Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “MCM”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

63 records · Page 4

Interconnect and Packaging Technologies for Terahertz Communication Systems

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

Micromachining↗

Medical Countermeasures for Radiation Induced Health Effects: Reports of an Interagency Panel Session Held at the NASA Human Research Program Investigator's Workshop, January 26, 2017

An Interagency Panel Session organized by the NASA Human Research Program Space Radiation Program Element (SRPE) was held during the NASA Human Research Program (HRP) Investigator’s Workshop (IWS) in Galveston, Texas on January 26, 2017 to identify complementary research areas that will advance the testing and development of medical countermeasures (MCM) in support of radioprotection and radiation mitigation on the ground and in space. There were several areas of common interest identified among the various participating agencies. This report provides a summary of the topics discussed by each agency along with potential areas of intersection for mutual collaboration opportunities. Common goals included repurposing of pharmaceuticals, neutraceuticals for use as radioprotectors and/or mitigators, low-dose/chronic exposure paradigms, late effects post-radiation exposure, mixed-field exposures of gamma-neutron, performance decrements, and methods to determine individual exposure levels.

Carnell, Lisa S.↗

Cold Survivable Current Sense Multi-Chip Module

This paper will present the design of a Current Sense Module (CSM) used to measure motor phase currents that is capable of surviving the harsh ambient environment of ocean worlds, such as Europa and Enceladus. The CSM module is fabricated by i3 Electronics using their Multi-Chip Module (MCM) technology with techniques developed by JPL to allow this module to survive temperatures down to -184°C. This module greatly improves the ability to measure phase and bridge current which can be problematic in extreme environments. In addition, by packaging these electronics at the die level, we achieve significant weight and size savings. This module is one of several modules that employ similar techniques that are integrated into a distributed or centralized motor controller. This paper will discuss the module’s design along with a summary of our test results.

Cheng, Ben↗

An extensive ab initio study of the structures, vibrational spectra, quadratic force fields, and relative energetics of three isomers of Cl2O2

Quantum mechanical computational methods are employed for an ab initio investigation of: (1) the molecular properties of the lowest isomers of the ClO dimer; and (2) predicted molecular and thermochemical properties. Techniques employed include electron correlation and particularly singles and doubles coupled-cluster (CCSD) theory with or without perturbational estimates of the effects of connected triple excitations. The isomers ClOClO and ClClO2 are found to have higher energies than the ClOOCl isomer, and the theoretical vibrational frequencies of the isomers are well correlated with experimental data. Experimental values of the heat of formation for the isomers are also compared with calculations based on an isodesmic reaction with Cl2O, H2O, and HOOH.

Lee, Timothy J.↗

Review of Stack CSP Technologies

CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.

3D CSP stack CSP Chip Scale Package MCM Mulitchip ↗

Microtechnology in Telecommunications for Spacecraft Cost and Mass Reduction

This paper examines the incorporation of both microelectronics and micromachining (termed microtechnologies) as applied to deep space telecommunication subsystems. Using the Pluto Fast Flyby Pre-Project as a main case study we have reduced the subsystem mass by 50%.

MCM amplifiers filters switches Goldstone Deep Spa↗