Sensitivity study on the fin effect of thermocouple mounted on the heated surface under film boiling condition
In the reactivity-initiated accident (RIA) scenario, right after the power burst with the occurrence of departure from nucleate boiling (DNB), the cladding temperature quickly reaches its maximum and is maintained in a steady film boiling regime. Then, under limited heat transfer performance of film boiling, the local cooling effect by the thermocouple wire may not be neglected. A computational model is developed to estimate the local cooling effect of the thermocouple wire mounted on the cladding surface under film boiling condition. The model predicts the temperature profile along the cladding surface as physically expected and is verified against the benchmark problem. Sensitivity studies reveal the significant effects of the thickness of vapor film layer and the diameter of thermocouple on the temperature drop near the thermocouple, for they increase the heat transfer area to the liquid water region. The impact of film boiling heat transfer coefficient, however, is not significant, as the primary heat transfer mechanism near the thermocouple is the heat conduction to the wire. Future study will include the contribution of radiative heat transfer between the cladding surface and the vapor film layer, as well as a transient power history which represents an actual RIA scenario.