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At least 73 records · Page 4

Optimization of Rocket Engine Components using Multi-Metallic Additive Manufacturing

Additive manufacturing (AM) is advancing many applications of component design for liquid rocket engines. AM has been demonstrated in various rocket component applications using a variety of monolithic metal alloys, many of which are traditional alloys for extreme environments. NASA and industry partners have focused in recent years to advance processing to create bimetallic and multicomponent AM processes and materials. The role of multi-metallic AM offers advantages since it can further optimize weight, optimize reliability and performance by increasing the strength to weight ratio of a component, and can optimize materials for various engineering requirements. NASA’s Rapid Analysis and Manufacturing Propulsion Technology (RAMPT) project has designed and manufactured a series of additively manufactured (AM) coupled combustion chambers, nozzles, and other engine components to advance new AM processes and materials with the goal of reducing cost and schedule for engine manufacturing. These designs incorporated multimetallic AM, which further enabled carbon-fiber composite overwrap to reduce overall thrust chamber assembly (TCA) mass. Various AM processes were demonstrated on these components using a copper-based alloy/superalloy bimetallic solution. The AM processes being explored individually and in combination for bimetallic applications include Laser Powder Bed Fusion (L-PBF), Laser Powder Directed Energy Deposition (LP-DED), and cold spray. The combination of bimetallic material combinations explored in this research include GRCop-based alloys and superalloys, Inconel 625 or NASA HR-1. One unique development that will be presented is the combustion chamber and nozzle as a single component by using freeform integrated DED to build the nozzle directly onto the aft end of the chamber. The various aspects of the additive manufacturing processes and challenges, materials characterization and mechanical testing, and hot-fire testing of bimetallic components in a relevant rocket engine environment will be discussed.

Additive Manufacturing

Containerless processing and rapid solidification of Nb-Si alloys of hypereutectic composition

A combination of bulk undercooling in an electromagnetic levitation apparatus and splat quenching between two copper plates is used to process Nb-Si alloys in order to maximize rapid solidification conditions and minimize the effects of recalescence, with emphasis on the solidification of characteristics of alloys in the 21 to 27 at. pct Si range of composition. SEM and TEM as well as X-ray diffraction are used to characterize the microstructures of the processed samples. In the range of compositions studied, the splat-quenched drops always formed the tetragonal Nb3Si phase directly from the liquid. Drops solidified in the coil were characterized by the presence of the primary intermetallic Nb5Si3 and the absence of both peritectic Nb3Si and the equilibrium eutectic. In these cases, a metastable alpha-Nb + beta-Nb5Si3 eutectic formed. The results are discussed in terms of possible metastable configurations of the Nb-Si phase diagram as well as concepts of nucleation and growth kinetics applied to the Nb3Si and Nb5Si3 intermetallics.

Hofmeister, W. H.

Total Recycling of Copper Cable Scrap and Production of Carbon Using Fast Microwave Technology

The recycling of cable scrap, particularly from discarded electrical wiring, is gaining significant attention due to the rising demand for copper and the need for sustainable management of electronic waste. Traditionally, mechanical and thermal processings have been used to recover copper and plastic from cables. However, these approaches are often energy-intensive, time-consuming, and costly in terms of equipment and labor. In this study, we present a simple and effective method for recovering materials from cable scrap using a domestic microwave oven. Cable pieces (2–2.5 cm long) were exposed to 700 W of microwave irradiation under rotation for 30 s, enabling the rapid and efficient separation of high-quality copper metal from the core wire, and activated carbon from the carbonized plastic sheath. Microwaves facilitate this process through Ohmic heating, which induces electrical resistance in the metal, generating heat that mechanically loosens the metal and carbonized plastic components. The process demonstrates high efficiency, achieving an 80% reduction in energy consumption compared to conventional processings. This fast and energy-efficient method shows strong potential for scaling up to industrial recycling, offering a cost-effective and environmentally friendly way to recover high-quality materials for further use or repurposing.

Bourlinos, Athanasios B. (ORCID:0000000256165993)

Development of Surfaces Optically Suitable for Flat Solar Panels

A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces is described. A phase locked detection system for the reflectometer is also described. A selective coating on aluminum potentially useful for flat plate solar collector applications is presented. The coating is composed of strongly bound copper oxide (divalent) and is formed by an etching process performed on an aluminum alloy with high copper content. Fabrication costs are expected to be small due to the one stop fabrication process. A number of conclusions gathered from the literature as to the required optical properties of flat plate solar collectors are discussed.

Source record

Applications of Atomic Layer Deposition in the Modification of Carbon Nanotubes

Atomic Layer Deposition (ALD) is a cost-effective nanoadditive-manufacturing technique that allows for conformal coating of substrates with atomic control in a benign temperature and pressure environment. Using paired precursor gases, thin films can be deposited on flat or textured surfaces ranging from glass, polymers, aerogels, and metals. Through atomic layer control, where single layers of atoms are deposited, fabrication of metal transparent films, nano-laminates, and coatings of nano-channels and pores is achievable. Reaction mechanisms in ALD are normally self-limiting, allowing for atomically accurate control of nanometer (nm) thicknesses. Therefore, high uniformity and precise thickness control make ALD an attractive process for the creation of novel nano-scale devices. Decreases in resistivity and density of electrical wire are needed to improve the function of electronics, electric motors and cables. Such improvements may be accomplished by adding ballistically conducting, metallic carbon nanotubes (CNT) to Cu. ALD was used to coat multiple substrates including CNT with Cu in an effort to make CNT-Cu composites which is more conductive and less dense than Cu. In addition, ALD can be used to as a method to deposit the catalyst layer seed layer for CNT growth using Ni. The ALD of copper metallic films can follow multiple reaction pathways depending on the ALD precursors used. For this work the reaction pathway was deposition of copper oxide and then post process annealing in a hydrogen environment. Copper(II) diacetylacetonate (Cu(acac)2) and ozone are used as precursors for copper oxide. As-deposited copper oxide films prepared at 180°C resulted in a growth per cycle of 1.0 A/cycle with low film resistivity.

Dwivedi, Vivek H.

Inert-Gas Electrical Discharge Machining

Holes in complicated hardware successfully drilled by dry EDM process that uses tubular copper electrode and argon or helium gas as dielectric medium.

Ramani, V.

A model for predicting high-temperature fatigue failure of a W/Cu composite

The material studied, a tungsten-fiber-reinforced, copper-matrix composite, is a candidate material for rocket nozzle liner applications. It was shown that at high temperatures, fatigue cracks initiate and propagate inside the copper matrix through a process of initiation, growth, and coalescence of grain boundary cavities. The ductile tungsten fibers neck and rupture locally after the surrounding matrix fails, and complete failure of the composite then ensues. A simple fatigue life prediction model is presented for the tungsten/copper composite system.

Verrilli, M. J.

Brazing Dissimilar Metals

Brazing effective technique for joining ordinary structural metals to brittle, low-thermal-expansion refractory metals. Specifically, brazing process established for joining copper or nickel flanges to ends of vacuum-plasma-sprayed tungsten tubes and for joining stainless-steel flanges to ends of tubes made of alloy of molybdenum with 40 percent of rhenium.

Krotz, Phillip D.

Water Purification

The Vision Catalyst Purifier employs the basic technology developed by NASA to purify water aboard the Apollo spacecraft. However, it also uses an "erosion" technique. The purifier kills bacteria, viruses, and algae by "catalytic corrosion." A cartridge contains a silver-impregnated alumina bed with a large surface area. The catalyst bed converts oxygen in a pool of water to its most oxidative state, killing over 99 percent of the bacteria within five seconds. The cartridge also releases into the pool low levels of ionic silver and copper through a controlled process of erosion. Because the water becomes electrochemically active, no electricity is required.

Source record

Atomic-scale Modeling of the Structure and Dynamics of Dislocations in Complex Alloys at High Temperatures

We report on the progress made during the first year of the project. Most of the progress at this point has been on the theoretical and computational side. Here are the highlights: (1) A new code, tailored for high-end desktop computing, now combines modern Accelerated Dynamics (AD) with the well-tested Embedded Atom Method (EAM); (2) The new Accelerated Dynamics allows the study of relatively slow, thermally-activated processes, such as diffusion, which are much too slow for traditional Molecular Dynamics; (3) We have benchmarked the new AD code on a rather simple and well-known process: vacancy diffusion in copper; and (4) We have begun application of the AD code to the diffusion of vacancies in ordered intermetallics.

Daw, Murray S.

Material Characterization of Additively Manufactured Components for Rocket Propulsion

To advance Additive Manufacturing (AM) technologies for production of rocket propulsion components the NASA Glenn Research Center (GRC) is applying state of the art characterization techniques to interrogate microstructure and mechanical properties of AM materials and components at various steps in their processing. The materials being investigated for upper stage rocket engines include titanium, copper, and nickel alloys. Additive manufacturing processes include laser powder bed, electron beam powder bed, and electron beam wire fed processes. Various post build thermal treatments, including Hot Isostatic Pressure (HIP), have been studied to understand their influence on microstructure, mechanical properties, and build density. Micro-computed tomography, electron microscopy, and mechanical testing in relevant temperature environments has been performed to develop relationships between build quality, microstructure, and mechanical performance at temperature. A summary of GRCs Additive Manufacturing roles and experimental findings will be presented.

Additive Manufacturing

Materials Characterization of Additively Manufactured Components for Rocket Propulsion

To advance Additive Manufacturing (AM) technologies for production of rocket propulsion components the NASA Glenn Research Center (GRC) is applying state of the art characterization techniques to interrogate microstructure and mechanical properties of AM materials and components at various steps in their processing. The materials being investigated for upper stage rocket engines include titanium, copper, and nickel alloys. Additive manufacturing processes include laser powder bed, electron beam powder bed, and electron beam wire fed processes. Various post build thermal treatments, including Hot Isostatic Pressure (HIP), have been studied to understand their influence on microstructure, mechanical properties, and build density. Micro-computed tomography, electron microscopy, and mechanical testing in relevant temperature environments has been performed to develop relationships between build quality, microstructure, and mechanical performance at temperature. A summary of GRC's Additive Manufacturing roles and experimental findings will be presented.

Additive Manufacturing

Process parameter translation strategies for variable directed energy deposition spot size using 316L, copper, and Inconel 625

Directed energy deposition (DED) is a form of additive manufacturing available across a variety of laser spot diameter values, often referred to as spot sizes. However, there is no method to easily transfer process parameters across discrete spot sizes, leading to DED process parameters that are equipment specific and not widely applicable. In this study, a strategy is proposed and investigated for five spot sizes that keep the areal energy density constant while varying power, feed rate, and powder flow during the deposition of 316L stainless steel. An assessment of trends in hardness and microstructure is possible due to the novel production of components of a single material across several spot sizes using a single nozzle on a single DED system. The proposed strategy was used to nullify the hardness drop during functional grading of Inconel 625 and pure copper, enabling fabrication of multi-material sample that does not compromise desirable properties. This application shows the value in establishing more efficient process parameter development and understanding spot size influences on geometric and material property flexibility, to enable a more diverse powder-based DED design space and to increase the industry adoption of DED systems.

316L

Electroplating on titanium alloy

Activation process forms adherent electrodeposits of copper, nickel, and chromium on titanium alloy. Good adhesion of electroplated deposits is obtained by using acetic-hydrofluoric acid anodic activation process.

Lowery, J. R.

An Effective Secondary Electron Emission Suppression Treatment For Copper MDC

Untreated oxygen-free, high-conductivity (OFHC) copper, commonly used for MDC electrodes, exhibits relatively high secondary electron emission characteristics. This paper describes a specialized ion-bombardment procedure for texturing copper surfaces which sharply reduces the emission properties relative to untreated copper. The resulting surface is a particle-free, robust, uniformly highly-textured all-metal structure. The use of this process requires no modifications to copper machining, brazing, or other MDC normal fabrication procedures. The flight TWT for a planned NASA deep space probe, the Cassini Mission, will incorporate copper MDC electrodes treated with the method described here.

Curren, Arthur N.

Detection of alteration associated with a porphyry copper deposit in southern Arizona

Computer processing of Landsat MSS data was performed using contrast stretching and band-to-band ratioing. A false color ratio composite picture showed color anomalies which coincided with known areas of alteration on and about Red Mountain. A helicopter survey of the study area was undertaken using a portable field reflectance spectrometer. One hundred fifty-six spectra were obtained in the 0.4 to 2.5 micrometer wavelength region. The spectra were digitized, and contour maps for 24 wavelength intervals were produced; no spectral anomalies were evident for the known altered areas. A contour map produced from the 1.6 and 2.2 micrometer ratio generally delineated the alteration areas. The 1.3, 1.6, and 2.2 micrometer wavelength data were canonically transformed using a transformation empirically derived from discriminant function analysis of altered and unaltered materials for the Goldfield, Nevada region, and a contour map was produced for the first canonical variable. The known areas of alteration were clearly defined on the contour map.

Abrams, M. J.

Design, Development and Hotfire Testing of Monolithic Copper and Bimetallic Additively Manufactured Combustion Chambers

NASA and industry partners are working towards fabrication process development to reduce costs and schedules associated with manufacturing liquid rocket engine components with the goal of reducing overall mission costs. One such technique being evaluated is powder-bed fusion or selective laser melting (SLM) otherwise commonly referred to as additive manufacturing. The NASA Low Cost Upper Stage Propulsion (LCUSP) program was designed to develop processes and material characterization for the GRCop-84 copper-alloy commensurate with powder bed additive manufacturing, evaluate bimetallic deposition and complete testing of a full scale combustion chamber. As part of this development, the process has been transferred to industry partners to enable a long-term supply chain of monolithic copper combustion chambers. As a direct spin off of this program, NASA is working with industry partners to further develop the printing process for the GRCop-84 material in addition to the C-18150 (CuCrZr) material. To advance the process further and allow for optimization with multiple materials, NASA is also investigating the feasibility of bimetallic additively manufactured chambers. A 1.2k sized thrust-chamber was designed and developed to compare the printing process of the GRCop-84 and C-18150 SLM materials. A series of similar MCC liners also completed development with an Inconel 625 jacket bonded to the GRcop-84 liner evaluating direct metal deposition (DMD) laser and arc-based techniques. This paper describes the design, development, manufacturing and testing of these combustion chambers and associated lessons learned throughout the design and development process.

Gradl, Paul

Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.

Savich, Gregory R.