin (.005) flexible ceramic susceptor (carbon) was discovered. It was developed to join ceramics, plastics, metals, and combinations of these materials using a unique induction heating process. Bonding times for laboratory specimens comparing state of the art technology to induction bonding were cut by a factor of 10 to 100 times. This novel type of carbon susceptor allows for applying heat directly and only to the bondline without heating the entire structure, supports, and fixtures of a bonding assembly. The ceramic (carbon film) susceptor produces molten adhesive or matrix material at the bond interface. This molten material flows through the perforated susceptor producing a fusion between the two parts to be joined, which in many instances has proven to be stronger than the parent material. Bonding can be accomplished in 2 minutes on areas submitted to the inductive heating. Because a carbon susceptor is used in bonding carbon fiber reinforced plastics and ceramics, there is no radar signature or return making it an ideal process for joining advanced aerospace composite structures.
Fox, Robert L.↗
Finite element applications to explore the effects of partial bonding on metal matrix composite properties
The mechanics of materials approach (definition of E, G, Nu, and Alpha) and the finite element method are used to explore the effects of partial bonding and fiber fracture on the behavior of high temperature metal matrix composites. Composite ply properties are calculated for various degrees of disbonding to evaluate the sensitivity of these properties to the presence of fiber/matrix disbonding and fiber fracture. The mechanics of materials approach allows for the determination of the basic ply material properties needed for design/analysis of composites. The finite element method provides the necessary structural response (forces and displacements) for the mechanics of materials equations. Results show that disbonding of fractured fibers affect only E sub (111) and alpha sub (111) significantly.
Caruso, J. J.↗
Finite element applications to explore the effects of partial bonding on metal matrix composite properties
The mechanics of materials approach (definition of E, G, nu, and alpha) and the finite element method are used to explore the effects of partial bonding and fiber fracture on the behavior of high temperature metal matrix composites. Composite ply properties are calculated for various degrees of disbonding to evaluate the sensitivity of these properties to the presence of fiber/matrix disbonding and fiber fracture. The mechanics of materials approach allows for the determination of the basic ply material properties needed for design/analysis of composites. The finite element method provides the necessary structural response (forces and displacements) for the mechanics of materials equations. Results show that disbonding of fractured fibers affect only E-l(11) and alpha-l(11) significantly.
Caruso, J. J.↗
Investigation of bonding between metals and ceramics I : nickel, cobalt, iron, or chromium with boron carbide
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MATERIALS - TEMPERATURE, HIGH↗
Thermal barrier coating system having improved adhesion
The adherence between a ceramic thermal barrier coating and a metal bond coating is improved by ion sputtering a ceramic film on the bond cost. A ceramic thermal barrier coating is then plasma-sprayed onto this primer film. This improves the integrity and strength of the interface between the plasma-sprayed ceramic layer and metallic bond coat which insures stronger adherence between the metal and the ceramic.
Bill, R. C.↗
Explosive bonding of metal-matrix composites
Explosive bonding process produces sheet composites of aluminum alloy reinforced by high-strength stainless steel wires. The bonds are excellent metallurgically, no external heat is required, various metals can be bonded, and the process is inexpensive.
Reece, O. Y.↗
Structure and ultrafast dynamics of tri-nuclear Ag-/Tl–Pt 2 POP 4 complexes in solution
The energetics and dynamics of ion assembly in solution has broad influence in nanomaterials and inorganic synthesis. To investigate the fundamental processes involved, we present a time-resolved x-ray solution scattering (TR-XSS) study of the trinuclear silver and thallium complexes of the diplatinum ion PtPOP [Pt 2 (H 2 P 2 O 5 )$_4^{4−}$] in aqueous solution. These complexes, their structural properties, and their electronic structure are not well understood and afford a unique opportunity to study the metal–metal bond formation that influences molecular and material assembly in solution. We present model-independent analysis of the observed dynamics as well as an analysis incorporating time-resolved structural refinements of key bond lengths with $<$100 fs time resolution. We find that upon photoexcitation, the Pt atoms contract ∼0.25 Å toward the center of both the Ag- and the Tl-PtPOP complexes, as previously observed for the PtPOP anion. For the AgPtPOP system, an ultrafast Ag-Pt bond expansion of ∼0.2 Å is observed, whereas in contrast, the TlPtPOP system exhibits a Tl-Pt bond contraction of ∼0.3 Å upon photoexcitation. For both complexes, the change in electronic state leads to coherent (“wave-packet”) oscillations along the metal–Pt coordinates. Based on these structural dynamics, we propose an electronic structure model that describes the metal–metal bonding behavior in both the ground and excited state for both complexes.
Lenzen, Philipp [Technical Univ. of Denmark, Lyngb↗
Effects of Carbonyl Bond and Metal Cluster Dissociation and Evaporation Rates on Predictions of Nanotube Production in HiPco
The high-pressure carbon monoxide (HiPco) process for producing single-wall carbon nanotubes (SWNT) uses iron pentacarbonyl as the source of iron for catalyzing the Boudouard reaction. Attempts using nickel tetracarbonyl led to no production of SWNTs. This paper discusses simulations at a constant condition of 1300 K and 30 atm in which the chemical rate equations are solved for different reaction schemes. A lumped cluster model is developed to limit the number of species in the models, yet it includes fairly large clusters. Reaction rate coefficients in these schemes are based on bond energies of iron and nickel species and on estimates of chemical rates for formation of SWNTs. SWNT growth is measured by the co-formation of CO2. It is shown that the production of CO2 is significantly greater for FeCO due to its lower bond energy as compared with that ofNiCO. It is also shown that the dissociation and evaporation rates of atoms from small metal clusters have a significant effect on CO2 production. A high rate of evaporation leads to a smaller number of metal clusters available to catalyze the Boudouard reaction. This suggests that if CO reacts with metal clusters and removes atoms from them by forming MeCO, this has the effect of enhancing the evaporation rate and reducing SWNT production. The study also investigates some other reactions in the model that have a less dramatic influence.
Scott, Carl D.↗
Iridium Interfacial Stack - IrIS
Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.
Spry, David↗
Acoustic emission analysis: A test method for metal joints bonded by adhesives
Acoustic emission analysis is applied to study adhesive joints which had been subjected to mechanical and climatic stresses, taking into account conditions which make results applicable to adhesive joints used in aerospace technology. Specimens consisting of the alloy AlMgSi0.5 were used together with a phenolic resin adhesive, an epoxy resin modified with a polyamide, and an epoxy resin modified with a nitrile. Results show that the acoustic emission analysis provides valuable information concerning the behavior of adhesive joints under load and climatic stresses.
Brockmann, W.↗
Examining metal-phosphorus bonds: Submillimeter spectroscopy of the CrP radical (X4Σ−)
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M.A. Burton↗
Bonding Diamond To Metal In Electronic Circuits
Improved technique for bonding diamond to metal evolved from older technique of soldering or brazing and more suitable for fabrication of delicate electronic circuits. Involves diffusion bonding, developed to take advantage of electrically insulating, heat-conducting properties of diamond, using small diamond bars as supports for slow-wave transmission-line structures in traveling-wave-tube microwave amplifiers. No fillets or side coats formed because metal bonding strips not melted. Technique also used to mount such devices as transistors and diodes electrically insulated from, but thermally connected to, heat sinks.
Jacquez, Andrew E.↗
Adhesion between atomically pure metallic surfaces, part iv semiannual report no. 2
Experimental investigation of physical adhesion, measurement of contact area during adhesion process, and effect of adsorbed or impurity species on metal-metal bonding
CONTACT↗
Insights into the Complexation of Actinides by Diethylenetriaminepentaacetic Acid from Characterization of the Americium(III) Complex
Diethylenetriaminepentaacetic acid (DTPA) is a frequently used chelator in the nuclear and medical industries, especially for the complexation of trivalent actinides. However, structural data on these complexes in the solid-state have long remained elusive. Herein, a detailed structural analysis of the presented crystal structures of [C(NH 2 ) 3 ] 4 [Nd(DTPA)] 2 · n H 2 O and [C(NH 2 ) 3 ] 4 [Am(DTPA)] 2 · n H 2 O, where [C(NH 2 ) 3 ] + is guanidinium, details the subtle differences in the Lewis acidity between a lanthanide/actinide pair of similar ionic sizes. Contractions in nitrogen–metal bond lengths between neodymium(III) and americium(III) were observed, while the metal–oxygen bonds remained relatively consistent, highlighting the marginal favorability for actinide complexation over the lanthanides with moderately soft N-donors. Spectroscopic analysis shows significant splitting of many transitions and relatively strong electronic interactions with traditionally low-intensity transitions in the americium complex, as is demonstrated in the 7 F 0 → 7 F 5 transitions. Pressure-induced spectroscopic analysis showed surprisingly little effect on the americium complex, with 5 f →5 f transitions either not shifting or marginally shifting from 2 to 3 nm at 11.93 ± 0.06 GPa─atypical of a soft, N-donor americium complex under pressure. Finally, large voids occupied by water molecules in between the complexes within the crystal structure may be responsible for the lack of pressure response in the 5 f →5 f transitions.
absorption spectroscopy↗