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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 685 records · Page 38
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

The transition from columnar to equiaxed dendritic growth in proeutectic, low-volume fraction copper, Pb-Cu alloys

Lead, 17.1, 11.2, and 5 volume fraction copper (14, 9, and 4 wt pct Cu) alloys have been directionally solidified at constant growth velocities ranging from 1 to 100 microns/s. Serially increasing the growth velocity within this range results in a graded microstructural transition from fully columnar, albeit segregated, copper dendrites in a lead matrix to one consisting only of equiaxed grains. The imposed velocity necessary to effect fully equiaxed growth is found to drop rapidly as the volume fraction of copper is decreased. Factors which complicate the controlled, directional solidification of these alloys are discussed and the experimental results are interpreted in view of, and seen to be in qualitative agreement with, Hunt's theory on the transition from columnar to equiaxed growth of dendrites.

Kim, Shinwoo↗
NASA NTRS1993

The interaction of atomic oxygen with copper: An XPS, AES, XRD, optical transmission, and stylus profilometry study

The University of Alabama in Huntsville (UAH) experiment A-0114 was designed to study the reaction of material surfaces with low earth orbits (LEO) atmospheric oxygen. The experiment contained 128 one-inch circular samples; metals, polymers, carbons, and semiconductors. Half of these samples were exposed on the front of the Long Duration Exposure Facility (LDEF) and remaining on the rear. Among metal samples, copper has shown some interesting new results. There were two forms of copper samples: a thin film sputter-coated on fused silica and a solid piece of OFHC copper. They were characterized by x-ray and Auger electron spectroscopies, x-ray diffraction, and high resolution profilometry. Cu 2p core level spectra were used to demonstrate the presence of Cu2O and CuO and to determine the oxidation states.

Raikar, Ganesh N.↗
NASA NTRS1994

Propagation velocities of laser-produced plasmas from copper wire targets and water droplets

Experiments were performed to determine the plasma propagation velocities resulting from KrF laser irradiation of copper wire target (75 microns diameter) and water droplets (75 microns diameter) at irradiance levels ranging from 25 to 150 GW/sq cm. Plasma propagation velocities were measured using a streak camera system oriented orthogonally to the high-energy laser propagation axis. Plasma velocities were studied as a function of position in the focused beam. Results show that both the shape of the plasma formation and material removal from the copper wire are different and depend on whether the targets are focused or slightly defocused (approximately = 0.5 mm movement in the beam axis). Plasma formation and its position relative to the target is an important factor in determining the practical focal point during high-energy laser interaction with materials. At irradiance of 100 GW/sq cm, the air plasma has two weak-velocity components which propagate toward and away from the incident laser while a strong-velocity component propagates away from the laser beam as a detonation wave. Comparison of the measured breakdown velocities (in the range of 2.22-2.27 x 10(exp 5) m/s) for air and the value calculated by the nonlinear breakdown wave theory at irradiance of 100 GW/sq cm showed a quantitative agreement within approximately 50% while the linear theory and Gaussian pulse theory failed. The detonation wave velocities of plasma generated from water droplets and copper wire targets for different focused cases were measured and analyzed theoretically. The propagation velocities of laser-induced plasma liquid droplets obtained by previous research are compared with current work.

Song, Kyo-Dong↗
NASA NTRS2005

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Ngo, Quoc↗
NASA NTRS2005

GRCop-84: A High Temperature Copper-based Alloy For High Heat Flux Applications

While designed for rocket engine main combustion chamber liners, GRCop-84 (Cu-8 at.% Cr-4 at.% Nb) offers potential for high heat flux applications in industrial applications requiring a temperature capability up to approximately 700 C (1292 F). GRCop-84 is a copper-based alloy with excellent elevated temperature strength, good creep resistance, long LCF lives and enhanced oxidation resistance. It also has a lower thermal expansion than copper and many other low alloy copper-based alloys. GRCop-84 can be manufactured into a variety of shapes such as tubing, bar, plate and sheet using standard production techniques and requires no special production techniques. GRCop-84 forms well, so conventional fabrication methods including stamping and bending can be used. GRCop-84 has demonstrated an ability to be friction stir welded, brazed, inertia welded, diffusion bonded and electron beam welded for joining to itself and other materials. Potential applications include plastic injection molds, resistance welding electrodes and holders, permanent metal casting molds, vacuum plasma spray nozzles and high temperature heat exchanger applications.

Ellis, David L.↗
NASA NTRS2018

Development of New Rocket Engine Liner Materials Based on Copper Alloys with Diamond Particle Additions

Novel copper-diamond materials containing particulate dispersions of diamond within a copper alloy matrix have been produced as next-generation rocket engine combustion chamber liner materials. These Copper-Diamond composite materials have significantly higher thermal conductivity than conventional liner materials and have the potential to increase the engine performance significantly. Liner fabrication techniques include hot pressing and spark plasma sintering, which are capable of scale up to full-size production parts. The materials have been evaluated for thermal cycling resistance and ease of manufacturing. The results indicate great promise of these materials and associated economics to replace state-of-the-art combustion chamber liner materials such as GRCop-84 and NARloy-Z. Novel combustion chamber fabrication processes are discussed, including cladding the liner with jacket materials.

Bhat, Biliyar N.↗
NASA NTRS2018

Development of New Rocket Engine Liner Materials Based on Copper Alloys with Diamond Particle Additions

Novel copper-diamond materials containing particulate dispersions of diamond within a copper alloy matrix have been produced as next-generation rocket engine combustion chamber liner materials. These Copper-Diamond (Cu-D) composite materials have significantly higher thermal conductivity than conventional liner materials and have the potential to increase the engine performance significantly. Liner fabrication techniques include hot pressing and spark plasma sintering (SPS), which are capable of scale up to full-size production parts. The materials have been evaluated for thermal cycling resistance and ease of manufacturing. The results indicate great promise of these materials and associated economics to replace state-of-the-art combustion chamber liner materials such as GRCop-84 and NARloy-Z. Combustion chamber fabrication processes are also discussed, including SPS and additive manufacturing.

Bhat, Biliyar N.↗
NASA NTRSDate not supplied

Process Development for Printing Copper Conductible Ink on Flexible Substrates Using Aerosol Jet Technology

Rise in demand for wearable consumer electronics products has given an impetus to the development of flexible electronics technology encompassing flexible substrates and compatible circuitry. Also, additive manufacturing of flexible electronics is emerging rapidly via several techniques such as Inkjet and Aerosol Jet Printing (AJP). The basic component of all flexible circuits to be printed by these technologies is conductible ink, which is generally silver ink. Few studies exist on the printing of copper conductible ink and not many copper ink formulations are available in the market as that of silver inks. This study aims to develop a process development study for deposition of copper conductible lines on flexible substrates using the aerosol jet printing technology. The process development study includes investigation of photosintering parameters for obtaining desirable electrical resistance and shear load to failure values for the printed line. Different pre-drying techniques such as oven pre-drying and platen pre-drying have been used for improving the electrical and mechanical properties of the conductive traces. Techniques such as optical microscopy and white light interferometry have been used for the characterization of print quality of the conductible lines.

printed electronics↗
NASA NTRSDate not supplied

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗
DOE OSTI2015

Method for fabrication of ceramic dielectric films on copper foils

The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Means and methods for treating copper-related diseases

The present invention relates to the field of (bio-)medicine, and more particularly to the treatment of copper-related diseases. Novel means and methods for depleting (excess) copper from organs and/or the circulation are provided. Agents with a high copper binding affinity and stabilized forms thereof are provided, as well as a novel treatment regimen. The means and methods of the present invention are particularly useful for treatment of Wilson Disease, but also for treatment of other conditions.

Zischka, Hans↗
DOE OSTI2023

Copper alloys for interconnectors and methods for making the same

Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.

Gianola, Daniel S.↗
DOE OSTI2024

An Organic, Direct Bonded Copper, Multi-Layered, Ultra-Low Inductance Package for High-Power UWBG MOSFETs

The most common metalized substrates used in high-power switching packages consist of a ceramic layer such as Aluminum Nitride (AlN) sandwiched between two copper layers. Ceramic substrates are used because it has the key characteristic of having high dielectric strength while being thermally conductive. A large drawback to ceramic substrates is that they do not allow for a multi-layered circuit design. By replacing the traditional ceramic substrate with organic direct bonded copper (ODBC) we can open a wide range of possibilities when it comes to power module layout such as multi-layered circuits and double-sided cooling. Both benefits are critical while packaging high-performance Gallium Oxide (Ga2O3) MOSFETs. Because of Ga2O3's relatively poor thermal conductivity, a double-sided cooled package becomes necessary. Therefore, the use of ODBC provides the flexibility to fabricate copper traces carrying much higher currents, and by creating a multi-layered package, we can drastically reduce the parasitic inductance inside the power module. Achieving lower parasitic inductance is critical for an ultra-fast Ga2O3 package to avoid excessive voltage overshoot and ringing. Using ODBC, we have designed novel packages capable of handling the challenges presented by fast Ga2O3 switching. Using multi-physics modeling software, we can validate our design before building the prototype. Due to the simple process parameters needed to work with ODBC, we can rapidly create prototypes without using external vendors. This flexibility allows us to quickly design, build, and validate highly complex switching power modules to accommodate next generation, Ga2O3 switching devices.

ADVANCED PROPULSION SYSTEMS,ENGINEERING↗
DOE OSTI2018

Mechanism of Selenium Loss in Copper Slag

During smelting of copper sulfide concentrate, selenium is distributed between silica-saturated iron-silicate slag and copper-iron sulfide matte. The recovery coefficients of selenium between slag and matte were determined as a function of the initial concentration of selenium at 1523 K (1250 °C) under an inert atmosphere in a vertical tubular furnace. The initial concentration of selenium was varied by the addition of metallic selenium as well as selenium dioxide to the mixture of slag and matte. Analysis of the results indicated high affinity of selenium for matte. The apparent loss of selenium with the slag was attributed to the presence of selenium-enriched matte particles entrapped in the slag, rather than dissolved SeO{sub 2}. The mechanisms proposed by previous investigators were discussed and also compared with the results of the present investigation.

36 MATERIALS SCIENCE↗
DOE OSTI2018

Phase Equilibria in the ZnO-“FeO”-SiO{sub 2} System in Reducing Atmosphere and in the ZnO-“FeO”-SiO{sub 2}-“Cu{sub 2}O” System in Equilibrium with Liquid Copper Metal at 1250 °C (1523 K)

Recent experimental studies in the ZnO-“FeO”-SiO{sub 2} system in reducing atmosphere demonstrated significant discrepancies with the current FactSage thermodynamic model developed using previous experimental data in this system in equilibrium with metallic iron and air. The present experimental study on phase equilibria in the ZnO-“FeO”-SiO{sub 2}-“Cu{sub 2}O” system in equilibrium with liquid copper at 1250 °C (1523 K) at low copper oxide concentrations in slag was initiated and undertaken to resolve these discrepancies. A high-temperature equilibration–rapid quenching–electron-probe X-ray microanalysis (EPMA) technique using a primary phase substrate support and closed system approach with Cu metal introduced to determine effective equilibrium oxygen partial pressure from the Cu{sub metal}/Cu{sub 2}O{sub slag} equilibria was applied to provide accurate information on the liquidus and corresponding solid compositions in the spinel, willemite, and tridymite primary phase fields. The present results confirmed the accuracy of the FactSage model, resolved discrepancies, and demonstrated significant uncertainties in the recent studies by other authors on the system in the open reducing atmosphere. The present study shows how this closed system approach can be used to obtain key thermodynamic data on phase equilibria in systems containing volatile metal species, overcoming the limitations and uncertainties encountered in conventional open gas/condensed phase equilibration with these systems. The study highlights the importance of the focus on obtaining accurate experimental data and the risks of misleading information from inadequate experimental control and analysis. The study also demonstrates that continuing in-depth critical review and analysis of the elemental reactions taking place in complex systems is an essential step in phase equilibrium research.

36 MATERIALS SCIENCE↗
DOE OSTI2014

A new copper borophosphate with novel polymeric chains and its structural correlation with raw materials in molten hydrated flux synthesis

A novel copper borophosphate, Cu{sub 3}[B{sub 2}P{sub 3}O{sub 12}(OH){sub 3}] has been prepared by the molten hydrated flux method. Its crystal structure was determined by the single-crystal X-ray diffraction (monoclinic, Cc, a=6.1895 Å, b=13.6209 Å, c=11.9373 Å, β=97.62°, V=997.5 Å{sup 3}, Z=4). The three-dimensional framework of the titled compound, is composed by two kinds of polymeric chains and isolated PO{sub 4} tetrahedral. One novel 4-membered tetrahedral rings has been observed in borophosphates. Magnetic measurements indicate that the title compound exits antiferromagnetic interactions. Due to the special reaction medium created by the molten hydrated flux method, a possible structural correlation between the final solids and the raw materials has been noted. - Graphical abstract: The 3D structure consists of a framework composed of CuO{sub x} polyhedra, BO{sub 4} and PO{sub 4} tetrahedra. A intersection angle between the metal chains and borophosphate chains can be noted. Display Omitted - Highlights: • A novel copper borophosphate has been prepared by the molten hydrated flux method. • One novel 4-membered tetrahedral ring has been observed firstly in borophosphates. • A possible structural correlation between the final solids and the raw materials has been noted.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2015

A cesium copper vanadyl-diphosphate: Synthesis, crystal structure and physical properties

A non-centrosymmetric orthorhombic diphosphate, Cs{sub 2}Cu{sub 1+x}(VO){sub 2−x}(P{sub 2}O{sub 7}){sub 2} (x=0.1) with a=13.7364(2) Å, b=9.2666(2) Å, c=11.5678(2) Å, Z=4, has been isolated. Its 3D framework is built from Cu atoms in square pyramidal and square planar coordination, VO{sub 5} tetragonal pyramids and P{sub 2}O{sub 7} diphosphate groups, sharing vertices. Large channels are fulfilled by cesium atoms. The ESR study reveals a similarity in behaviour of two paramagnetic (Cu and V) subsystems. The temperature dependences of the ESR linewidth and static magnetic susceptibility data present evidences for a cluster type magnetic ordering in the title compound at T⁎=22 K. The weakness of the relevant anomalies reflects presumably obvious Cu{sup 2+} ions and (VO){sup 2+} units disorder in the system. It is supposed that the charge and geometry of the framework are controlled by the Cu{sup 2+}/(VO){sup 2+} ratio; its variation may lead to a design of new materials. - Graphical abstract: A microporous 3D anionic framework of the first copper vanadium-diphosphate Cs{sub 2}Cu{sub 1.1}(VO){sub 1.9}(P{sub 2}O{sub 7}){sub 2}. The similarity in behaviour of Cu and V paramagnetic subsystems revealed by ESR study. - Highlights: • The first copper vanadium-diphosphate Cs{sub 2}Cu{sub 1.1}(VO){sub 1.9}(P{sub 2}O{sub 7}){sub 2} is reported. • A 3D anionic framework is characterized by disorder in distribution of Cu and V atoms. • Structural relations with topologically similar compounds are discussed. • The similarity in behaviour of Cu and V paramagnetic subsystems has been revealed.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2015

Syntheses, characterization and properties of silver, copper and palladium complexes from bis(oxazoline)-containing ligands

The reactions of 2,6-di(2-oxazolyl)pyridine (L{sup 1}) and 2,6-bis[(S)-4-phenyl-2-oxazolyl]pyridine (L{sup 2}) with silver, copper and palladium salts to yield six new complexes: ([Ag{sub 5}(L{sup 1}){sub 5}](BF{sub 4}){sub 5}){sub n} (1), ([Ag(L{sup 1})](SbF{sub 6})){sub n} (2), [Cu{sub 4}I{sub 4}(L{sup 1}){sub 2}] (3), [Cu{sub 6}I{sub 6}(L{sup 1}){sub 2}] (4), [Pd(L′{sup 1})(OAc)] (5), [Pd(L′{sup 2})Cl] (6), which were fully characterized by single-crystal and powder X-ray diffraction, IR, elemental and thermogravimetric analyses. 1 and 2 are a pair of Ag-oxazoline helical chain structure complexes. The spiral directions of chains are opposite in 1, while identical in 2; the measurement of CD spectra can further confirm their meso and chiral structures. Complexes 3 and 4 show eight-nuclear and twelve-nuclear iodine–cuprous cluster structure. Their structural diversity is induced by different molar ratios of CuI:L{sup 1}. Complexes 5 and 6 are discrete mononuclear palladium complexes. In situ oxazolyl-ring-opening reactions take place in the syntheses of them and the L{sup 1} and the L{sup 2} were transformed to their oxazolyl-ring opened derivatives L′{sup 1} and L′{sup 2}. Moreover, fluorescence, non-linear optical properties, and ferroelectric properties have been investigated. - Graphical abstract: 2,6-di(2-oxazolyl)pyridine (L{sup 1}) reacts with silver and copper salts to yield helical and cluster structure complexes. - Highlights: • Helical and cluster structure complexes. • In situ oxazolyl-ring-opening reactions. • Fluorescence, non-linear optical properties, and ferroelectric properties.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗