Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding
Abstract Not Provided
Yarema, R.↗
SEARCH · Engineering Papers
Results for “3D INTEGRATION”
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Integration and Packaging
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.
72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
Technologies 2
Advanced Packaging in Leti. Topics include wafter level packaging, key processes & technologies, applications examples, 3D integration, key processes & technologies, and applications examples.
36 MATERIALS SCIENCE↗
3D IC for Future HEP Detectors
Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. Here we describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This also includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.
24 POWER TRANSMISSION AND DISTRIBUTION↗
ALD-Derived WO 3– x Leads to Nearly Wake-Up-Free Ferroelectric Hf 0.5 Zr 0.5 O 2 at Elevated Temperatures
Breaking the memory wall in advanced computing architectures will require complex 3D integration of emerging memory materials such as ferroelectrics─either within the back-end-of-line (BEOL) of CMOS front-end processes or through advanced 3D packaging technologies. Achieving this integration demands that memory materials exhibit high thermal resilience, with the capability to operate reliably at elevated temperatures, such as 125°C, due to the substantial heat generated by front-end transistors. However, silicon-compatible HfO 2 -based ferroelectrics tend to exhibit antiferroelectric-like behavior in this temperature range, accompanied by a more pronounced wake-up effect, posing significant challenges to their thermal reliability. Here, we report that by introducing a thin tungsten oxide (WO 3–x ) layer─known as an oxygen reservoir─and carefully tuning its oxygen content, ultrathin Hf 0.5 Zr 0.5 O 2 (5 nm) films can be made robust against the ferroelectric-to-antiferroelectric transition at elevated temperatures. This approach not only minimizes polarization loss in the pristine state but also effectively suppresses the wake-up effect, reducing the required wake-up cycles from 10 5 to only 10 at 125°C, a qualifying temperature for back-end memory integrated with front-end logic, as defined by the JEDEC standard. First-principles density functional theory (DFT) calculations reveal that WO 3 enhances the stability of the ferroelectric orthorhombic phase (o-phase) at elevated temperatures by increasing the tetragonal-to-orthorhombic phase energy gap and promoting favorable phonon mode evolution, thereby supporting o-phase formation under both thermodynamic and kinetic constraints.
36 MATERIALS SCIENCE↗
Fast timing with induced current detectors
Vertically integrated (3D) combinations of sensors and electronics offer the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. We describe the capabilities of such a system and the limitations imposed by geometry and power. Furthermore, we illustrate how a similar geometry can be used to provide very fast timing of x-ray arrival in a thick sensor by utilizing the transient induced current in a field of pixels.
3D integration↗
BASIN-3D: A brokering framework to integrate diverse environmental data
Diverse observational and simulation datasets are needed to understand and predict complex ecosystem behavior over seasonal to decadal and century time-scales. Integration of these datasets poses a major barrier towards advancing environmental science, particularly due to differences in the structure and formats of data provided by various sources. Here, we describe BASIN-3D (Broker for Assimilation, Synthesis and Integration of eNvironmental Diverse, Distributed Datasets), a data integration framework designed to dynamically retrieve and transform heterogeneous data from different sources into a common format to provide an integrated view. BASIN-3D enables users to adopt a standardized approach for data retrieval and avoid customizations for the data type or source. We demonstrate the value of BASIN-3D with two use cases that require integration of data from regional to watershed spatial scales. The first application uses the BASIN-3D Python library to integrate time-series hydrological and meteorological data to provide standardized inputs to analytical and machine learning codes in order to predict the impacts of hydrological disturbances on large river corridors of the United States. The second application uses the BASIN-3D Django framework to integrate diverse time-series data in a mountainous watershed in East River, Colorado, United States to enable scientific researchers to explore and download data through an interactive web portal. Thus, BASIN-3D can be used to support data integration for both web-based tools, as well as data analytics using Python scripting and extensions like Jupyter notebooks. The framework is expected to be transferable to and useful for many other field and modeling studies.
Varadharajan, C↗
Improved Scanning Geometry to Collect 3D-Geometry Data in Flat Samples
3D integration through silicon technology of integrated circuits challenges non-destructive testing methods. 3D x-ray methods are the techniques of choice to localize defects in interconnects. The development of high-power x-ray sources enabled the use of x-ray microscopy in laboratory tools. Those devices are able to resolve features down to 40 nm in an acceptable measurement time. However, the field of view is very limited to 16 {mu}m in high-resolution mode and to 65 {mu}m in large-field-of-view mode. To record tomography data, the size of the samples must not exceed the field of view to circumvent specific artifacts. Semiconductor samples usually do not fulfill the condition mentioned above since they have the shape of flat sheets. Therefore limited-angle tomography is typically used. The missing angles cause typical capping artifacts and poor signal-to-noise ratio. We present a modified scanning geometry that overcomes some of the artifacts and yields a better image quality. The geometry and potential applications are presented in comparison to the traditional limited-angle tomography.
07 ISOTOPE AND RADIATION SOURCES↗
High Density Memory Based on Quantum Device Technology
We explore the feasibility of ultra-high density memory based on quantum devices. Starting from overall constraints on chip area, power consumption, access speed, and noise margin, we deduce boundaries on single cell parameters such as required operating voltage and standby current. Next, the possible role of quantum devices is examined. Since the most mature quantum device, the resonant tunneling diode (RTD) can easily be integrated vertically, it naturally leads to the issue of 3D integrated memory. We propose a novel method of addressing vertically integrated bistable two-terminal devices, such as resonant tunneling diodes (RTD) and Esaki diodes, that avoids individual physical contacts. The new concept has been demonstrated experimentally in memory cells of field effect transistors (FET's) and stacked RTD's.
vanderWagt, Paul↗
From 2D to 4D: a containerized workflow and browser to explore dynamic chromatin architecture
Background Characterizing the physical organization of the genome is essential for understanding long-range gene regulation, chromatin compartmentalization, and epigenetic accessibility. Hi-C experiments generate two-dimensional (2D) genome-wide contact maps of chromatin interactions by capturing the spatial proximity between genomic loci, which reveal interaction frequencies but lack the spatial resolution needed to interpret the three-dimensional (3D) genome structure(s). Emerging evidence suggests that epigenetic regulation is closely linked to 3D genome architecture, and that structural changes over time (4D) drive key biological processes in development, disease, and environmental response. Thus, integrating 3D structure with functional data is critical for a more complete understanding of genome regulation. Previous work, most notably the 4DHiC chromosome modeling framework, has shown that physical multi-dimensional modeling approaches rooted in polymer physics and molecular dynamics can resolve these structures at biologically meaningful resolutions by integrating temporal Hi-C data with physical constraints to uncover dynamic chromosome reorganization. Thus, molecular dynamics simulations, constrained by Hi-C contact matrices, can resolve fine-scale structural changes and reveal functionally significant transitions in chromatin conformation. Results Herein, we present the 4D Genome Browser Workflow (4DGBWorkflow) and the 4D Genome Browser (4DGB). The algorithm is based on the 4DHiC method, and the containerized tool is an end-to-end workflow that can transform, filter, and view 4D epigenomics and chromatin datasets, allowing non-specialists to apply three-dimensional modeling principles to diverse datasets and experimental conditions. The software executes on a laptop running macOS, Linux or Windows. From input Hi-C files (.hic), the 4DGBWorkflow produces 3D reconstructions of chromosomes, integrates the reconstruction with track data (e.g., epigenetic marks, transcriptome profiles), and provides comparative visualization of the results in a single workflow. Conclusions The 4DGBWorkflow and 4D Genome Browser are open-source tools for comparative analysis and visualization of 4D chromosome datasets, including chromatin architecture and epigenomic signals. Automatic integration of Hi-C data with molecular dynamics democratizes the construction of time resolved 3D genome structures, simplifying complex simulations and data integration schemes.
3D Genome Browser↗
Effective field theory and integrability in two-dimensional Mott transition
Highlights: > Mott transition in 2d lattice fermion model. > 3D integrability out of 2D. > Effective field theory for Mott transition in 2d. > Double Chern-Simons. > d-Density waves. - Abstract: We study the Mott transition in a two-dimensional lattice spinless fermion model with nearest neighbors density-density interactions. By means of a two-dimensional Jordan-Wigner transformation, the model is mapped onto the lattice XXZ spin model, which is shown to possess a quantum group symmetry as a consequence of a recently found solution of the Zamolodchikov tetrahedron equation. A projection (from three to two space-time dimensions) property of the solution is used to identify the symmetry of the model at the Mott critical point as U{sub q}(sl(2)-circumflex)xU{sub q}(sl(2)-circumflex), with deformation parameter q = -1. Based on this result, the low-energy effective field theory for the model is obtained and shown to be a lattice double Chern-Simons theory with coupling constant k = 1 (with the standard normalization). By further employing the effective filed theory methods, we show that the Mott transition that arises is of topological nature, with vortices in an antiferromagnetic array and matter currents characterized by a d-density wave order parameter. We also analyze the behavior of the system upon weak coupling, and conclude that it undergoes a quantum gas-liquid transition which belongs to the Ising universality class.
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
Rational fabrication of carbon nanotubes arrays on porous nickel matrix as advanced electrode materials of supercapacitors
Highlights: • Construct self-supported porous Ni/CNTs composite arrays. • Porous Ni/CNTs arrays show superior capacitive performance. • Ni/CNTs arrays structure boosts fast electron/ion transfer. - Abstract: Rational synthesis of advanced carbon materials is of great importance to the development of supercapacitors. In this work, we propose a facile combined electrodeposition-chemical vapor deposition for tailored construction of carbon nanotubes (CNTs) arrays on highly porous Ni matrix forming integrated 3D Ni/CNTs electrode. Interconnected CNTs with diameters of 20–30 nm are strongly anchored on the cross-linked porous Ni branches consisting of nanoparticles of 500–600 nm. Capacitive performance of the obtained porous Ni/CNTs electrode is thoroughly characterized by electrochemical means including charge/discharge tests and cyclic voltammetry. The 3D Ni/CNTs electrode shows good high-rate performance with a capacitance of 186 F g{sup −1} at 2.5 A g{sup −1}, and excellent cycling stability with a capacitance retention of 99% after 10,000 cycles. The integrated conductive network composed of 3D Ni/CNTs offers large active area, good electronic conductivity and fast transportation paths of ions/electrons, leading to superior capacitive performance.
77 NANOSCIENCE AND NANOTECHNOLOGY↗
NASA’s In-Space Manufacturing Project: Update on Manufacturing Technologies and Materials to Enable More Sustainable and Safer Exploration
NASA’s In-Space Manufacturing (ISM) project seeks to develop the materials, processes, and manufacturing technologies needed to provide an on-demand manufacturing capability for deep space exploration missions. The ability to manufacture and recycle some parts on demand rather than launch them from earth has the potential to reduce logistics requirements on long duration missions and enhance crew safety. With the launch of the first 3D printer (built and operated by Made in Space through a Small Business Innovative Research – SBIR -- contract) to the International Space Station (ISS) in 2014, the ISM project demonstrated the feasibility of operating an on-demand manufacturing system in a microgravity environment. This paper will provide an update on recent advancements in ISM under three key technology areas: manufacturing, recycling, and development of a design database. ISM continues to pursue development of manufacturing technologies for space applications and use the ISS as a critical test bed to prove out these technologies before deploying them on next generation exploration systems. Activities under this focus area include: characterization of materials manufactured using the Additive Manufacturing Facility (AMF), the second generation commercial 3D-printer on ISS, also owned and operated by Made in Space; development of prototype payloads for metal manufacturing through phase II SBIR contracts with Tethers Unlimited, Made in Space, and Ultra Tech Machinery; development of a multi-material fabrication laboratory capable of processing metals and providing inspection of manufactured parts through a Broad Agency Announcement (Techshot, Interlog, and Tethers Unlimited); an in-line sensing system for ISM platforms; and development of higher strength feedstocks for 3D polymer printers. In the area of recycling, the Tethers Unlimited Refabricator payload (an integrated 3D printer and recycler for ULTEM 9085) launched to ISS in November 2018 and began operating in early 2019. This payload represents the first demonstration of on-orbit recycling; down massed specimens will assess material degradation in the polymer over multiple recycling cycles to define limits on material re-use. Other work in the recycling area includes development of common use materials intended to be reused and recycled on space missions (Tethers Unlimited and Cornerstone Research Group) and a sterilization capability for multiple-use materials (ERASMUS from Tethers Unlimited). Concurrent with manufacturing technology and materials development work is creation of a design database, a curated list of parts that can be manufactured using the suite of In-Space Manufacturing capabilities.
Tracie Prater↗
Research Update: Electrical monitoring of cysts using organic electrochemical transistors
Organotypic three-dimensional (3D) cell culture models have the potential to act as surrogate tissues in vitro, both for basic research and for drug discovery/toxicology. 3D cultures maintain not only 3D architecture but also cell-cell and cell extracellular matrix interactions, particularly when grown in cysts or spheroids. Characterization of cell cultures grown in 3D formats, however, provides a significant challenge for cell biologists due to the incompatibility of these structures with commonly found optical or electronic monitoring systems. Electronic impedance spectroscopy is a cell culture monitoring technique with great potential; however, it has not been possible to integrate 3D cultures with commercially available systems to date. Cyst-like 3D cultures are particularly challenging due to their small size and difficulty in manipulation. Herein, we demonstrate isolation of cyst-like 3D cultures by capillarity and subsequent integration with the organic electrochemical transistor for monitoring the integrity of these structures. We show not only that this versatile device can be adapted to the cyst format for measuring resistance and, therefore, the quality of the cysts, but also can be used for quantitative monitoring of the effect of toxic compounds on cells in a 3D format. The ability to quantitatively predict effects of drugs on 3D cultures in vitro has large future potential for the fields of drug discovery and toxicology.
60 APPLIED LIFE SCIENCES↗
Vertically Integrated Edgeless Photon Imaging Camera
The Vertically Integrated Photon Imaging Chip - Large, (VIPIC-L), is a large area, small pixel (65μm), 3D integrated, photon counting ASIC with zero-suppressed or full frame dead-time-less data readout. It features data throughput of 14.4 Gbps per chip with a full frame readout speed of 56kframes/s in the imaging mode. VIPIC-L contain 192 x 192 pixel array and the total size of the chip is 1.248cm x 1.248cm with only a 5μm periphery. It contains about 120M transistors. A 1.3M pixel camera module will be developed by arranging a 6 x 6 array of 3D VIPIC-L’s bonded to a large area silicon sensor on the analog side and to a readout board on the digital side. The readout board hosts a bank of FPGA’s, one per VIPIC-L to allow processing of up to 0.7 Tbps of raw data produced by the camera.
Fahim, Farah↗
Three-Dimensional Geologic Characterization of Geothermal Systems: Astor Pass, Nevada, USA
Geothermal systems in the Great Basin, USA, are controlled by a variety of fault intersection and fault interaction areas. Understanding the specific geometry of the structures most conducive to geothermal circulation is crucial in order to both mitigate the costs of geothermal exploration (especially drilling) and to identify blind geothermal systems (no surface expression). Astor Pass, Nevada, one such blind geothermal system, lies near the boundary between two distinct structural domains, the Walker Lane and the Basin and Range, and exhibits characteristics of each setting. Both northwest-striking, left-stepping dextral faults of the Walker Lane and kinematically linked northerly striking normal faults associated with the Basin and Range are present at Astor Pass. Previous studies identified a blind geothermal system controlled by the intersection of northwest-striking dextral and north-northwest-striking normal faults. Wells drilled into the southwestern quadrant of the fault intersection yielded 94°C fluids, with geothermometers suggesting significantly higher maximum temperatures. Additional data, including reprocessed 2D seismic data and petrologic analysis of well cuttings, were integrated with existing and reinterpreted geologic maps and cross-sections to aid construction of a 3D geologic model. This comprehensive 3D integration of multiple data sets allows characterization of the structural setting of the Astor Pass blind geothermal system at a level of detail beyond what independent data interpretation can provide. Our analysis indicates that the blind geothermal system is controlled by two north- to northwest-plunging fault intersections.
15 GEOTHERMAL ENERGY↗
Validation of the integration of CFD and SAS4A/SASSYS-1: Analysis of EBR-II shutdown heat removal test 17
Recent analyses have demonstrated the need to model multidimensional phenomena, particularly thermal stratification in outlet plena, during safety analyses of loss-of-flow transients of certain liquid-metal cooled reactor designs. Therefore, Argonne's reactor systems safety code SAS4A/SASSYS-1 is being enhanced by integrating 3D computational fluid dynamics models of the plena. A validation exercise of the new tool is being performed by analyzing the protected loss-of-flow event demonstrated by the EBR-II Shutdown Heat Removal Test 17. In this analysis, the behavior of the coolant in the cold pool is modeled using the CFD code STAR-CCM+, while the remainder of the cooling system and the reactor core are modeled with SAS4A/SASSYS-1. This paper summarizes the code integration strategy and provides the predicted 3D temperature and velocity distributions inside the cold pool during SHRT-17. The results of the coupled analysis should be considered preliminary at this stage, as the exercise pointed to the need to improve the CFD model of the cold pool tank. (authors)
21 SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS↗
Wind blade joints based on non-crimp 3D orthogonal woven Pi shaped preforms
Current industrial designs for joining composite windblade elements allow unstable crack propagation in the thick adhesive layer within the joint. In this work, a novel integral 3D woven Pi-joint element is developed and implemented in an I-beam joint construction that corresponds to a windblade shear web and spar cap. In a series of iterative design-analysis-fabrication-testing cycles, 2.9 m long I-beams that used the current practice joint and the novel proposed joint were designed, studied theoretically with the use of a 3D Mosaic analysis tool, then manufactured and loaded to failure in a cantilever flexure loading set up. Experimental data showed significant advantage in the load-bearing capacity of the joint structure with the use of novel Pi-joint element. Excellent agreement was observed between the theoretical predictions and experimental data.
17 WIND ENERGY↗