The LVLASO I/O Concentrator Software Description
This paper describes the software written for the VO Concentrator Unit in support of the Low Visibility Landing and Surface Operations (LVLASO) experiment flown on-board NASA's Boeing 757 aircraft.
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This paper describes the software written for the VO Concentrator Unit in support of the Low Visibility Landing and Surface Operations (LVLASO) experiment flown on-board NASA's Boeing 757 aircraft.
The National Aeronautics and Space Administration (NASA) Data Assimilation Office (DAO) at the Goddard Space Flight Center (GSFC) has developed the GEOS DAS, a data assimilation system that provides production support for NASA missions and will support NASA's Earth Observing System (EOS) in the coming years. The GEOS DAS will be used to provide background fields of meteorological quantities to EOS satellite instrument teams for use in their data algorithms as well as providing assimilated data sets for climate studies on decadal time scales. The DAO has been involved in prototyping parallel implementations of the GEOS DAS for a number of years and is now embarking on an effort to convert the production version from shared-memory parallelism to distributed-memory parallelism using the portable Message-Passing Interface (MPI). The GEOS DAS consists of two main components, an atmospheric General Circulation Model (GCM) and a Physical-space Statistical Analysis System (PSAS). The GCM operates on data that are stored on a regular grid while PSAS works with observational data that are scattered irregularly throughout the atmosphere. As a result, the two components have different data decompositions. The GCM is decomposed horizontally as a checkerboard with all vertical levels of each box existing on the same processing element(PE). The dynamical core of the GCM can also operate on a rotated grid, which requires communication-intensive grid transformations during GCM integration. PSAS groups observations on PEs in a more irregular and dynamic fashion.
We present a model for data reorganization in parallel disk systems that is geared towards load balancing in an environment with periodic access patterns. Data reorganization is performed by disk cooling, i.e. migrating files or extents from the hottest disks to the coldest ones. We develop an approximate queueing model for determining the effective arrival rates of cooling requests and discuss its use in assessing the costs versus benefits of cooling.
We describe a benchmark problem, based on the Block-Tridiagonal (BT) problem of the NAS Parallel Benchmarks (NPB), which is used to test the output capabilities of high-performance computing systems, especially parallel systems. We also present a source code implementation of the benchmark, called NPBIO2.4-MPI, based on the MPI implementation of NPB, using a variety of ways to write the computed solutions to file.
The two primary goals for this report were the design, contruction and modeling of parallel disk arrays for scientific visualization and animation, and a study of the IO requirements of highly parallel applications. In addition, further work in parallel display systems required to project and animate the very high-resolution frames resulting from our supercomputing simulations in ocean circulation and compressible gas dynamics.
This paper presents the effects of paste printing parameters including stencil thickness, squeegee length and materials, and pressurized head on solder paste volume.
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This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.
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The scientific computing paradigm has transitioned from compute-intensive to I/O-intensive and memory-intensive in the past decade, especially when data-driven science has become common practice. Numerous empirical I/O-aware scheduling optimizations have been developed by incorporating I/O capacity and bandwidth as constraints into scheduling. Unfortunately, there is a lack of data flow (I/O) characterization tool and an understanding of trade-offs between concurrency, locality, and I/O bandwidth. To bridge the gap, this work 1) presents a set of descriptors to characterize, organize, and visualize I/O profiles, including flow size, I/O bandwidth, and operation count, which group data flows by I/O types, tasks, and files; 2) proposes an I/O Roofline model-based trade-off analysis to find the optimal trade-off between flow operational intensity, concurrency, and flow performance. The I/O descriptors generate useful insights into complicated I/O behaviors, suggesting distinct concurrency, storage, and scheduling to be used by types, tasks, and files. The proposed trade-off analysis guides scheduling decisions that generate resource assignment with the best flow parallelism. We evaluate our I/O-aware scheduling methodology on a highly I/O-intensive workflow–1000 Genomes. The experimental results demonstrate speedups of up to 2.4× compared to the state-of-the- art methods.
In a data system having a memory, plural input/output (I/O) devices and a bus connecting each of the I/O devices to the memory, a direct memory access (DMA) controller regulating access of each of the I/O devices to the bus, including a priority register storing priorities of bus access requests from the I/O devices, an interrupt register storing bus access requests of the I/O devices, a resolver for selecting one of the I/O devices to have access to the bus, a pointer register storing addresses of locations in the memory for communication with the one I/O device via the bus, a sequence register storing an address of a location in the memory containing a channel program instruction which is to be executed next, an ALU for incrementing and decrementing addresses stored in the pointer register, computing the next address to be stored in the sequence register, computing an initial contents of each of the register. The memory contains a sequence of channel program instructions defining a set up operation wherein the contents of each of the registers in the channel register is initialized in accordance with the initial contents computed by the ALU and an access operation wherein data is transferred on the bus between a location in the memory whose address is currently stored in the pointer register and the one I/O device enabled by the resolver.
Two prototype Reconfigurable, Bi-directional Flexfet Level Shifters (ReBiLS) have been developed, where one version is a stand-alone component designed to interface between external low voltage and high voltage, and the other version is an embedded integrated circuit (IC) for interface between internal low-voltage logic and external high-voltage components. Targeting stand-alone and embedded circuits separately allows optimization for these distinct applications. Both ReBiLS designs use the commercially available 180-nm Flex fet Independently Double-Gated (IDG) SOI CMOS (silicon on insulator, complementary metal oxide semiconductor) technology. Embedded ReBiLS circuits were integrated with a Reed-Solomon (RS) encoder using CMOS Ultra-Low-Power Radiation Tolerant (CULPRiT) double-gated digital logic circuits. The scope of the project includes: creation of a new high-voltage process, development of ReBiLS circuit designs, and adjustment of the designs to maximize performance through simulation, layout, and manufacture of prototypes. The primary technical objectives were to develop a high-voltage, thick oxide option for the 180-nm Flexfet process, and to develop a stand-alone ReBiLS IC with two 8-channel I/O busses, 1.8 2.5 I/O on the low-voltage pins, 5.0-V-tolerant input and 3.3-V output I/O on the high-voltage pins, and 100-MHz minimum operation with 10-pF external loads. Another objective was to develop an embedded, rad-hard ReBiLS I/O cell with 0.5-V low-voltage operation for interface with core logic, 5.0-V-tolerant input and 3.3-V output I/O pins, and 100-MHz minimum operation with 10- pF external loads. A third objective was to develop a 0.5- V Reed-Solomon Encoder with embedded ReBilS I/O: Transfer the existing CULPRiT RS encoder from a 0.35-micron bulk-CMOS process to the ASI 180-nm Flexfet, rad-hard SOI Process. 0.5-V low-voltage core logic. 5.0-V-tolerant input and 3.3-V output I/O pins. 100-MHz minimum operation with 10- pF external loads. The stand-alone ReBiLS chip will allow system designers to provide efficient bi-directional communication between components operating at different voltages. Embedding the ReBiLS cells into the proven Reed-Solomon encoder will demonstrate the ability to support new product development in a commercially viable, rad-hard, scalable 180-nm SOI CMOS process.
Reduced Instruction Set Computer (RISC) workstations and Personnel Computers (PC) are very popular tools for office automation, command and control, scientific analysis, database management, and many other applications. However, when using Input/Output (I/O) intensive applications, the RISC workstations and PC's are often overburdened with the tasks of collecting, staging, storing, and distributing data. Also, by using standard high-performance peripherals and storage devices, the I/O function can still be a common bottleneck process. Therefore, the high-performance mass storage system, developed by Loral AeroSys' Independent Research and Development (IR&D) engineers, can offload a RISC workstation of I/O related functions and provide high-performance I/O functions and external interfaces. The high-performance mass storage system has the capabilities to ingest high-speed real-time data, perform signal or image processing, and stage, archive, and distribute the data. This mass storage system uses a hierarchical storage structure, thus reducing the total data storage cost, while maintaining high-I/O performance. The high-performance mass storage system is a network of low-cost parallel processors and storage devices. The nodes in the network have special I/O functions such as: SCSI controller, Ethernet controller, gateway controller, RS232 controller, IEEE488 controller, and digital/analog converter. The nodes are interconnected through high-speed direct memory access links to form a network. The topology of the network is easily reconfigurable to maximize system throughput for various applications. This high-performance mass storage system takes advantage of a 'busless' architecture for maximum expandability. The mass storage system consists of magnetic disks, a WORM optical disk jukebox, and an 8mm helical scan tape to form a hierarchical storage structure. Commonly used files are kept in the magnetic disk for fast retrieval. The optical disks are used as archive media, and the tapes are used as backup media. The storage system is managed by the IEEE mass storage reference model-based UniTree software package. UniTree software will keep track of all files in the system, will automatically migrate the lesser used files to archive media, and will stage the files when needed by the system. The user can access the files without knowledge of their physical location. The high-performance mass storage system developed by Loral AeroSys will significantly boost the system I/O performance and reduce the overall data storage cost. This storage system provides a highly flexible and cost-effective architecture for a variety of applications (e.g., realtime data acquisition with a signal and image processing requirement, long-term data archiving and distribution, and image analysis and enhancement).
Each RAID level reflects a different design architecture. Associated with each is a backdrop of imposed limitations, as well as possibilities which may be exploited within the architectural constraints of that level. There are three unique features that differentiate RAID 7 from all other levels. RAID 7 is asynchronous with respect to usage of I/O data paths. Each I/O drive (includes all data and one parity drives) as well as each host interface (there may be multiple host interfaces) has independent control and data paths. This means that each can be accessed completely, independently, of the other. This is facilitated by a separate device cache for each device/interface as well. RAID 7 is asynchronous with respect to device hierarchy and data bus utilization. Each drive and each interface is connected to a high speed data bus controlled by the embedded operating system to make independent transfers to and from central cache. RAID 7 is asynchronous with respect to the operation of an embedded real time process oriented operating system. This means that exclusive and independent of the host, or multiple host paths, the embedded OS manages all I/O transfers asynchronously across the data and parity drives. A key factor to consider is that of the RAID 7's ability to anticipate and match host I/O usage patterns. This yields the following benefits over RAID's built around micro-code based architectures. RAID 7 appears to the host as a normally connected Big Fast Disk (BFD). RAID 7 appears, from the perspective of the individual disk devices, to minimize the total number of accesses and optimize read/write transfer requests. RAID 7 smoothly integrates the random demands of independent users with the principles of spatial and temporal locality. This optimizes small, large, and time sequenced I/O requests which results in users having an I/O performance which approaches performance to that of main memory.