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At least 703 records · Page 39

The Effect of Thin Film Adhesives on Mode I Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts

Shape Memory Alloy (SMA) was placed within Polymer Matrix Composite (PMC) panels alongside film adhesives to examine bonding. Double cantilever beam (DCB) testing was performed using ASTM D5528. C-scanning was performed before testing, modal acoustic emissions (MAE) were monitored during testing, and microscopy performed post-test. Data was analyzed using modified beam theory (MBT), compliance calibration (CC) and modified compliance calibration (MCC) methods. Fracture toughness for control specimens was higher than previously reported due to fiber-bridging. Specimens with SMAs and adhesives stabilized crack propagation. Results revealed SMA-bridging; a phenomenon mimicking fiber-bridging which increased the load and fracture toughness of SMA specimens.

Derek J Quade↗

Fracture Prediction of Epoxy Resin using Morse Bond Potential Embedded in GAFF using Molecular Dynamics Simulations

A generic method is developed to investigate the fracture behavior of an epoxy resin using atomistic molecular (MD) dynamics simulations. The epoxy system consisted of the stoichiometric mixture of tetra-/tri-functional epoxies and di-functional hardener molecules and was cured with a step-growth crosslinking algorithm. A hybrid force field (hFF) in which Morse bond function were added in second generation-general Amber Force Field (GAFF2) was used to capture bond breaking of the crosslinked epoxy system under uniaxial deformation. The Morse bond parameters for covalent bonds in the crosslinked backbone were fit to dissociation curves computed by CASPT2/6-311+G**. After the systems in various crosslink densities were obtained and equilibrated, the full length of stress-strain (𝜎-𝜀) curve was produced including initial elastic regime, yielding, plastic flow, strain hardening, and progressive failure. We found that the hFF was effective in studying the dissociation of crosslinked polymers and understanding the failure mechanism. In the results, the hFF delivered the same elastic property obtained from the unmodified force field GAFF. The stress-strain curve, however, began to be distinct in the plastic regime due to broken covalent bonds capable of altering the tensile behavior. Once the stress reached maximum, it progressively decreased until the ultimate failure (𝜎=0). Since hFF employed the existing GAFF functions with including a minimal change of its bond potential, this approach is easier to perform and computationally more efficient for unveiling the fracture behavior of polymer materials at the molecular level than other approaches with reactive force fields. We expect this approach will be utilized to accelerate the material-by-design process for thermosets by incorporate data from molecular models.

Changwoon Jang↗

Mapping Process Model Results to Fracture Model Initial Conditions for Adhesive Bonding

A systematic approach is proposed for mapping adhesive bonding process outcomes to initial conditions for progressive damage analysis (PDA). Herein, two mapping procedures are developed: 1) direct mapping for residual stresses, strains, and deformations obtained from a process model; and 2) functional mapping for quantities such as bondline thickness, degree of cure, and porosity that are assumed to have a functional relationship with fracture toughness but are not discretely modeled in the PDA. The spatial distribution of functionally mapped quantities may be determined by process modeling or inspection. The functional maps between the quantity of interest and fracture toughness may be obtained from independent lower-scale numerical simulations or empirical test campaigns. The proposed mapping procedure links the adhesive bonding process to the structural performance. Therefore, by accounting for the effects of bondline nonuniformities in structural analysis, analytical predictive accuracy can be improved, and off-nominal conditions can be evaluated. The mapping procedures are demonstrated and verified with example problems.

Andrew C Bergan↗

Mapping Process Model Results to Fracture Model Initial Conditions for Adhesive Bonding

A systematic approach is proposed for mapping adhesive bonding process outcomes to initial conditions for progressive damage analysis (PDA). Herein, two mapping procedures are developed: 1) direct mapping for residual stresses, strains, and deformations obtained from a process model; and 2) functional mapping for quantities such as bondline thickness, degree of cure, and porosity that are assumed to have a functional relationship with fracture toughness but are not discretely modeled in the PDA. The spatial distribution of functionally mapped quantities may be determined by process modeling or inspection. The functional maps between the quantity of interest and fracture toughness may be obtained from independent lower-scale numerical simulations or empirical test campaigns. The proposed mapping procedure links the adhesive bonding process to the structural performance. Therefore, by accounting for the effects of bondline nonuniformities in structural analysis, analytical predictive accuracy can be improved, and off-nominal conditions can be evaluated. The mapping procedures are demonstrated and verified with example problems.

Andrew Bergan↗