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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 703 records · Page 39

Electron Cyclotron power management for control of Neoclassical Tearing Modes in the ITER baseline scenario

Time-dependent simulations are used to evolve plasma discharges in combination with a Modified Rutherford equation (MRE) for calculation of Neoclassical Tearing Mode (NTM) stability in response to Electron Cyclotron (EC) feedback control in ITER. The main application of this integrated approach is to support the development of control algorithms by analyzing the plasma response with physics-based models and to assess how uncertainties in the detection of the magnetic island and in the EC alignment affect the ability of the ITER EC system to fulfill its purpose. These simulations indicate that it is critical to detect the island as soon as possible, before its size exceeds the EC deposition width, and that maintaining alignment with the rational surface within half of the EC deposition width is needed for stabilization and suppression of the modes, especially in the case of modes with helicity (2,1). A broadening of the deposition profile, for example due to wave scattering by turbulence fluctuations or not well aligned beams, could even be favorable in the case of the (2,1)-NTM, by relaxing an over-focussing of the EC beam and improving the stabilization at the mode onset. Pre-emptive control reduces the power needed for suppression and stabilization in the ITER baseline discharge to a maximum of 5 MW, which should be reserved and available to the Upper Launcher during the entire flattop phase. By assuming continuous triggering of NTMs, with pre-emptive control ITER would be still able to demonstrate a fusion gain of Q=10.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Testing and Expertise for Marine Energy (TEAMER) Program Support (CRADA Final Report)

Virginia Tech (VT) had previously developed a 50 kW AC to DC power converter that is specifically designed to improve the performance and efficiency of wave energy converters (WECs). Through this CRADA, NLR will test the VT power converter via a coupled dynamometer and power electronics test platform. The NLR test platform will be comprised of (1) a rotary dynamometer that will drive a VT provided gearbox and generator, (2) one or more DC regenerative power supplies that provide input power to and take power from the VT supplied power electronics, and (3) a data acquisition system for measurement. NLR will work with VT to develop a test plan, set up the test platform and integrate the test article, perform the testing, and assist in the data analysis.

16 TIDAL AND WAVE POWER↗

Control and Analysis for a Self-Excited Induction Generator for Wind Turbine and Electrolyzer Applications

Self-Excited Induction Generation(SEIG) is very rugged, simple, lightweight, and it is easy and inexpensive to implement, very simple to control, and requires a very little maintenance. In this variable-speed operation, the SEIG needs a power electronics interface to convert from the variable frequency output voltage of the generator to a DC output voltage for battery or other DC applications. In our study, a SEIG is connected to the power electronics interface such as diode rectifier and DC/DC converter and then an electrolyzer is connected as a final DC load for fuel cell applications. An equivalent circuit model for an electrolyzer is utilized for our application. The control and analysis for the proposed system is carried out by using PSCAD and MATLAB software. This study would be useful for designing and control analysis of power interface circuits for SEIG for a variable speed wind turbine generation with fuel cell applications before the actual implementation.

17 WIND ENERGY↗

Synchronverter-based Control of Multi-Port Autonomous Reconfigurable Solar Plants (MARS)

Control of integrated photovoltaic (PV) plants with energy storage systems (ESSs) has become an important research and development topic in recent times. In this context, a Multi-port Autonomous Reconfigurable Solar (MARS) plant that integrates PV and ESS to alternating current transmission grid and high-voltage direct current (HVdc) link is studied in this paper. With penetration of power electronic based resources in the grid, the grid’s capability to recover from frequency or voltage disturbances are reduced. Therefore, one of the vital objectives of any new grid integrated power electronic resource is to provide advanced control functions like voltage and frequency support to the grid during disturbances. In this research work, a detailed implementation of a synchronverter-based control algorithm of MARS is presented. The proposed control algorithm and the MARS control architecture are evaluated through simulations on PSCAD/EMTDC simulation platform to showcase the performance in different operating conditions. In addition, they are evaluated in Opal-RT offline simulation models which can also be used to perform control-hardware-in-the-loop (cHIL) tests.

Marthi, Phani Ratna Vanamali↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

Design and Test of a Structurally-Integrated Heat Sink for the Maxwell X-57 High Lift Motor Controller

An innovative thermal management solution was conceptualized, built and tested for the X57 Maxwell electric airplane. A combination of commercial CFD codes and bespoke thermal modeling tools were employed to rapidly develop a structurally-integral power electronics heat sink. A structurally-integrated heat sink was devised for the GIMC-SCEPTOR high lift motor controller. The nacelle-conforming sink is designed to dissipate heat from the power electronics assembly while simultaneously acting as the mechanical load path between the wing structure and high lift motor.

Edwards, Ryan↗

Effective Selective Area Doping for GaN Vertical Power Transistors Enabled by Innovative Materials Engineering

GaN vertical power transistors have emerged as promising candidates for future high efficiency high power electronic applications, with the potential to outperform conventional GaN lateral power devices in terms of power, breakdown, and avalanche characteristics. However, the development of current GaN vertical power transistors is seriously hindered by the poor materials performance of selective area doped p-n junctions. A mechanistic understanding of these fundamental materials issues is essential in order to achieve high performance selective area doped p-n junctions and consequently to advance the GaN vertical power transistor technology. To address this challenge, we carried out a comprehensive research program that advance fundamental knowledge in the selective area doping for GaN materials, and which will lead to the development of high performance GaN vertical power transistors. First, we developed innovative fabrication processes, including novel surface etching, surface passivation, and metalorganic chemical vapor deposition (MOCVD) growth, which provided enhanced opportunities for solving the unique challenges of selective area doping in GaN materials. Second, we performed a fundamental materials study using powerful characterization methods including transmission electron microscopy (TEM), ultraviolet (UV-), x-ray and angle-resolved photoelectron spectroscopy (UPS/XPS/ARPES), electron holography, and cathodoluminescence (CL); Third, we investigated several related issues, including Mg incorporation, polarization effects in carrier transport, and non-ideal material effects, which have rarely been explored so far. At the end of this project, we successfully demonstrated (1) fundamental understanding of selective area etching, regrowth, and doping of GaN, and associated knowledge on defects, interface, and breakdown properties. (2) Effective etch and regrowth processing recipes to achieve etch/regrowth GaN p-n diodes with very low leakage of 3.5 nA at 600 V, which meets the ARPA-E target. (2) High performance vertical GaN p-n didoes and vertical junction termination extension (JTE) devices with breakdown voltage of ~ 2 kV, and breakdown electric field of ~ 3.5 MV/cm, which are close to the performance limit of GaN. The successful outcome has resulted in new fundamental understandings in the selective area doping and regrowth process for GaN, which will lead to groundbreaking GaN vertical transistors for high performance next generation power electronics.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Cost analysis of distributed storage in AC and DC microgrids

Building and microgrid designs with highly-distributed electrical storage have potential advantages over today's conventional topologies with centralized storage. Herein this paper studies the capital cost benefits of several residential behind-the-meter distributed-storage topologies, including AC and DC versions of systems with load-packaged batteries and resilient sub-networks. The study begins by defining the block configuration of each topology. This work then develops a model for the cost of the power electronics necessary to interface with the storage elements. Finally, the analysis develops a model for the total cost of each storage topology, incorporating the installation and soft costs. The results suggest that while the cost of power electronics is lower in centralized topologies, the total cost is lower for distributed storage due to the avoided costs of installation and permitting. This paper also explores the benefits of load-packaged batteries for savings in electrical infrastructure.

25 ENERGY STORAGE↗

Harmonic Modeling, Data Generation and Analysis of Power Electronics-Interfaced Residential Loads

The share of electronics-based residential load is expected to rise as devices such as variable frequency drives (VFDs), electric vehicle chargers, and inverter-based distributed energy resources (DERs), e.g., photovoltaic (PV) systems become more common. These loads may introduce significant harmonics into power networks that need to be closely studied in order to perform accurate load modeling and forecasting. However, it can be difficult to obtain harmonic-rich voltage and current data - necessary for identifying accurate load models - for residential electrical loads. Recognizing this need, we identify and model a set of electronics-based end-use loads and DERs in an electromagnetic transients program (EMTP) tool for a residence with a single- phase split-phase supply. Further, a procedure is developed to model harmonic interactions between end-use loads connected to the same non-ideal supply voltage in a residential setting. Finally, a harmonic-rich dataset produced via the proposed procedure is utilized to identify frequency coupling matrix (FCM) based load model. Numerical results demonstrate the accuracy of the model, and explore model identifiability with limited data points.

harmonics, power quality, load modeling↗

A High-Average-Power Free Electron Laser for Microfabrication and Surface Applications

CEBAF has developed a comprehensive conceptual design of an industrial user facility based on a kilowatt ultraviolet (UV) (160-1000 mm) and infrared (IR) (2-25 micron) free electron laser (FEL) driven by a recirculating, energy recovering 200 MeV superconducting radio frequency (SRF) accelerator. FEL users, CEBAF's partners in the Lase Processing Consortium, including AT&T, DuPont, IBM, Northrop Grumman, 3M, and Xerox, are developing applications such as metal, ceramic, and electronic material micro-fabrication and polymer and metal surface processing, with the overall effort leading to later scale-up to industrial systems at 50-100 kW. Representative applications are described. The proposed high-average-power FEL overcomes limitations of conventional laser sources in available power, cost-effectiveness, tunability, and pulse structure.

Dylla, H. F.↗

Impacts of Experimentally Obtained Harmonic Spectrums of Residential Appliances on Distribution Feeder: Preprint

This paper focuses on the harmonic load flow study for a set of residential loads and the impacts of the harmonic contents on the distribution feeder. Owing to the increased use of the power electronic based appliances and energy efficient home equipment like the lighting loads, the percentage of non-linear loads has increased in the distribution system which can impact the system performance, loss, and stability. Thus a comprehensive knowledge of their power quality and harmonic analysis is essential to improve the load models, voltage stability assessment, determining possible interactions at harmonic frequencies, protection planning, and the effect of the system impedance. For this study, the household appliances include the lighting, power electronics, resistive, and motor loads with a nominal supply voltage of 120 V single-phase or 240 V split-phase at a nominal frequency of 60 Hz. The harmonic spectrum as obtained from the experimental data is used to solve the harmonic load flow for a detailed secondary network including the distribution transformer extracted from a real distribution feeder's model. Additionally, the impact of the voltage harmonic on a three phase test load is presented through experimental results. The harmonic data of the transformer terminal voltage as obtained from the former load flow study is scaled to generate the source voltage for the three phase configuration of the grid simulator to make the test setup very similar to a real scenario.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Control and Management of Multiple Converters in a Residential Smart Grid

Power electronic systems are becoming a staple building block for electric grid networks. However, these systems have been largely designed to grid integrate in ad hoc configurations with little or no coordination of control. This work proposes a central controller and power electronic system hardware and software design for a residential system (photovoltaic, energy storage and residential building). This system supports auto-integration, plug and play capabilities, and optimal energy management to meet different use cases. Modelling and multi-day testing of the system have been conducted in a controller hardware-in-the-loop (C-HIL) testbed. Multiple use cases and pricing options have been considered as part of the simulation and testing. Results are presented of these systems as a proof of principle.

Starke, Michael↗

Real-time Simulation Framework for Hardware-in-the-Loop Testing of Multi-port Autonomous Reconfigurable Solar Power Plant (MARS)

Multiport autonomous reconfigurable solar power plant (MARS) has been proposed for integrated development of photovoltaic (PV) and energy storage system (ESS) that can connect to high-voltage direct current (HVdc) and alternating current (ac) transmission grid. To de-risk the development of this complex integrated system that consists of hundreds to thousands of power electronics modules, a controller hardware-in-the-loop (cHIL) test setup will be extremely beneficial. The cHIL testing can be used for evaluation of modules as well as the hierarchical control system in MARS. With the unique configuration of power electronics modules in MARS, it becomes necessary to develop custom-designed real-time simulation models in the cHIL setup in absence of off-the-shelf models. In this paper, high-fidelity dynamic model of MARS, control algorithms at the lower level, and required communication algorithms are developed and optimized for real-time performance in the cHIL setup. Real-time experimental results from the cHIL are provided.

Dong, Zerui↗

Controller Verification of a Smart-Grid Compatible 200 kHz Single-stage Photovoltaic Microinverter

This paper presents control system design, implementation, and experimental validation of a single-stage 400 W, 200 kHz solar photovoltaic (PV) microinverter using hardware-in-the-loop (HIL) and hardware testing. The selected circuit topology is based on a Gallium Nitride (GaN) direct-matrix based dual active bridge (DAB) converter with a low voltage active power decoupler (APD) circuit. Control performance is verified, smart-grid compatibility is tested, and circuit operation is confirmed. Controller HIL (CHIL) is shown to aid in a complex power electronics system design by 1) enabling detailed control development prior to hardware implementation, 2) expanding the use of automated testing, and 3) increasing confidence in control performance prior to prototype testing. Altogether, these factors make HIL a valuable tool in complex power electronic designs.

14 SOLAR ENERGY↗

Impact of Accelerated Stress-Tests on SiC MOSFET Precursor Parameters

Integrating SiC power MOSFETs is very attractive for advancing power electronic system performance, yet the system reliability with new devices remains in question. This work presents an overview of accelerated lifetime tests and the packaging and semiconductor failure mechanisms they excite. The experiments explained here includes High Temperature Gate Bias (HTGB), Switching Cycling, Power Cycling, and Thermal Cycling. These experiments stress different failure mechanisms, that show degradation in different device parameters including, but not limited to, threshold voltage and on-resistance. These four experiments help illustrate the spectrum between device and package degradation that can be used to design more reliable power electronic circuits.

33 ADVANCED PROPULSION SYSTEMS↗

A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications

Limitations of silicon (Si) based power electronic devices can be overcome with Silicon Carbide (SiC) because of its remarkable material properties. SiC is a wide bandgap semiconductor material with larger bandgap, lower leakage currents, higher breakdown electric field, and higher thermal conductivity, which promotes higher switching frequencies for high power applications, higher temperature operation, and results in higher power density devices relative to Si [1]. The proposed work is focused on design of a SiC gate driver to drive a SiC power MOSFET, on a Cree SiC process, with rise/fall times (less than 100 ns) suitable for 500 kHz to 1 MHz switching frequency applications. A process optimized gate driver topology design which is significantly different from generic Si circuit design is proposed. The ultimate goal of the project is to integrate this gate driver into a Toyota Prius plug-in hybrid electric vehicle (PHEV) charger module. The application of this high frequency charger will result in lighter, smaller, cheaper, and a more efficient power electronics system.

Lamichhane, Ranjan↗