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At least 685 records · Page 38

Method of Manufacturing a Light Emitting, Photovoltaic or Other Electronic Apparatus and System

The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.

Ray, William Johnstone↗

Method of Manufacturing a Light Emitting, Photovoltaic or Other Electronic Apparatus and System

The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.

Ray, William Johnstone↗

Real-time SEM studies in controlled reactive atmospheres

A unique scanning electron accessory has been developed that allows the observation of specimens under partial pressures of any gas. The sample is placed in a metal support boat inside a special sample holder. The sample in the boat is imaged on a CRT and is simultaneously recorded on a videotape, allowing the reaction between the sample and the gas to be observed in real time. Sample changes can be seen continuously as the sample is being heated or cooled. This process allows the observation of material transformations such as phase changes as they happen. Temperatures as high as 1000 C have been used and are continuously monitored using a thermocouple with a digital display on the CRT and videotape. X-ray analyses can also be run before and after any reactions. In the study described here, thick-film screen-printing inks using molybdenum/tin compositions as a replacement for silver were developed to be used on terrestrial photovoltaic cells. Pieces were placed on the sample stage and heated in both O2 and H2 atmospheres. The results were used to determine the most effective frits to be used in the thick-film inks.

Gallagher, B. D.↗

Mobile antenna development at JPL

The Jet Propulsion Laboratory (JPL), under the sponsorship of NASA, has pioneered the development of land vehicle antennas for commercial mobile satellite communications. Several novel antennas have been developed at L-band frequencies for the Mobile Satellite (MSAT) program initiated about a decade ago. Currently, two types of antennas are being developed at K- and Ka-band frequencies for the ACTS (Advanced Communications Technology Satellite) Mobile Terminal (AMT) project. For the future, several hand-held antenna concepts are proposed for the small terminals of the Ka-band Personal Access Satellite System (PASS). For the L-band MSAT program, a number of omni-directional low-gain antennas, such as the crossed drooping-dipoles, the higher-order-mode circular microstrip patch, the quadrifilar helix, and the wrapped-around microstrip 'mast' array, have been developed for lower data rate communications. Several medium-gain satellite tracking antennas, such as the electronically scanned low-profile phased array, the mechanically steered tilted microstrip array, the mechanically steered low-profile microstrip Yagi array, and the hybrid electronically/mechanically steered low-profile array, have been developed for the MSAT's higher data rate and voice communications. To date, for the L-band vehicle application, JPL has developed the world's lowest-profile phased array (1.8 cm height), as well as the lowest-profile mechanically steered antenna (3.7 cm height). For the 20/30 GHz AMT project, a small mechanically steered elliptical reflector antenna with a gain of 23 dBi has recently been developed to transmit horizontal polarization at 30 GHz and receive vertical polarization at 20 GHz. Its hemispherical radome has a height of 10 cm and a base diameter of 23 cm. In addition to the reflector, a mechanically steered printed MMIC active array is currently being developed to achieve the same electrical requirements with a low profile capability. These AMT antenna developments, along with other Ka-band technologies, will lead to the development of several compact hand-held terminals for the PASS program. A few antenna concepts, such as the lap-top or desk-top terminal's printed array, the hand-held phased array, and the head-mounted low-profile array, have been proposed to achieve a future vision for the personal access communications system.

Huang, J.↗

Self-Sensing, Stretchable, Active Circuit Arrays: Liquid Metal Paste as a Combination Interconnect and Strain Sensor

Stretchable electrical interconnects and substrate materials are increasingly used to create flexible and con-formable electronic systems for soft robotics, smart textiles, and wearable devices. Wires fabricated using composite or liquid conductive inks encapsulated in silicone enable high strain and are mechanically robust. The resistance of these inter-connects increases with strain, which can present challenges for power delivery and signaling among electronic components. However, this effect can be used directly to estimate strain within a stretchable circuit without the need for additional sensor components. In this work, we present an approach for fabricating fully-stretchable, multi-layer active circuit arrays in silicone using liquid metal paste interconnects, in which power and data wires are re-purposed as strain sensors to estimate substrate deformation. As a proof-of-principle, we demonstrate a 3×3 active circuit array that self-senses relative voltage supply at each node to estimate deformation and consumes less than 10 mA per node. Each node is digitally addressable and performs both analog measurement and digital conversion. All interconnects are fabricated using liquid metal paste, and power, data, and sensing are performed over a shared, four-wire interface in this multi-layer stretchable printed circuit board.

99 GENERAL AND MISCELLANEOUS↗

An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduced Board Size for Space Based Electronics

This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.

Hunter, Don J↗

A programmable CCD driver circuit for multiphase CCD operation

A programmable CCD (charge-coupled device) driver circuit was designed to drive CCDs in multiphased modes. The purpose of the drive electronics is to operate developmental CCD imaging arrays for NASA's tiltable moderate resolution imaging spectrometer (MODIS-T). Five objectives for the driver were considered during its design: (1) the circuit drives CCD electrode voltages between 0 V and +30 V to produce reasonable potential wells, (2) the driving sequence is started with one input signal, (3) the driving sequence is started with one input signal, (4) the circuit allows programming of frame sequences required by arrays of any size, (5) it produces interfacing signals for the CCD and the DTF (detector test facility). Simulation of the driver verified its function with the master clock running up to 10 MHz. This suggests a maximum rate of 400,000 pixels/s. Timing and packaging parameters were verified. The design uses 54 TTL (transistor-transistor logic) chips. Two versions of hardware were fabricated: wirewrap and printed circuit board. Both were verified functionally with a logic analyzer.

Ewin, Audrey J.↗

Large-scale additive manufacturing of self-heating molds

Large-scale material extrusion additive manufacturing technology is becoming the new mainstream technology for scaled-up composite mold and die applications. This paradigm shift in composite processing technology is primarily driven by out-of-autoclave tooling applications, in which fiber reinforced composite molds with scaled-up sizes and embedded heating elements are attractive. The present research describes the design, manufacturing, and testing of self-heating composite molds fabricated via a large-scale pellet extrusion 3D printing machine with an integrated wire co-extrusion tool. Polycarbonate (PC) composites reinforced with carbon fiber (PC/CF; 20 wt.%) and glass fiber (PC/GF; 20 wt.%) were used to fabricate mold parts. Joule heating thermal test results showed that uniform temperatures (~100 °C) were achieved for both PC/CF and PC/GF mold surfaces, using a custom-made feedback control power supply and infrared thermography. Mechanical characterizations, including tensile and flexural testing were performed on the wire-embedded and un-wired PC/CF and PC/GF base specimens to investigate the impact of the fiber reinforcement as well as the embedded wires. In the direction of extrusion, the ultimate tensile stress of PC/CF was 105 MPa, and that of PC/GF was 73 MPa, while the neat PC value was 64 MPa. Inner-bead voids and interfacial gaps were observed and characterized via optical and scanning electron microscopy. The embedded wires and inner bead impacted the mechanical properties of the composites. Furthermore, the stiffness of the wire-embedded mold was still satisfactory, proving that the technology can be used to fabricate additively manufactured out-of-oven/autoclave molds.

36 MATERIALS SCIENCE↗

Neutral ion sources in precision manufacturing

Ion figuring of optical components is a relatively new technology that can alleviate some of the problems associated with traditional contact polishing. Because the technique is non contacting, edge distortions and rib structure print through do not occur. This initial investigation was aimed at determining the effect of ion figuring on surface roughness of previously polished or ductile ground ceramic optical samples. This is the first step in research directed toward the combination of a pre-finishing process (ductile grinding or polishing) with ion figuring to produce finished ceramic mirrors. The second phase of the project is focusing on the development of mathematical algorithms that will deconvolve the ion beam profile from the surface figure errors so that these errors can be successfully removed from the optical components. In the initial phase of the project, multiple, chemical vapor deposited silicon carbide (CVD SiC) samples were polished or ductile ground to specular or near-specular roughness. These samples were then characterized to determine topographic surface information. The surface evaluation consisted of stylus profilometry, interferometry, and optical and scanning electron microscopy. The surfaces, were ion machined to depths from 0-5 microns. The finished surfaces were characterized to evaluate the effects of the ion machining process with respect to the previous processing methods and the pre-existing subsurface damage. The development of the control algorithms for figuring optical components has been completed. These algorithms have been validated with simulations and future experiments have been planned to verify the methods. This paper will present the results of the initial surface finish experiments and the control algorithms simulations.

Fawcett, Steven C.↗

The organic redox transistor for neuromorphic computing

Inspired by the in-memory computing architectures of biological systems, neuromorphic computing using crossbar arrays of artificial synapses based on non-volatile memory (NVM) devices with variable conductances has emerged as a new paradigm to enable massively parallel and ultra-low power computing hardware for data centric applications. Although inference has been demonstrated successfully using crossbars based on a variety of NMV technologies, efficient learning and scaling to large arrays (>10 6 elements) remains a challenge due to the synaptic elements' non-ideal electrical characteristics which degrades ANN accuracy. A further challenge is that in the conductive state memristors draw large currents >μA resulting in significant voltage drops in the interconnect wires and increased probability of failure in scaled arrays. We suggest the organic polymer redox transistor (RT) is an alternate approach that could solve many of these challenges, enabling both inference and parallel outer product updates, as recently demonstrated by Fuller et al. An RT consists of redox-active channel and gate electrodes in contact with a liquid or solid electrolyte. lon insertion through the electrolyte controls the channel electronic conductivity, while electron transfer through an external circuit maintains overall charge neutrality. Unlike a rechargeable battery, in the RT the voltage built-up across the electrolyte is kept to a minimum (typically <100 mV) by using the same material for the gate and channel. Elimination of the voltage offset simplifies integration of the RT into programmable arrays by enabling the use of various selectors. RTs based on inorganic and organic materials have been recently demonstrated with conductance tuning occurring at potentials of just a few mV and hundreds to thousands of linearly and symmetrically programmable conductance states, enabling near ideal accuracy in neural network simulations. Introduced in the 1980's, redox transistors with metallic gate electrodes and organic channel materials, also known as organic electrochemical transistors (OECTs), have been explored for a variety of applications such as chem- and bio-sensing, neural interfaces, and low cost printed circuits. A typical channel material for OECTs is the conducting polymer poly(3,4-ethylenedioxythiophene) doped with poly(styrene sulfonate) (PEDOT:PSS). PEDOT is a p-type semiconducting polymer with mobile positively charged polarons that hop chain-to-chain.

Talin, Albert Alec↗

Design and optimization of higher order mode couplers for the superconducting cavities of the PERLE energy recovery linac

The Powerful Energy Recovery Linac for Experiments (PERLE) is an energy recovery linac (ERL) facility based on superconducting radio-frequency (SRF) technology to be hosted at the Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab) in France. With a target beam power of 10 MW, PERLE aims to demonstrate the high-current, continuous wave, multi-pass operation to validate options for future high-energy machines, such as the 50 GeV ERL proposed for the Large Hadron electron Collider (LHeC) and the Future Circular electron-hadron Collider (FCC-eh), and host dedicated particle physics and nuclear experiments. In high-current ERLs, the regenerative Beam Breakup (BBU), emerging from the beam and cavity Higher Order Modes (HOMs) interaction, is a major concern for their stable operation. Beam-induced HOMs can increase the cavity heat load at cryogenic temperature and cause beam instabilities. HOM couplers are installed in the cavity beam pipes to absorb HOM energy and mitigate these effects. This thesis presents the design and optimization of several coaxial HOM couplers for the 5-cell 801.58 MHz elliptical Nb cavities of the 500 MeV PERLE ERL configuration. The RF transmission of the HOM couplers was optimized to enhance the damping of the most dangerous HOMs. The optimized HOM couplers were integrated into endgroups to simulate their damping performance and thermal behavior. The optimized HOM couplers were 3D-printed in epoxy and copper-coated. Low-power RF measurements were conducted on the produced HOM couplers installed in copper PERLE-type cavities to validate their damping performance and propose several endgroups for the PERLE 5-cell cavity to mitigate HOMs below the BBU instability limits.

Barbagallo, Carmelo↗

Instruments for Reading Direct-Marked Data-Matrix Symbols

Improved optoelectronic instruments (specially configured digital cameras) for reading direct-marked data-matrix symbols on the surfaces of optically reflective objects (including specularly reflective ones) are undergoing development. Data-matrix symbols are two-dimensional binary patterns that are used, like common bar codes, for automated identification of objects. The first data-matrix symbols were checkerboard-like patterns of black-and-white rectangles, typically existing in the forms of paint, ink, or detachable labels. The major advantage of direct marking (the marks are more durable than are painted or printed symbols or detachable labels) is offset by a major disadvantage (the marks generated by some marking methods do not provide sufficient contrast to be readable by optoelectronic instruments designed to read black-and-white data-matrix symbols). Heretofore, elaborate lighting, lensing, and software schemes have been tried in efforts to solve the contrast problem in direct-mark matrix- symbol readers. In comparison with prior readers based on those schemes, the readers now undergoing development are expected to be more effective while costing less. All of the prior direct-mark matrix-symbol readers are designed to be aimed perpendicularly to marked target surfaces, and they tolerate very little angular offset. However, the reader now undergoing development not only tolerates angular offset but depends on angular offset as a means of obtaining the needed contrast, as described below. The prototype reader (see Figure 1) includes an electronic camera in the form of a charge-coupled-device (CCD) image detector equipped with a telecentric lens. It also includes a source of collimated visible light and a source of collimated infrared light for illuminating a target. The visible and infrared illumination complement each other: the visible illumination is more useful for aiming the reader toward a target, while the infrared illumination is more useful for reading symbols on highly reflective surfaces. By use of beam splitters, the visible and infrared collimated lights are introduced along the optical path of the telecentric lens, so that the target is illuminated and viewed from the same direction.

Schramm, Harry F.↗

Making & Breaking the Rules for DED Design

Design for Additive Manufacturing (DfAM) is widely used to describe design activities and guidelines employed in the creation of Additively Manufactured (AM) parts. Basic design rules for widely adopted processes like Powder Bed Fusion (PBF) are relatively understood including material performance, part size constraints, self-supporting angles, overhangs, wall thicknesses, and feature resolution. Complexity is often inherent with PBF using organically inspired solutions through generative design and topology optimization software to create designs that often cannot be realized via traditional manufacturing processes. The design rules for Directed Energy Deposition (DED) are less well known, and, in some cases, the lack of understanding is likely inhibiting broader application of the various DED processes. This presentation covers key design rules for DED fusion processes and elucidates opportunities like multi-material deposition and build approaches ranging from basic features to complex large-scale parts. Complementary to the opportunistic characteristics of DfAM for DED, Manufacture for AM (MfAM) encompasses the restrictive aspects of the manufacturing lifecycle with limitations due to bead width and wall thickness, self-supporting angles, surface texture, microstructural evolution, and residual stresses. AM enabled part design must always consider the entire value chain starting with incoming feedstock (e.g. plate, wire, or powder) and progressing through the printing process, post-processing (e.g. machining, inspection), and final system assembly. Key considerations, like the tradeoffs between feature resolution and build rate, for process and part selection and economic assessments will be discussed as DED is often traded against other AM processes. After highlighting typical DED design rules, we will also show how some of those rules can be broken via use cases and part designs that span the full spectrum of DED processes with examples of various DED part designs.

Additive Manufacturing↗

Sample Handling in Extreme Environments

Harsh environments, such as that on Venus, preclude the use of existing equipment for functions that involve interaction with the environment. The operating limitations of current high temperature electronics are well below the actual temperature and pressure found on Venus (460 deg C and 92 atm), so proposed lander configurations typically include a pressure vessel where the science instruments are kept at Earth-like temperature and pressure (25 deg C and 1 atm). The purpose of this project was to develop and demonstrate a method for sample transfer from an external drill to internal science instruments for a lander on Venus. The initial concepts were string and pneumatically driven systems; and the latter system was selected for its ability to deliver samples at very high speed. The pneumatic system was conceived to be driven by the pressure difference between the Venusian atmosphere and the inside of the lander. The pneumatic transfer of a small capsule was demonstrated, and velocity data was collected from the lab experiment. The sample transfer system was modeled using CAD software and prototyped using 3D printing. General structural and thermal analyses were performed to approximate the proposed system's mass and effects on the temperature and pressure inside of the lander. Additionally, a sampler breadboard for use on Titan was tested and functionality problems were resolved.

sample handling↗

Additively Manufactured Solid-State Luminaire

This project addresses several key barriers to wide-spread adoption of additive manufacturing (AM) technology as applied to solid state lighting luminaires. The solution will utilize cutting edge AM approaches for integrating structure with thermal management solutions, electronic functionality, and optics. The research team (Eaton, Lighting Research Center (LRC) at Rensselaer Polytechnic Institute, Xerox Research Centre of Canada (XRCC)) utilize their AM and lighting expertise to investigate breakthrough manufacturing approaches that will significantly reduce cost, eliminate manufacturing process waste, and improve luminaire efficacy. The team has identified critical areas of research and proposed novel technical approaches to achieve these goals. Key areas of focus in Budget Period 1 (BP1) of the project quantified the impact of applying AM methodologies to the main, discrete subsystem components (Heat Sink, Housing, Optics, Electronics). Budget Period 2 (BP2) research explored similar impact on a fully integrated, AM modular luminaire concept. Final Achievement of the Target Metrics for the project are as follows: Material Reduction: achieved > 57.45% (target is 50%) Manufacturing Process: achieved > 51% reduction (target is 50%) Application Efficacy: achieved 126 lm/W (target is 130 lm/W) First Cost vs Baseline: demonstrated 49% improvement in project timing, 59% improvement in man hour savings and 89% worse BOM costs (due to deficiencies in current “state of the art” equipment). The BOM costs improve to 53% savings if state of the art processes and equipment could have been used.

3D Printing↗

W-ZrC composites prepared by reactive melt infiltration of Zr 2 Cu alloy into binder jet 3D printed WC preforms

W-ZrC composites were successfully prepared by reactive melt infiltration (RMI) of stoichiometric and excess amounts of Zr 2 Cu into sintered and un-sintered WC preforms made from binder jet 3D printing. The focus of this work was to study the conversion of reactant powders and liquid infiltrant with varying preform density and infiltrant amount by controlling the processing time to reach high conversion yield while understanding the phase composition, microstructure, and hardness. To investigate the effect of time, the reactive melt infiltration was conducted at 1400 °C for 2, 4 and 8 h in a furnace with 96% Ar - 4% H2 gas atmosphere. The increase in reaction time from 2 to 8 h increased the W and W 2 C phase contents and decreased the ZrC phase content when using sintered WC preforms. Samples prepared from un-sintered WC preforms exhibited improved reactive melt infiltration compared to sintered samples, and there was no detectable W 2 C phase and nearly full consumption of WC. Similar to sintered WC samples, the content of W and ZrC phases increased with the increase in time from 2 to 8 h. The interfaces and phases at reaction interfaces were investigated using electron diffraction analysis and S/TEM-EDS to understand material stability; the phases were identified and consistent with XRD analysis. Additionally, there was no Cu present at the interfaces. Increasing the amount of infiltrant led to better reactive melt infiltration. In general, the hardness increased with reaction time and the highest Vickers hardness was found in the W-ZrC sample formed from sintered WC reacted with excess Zr 2 Cu. Finally, this research addresses the critical comparison of sintering and RMI time and shows that by using un-sintered samples for 8 h we are able to achieve W-ZrC composites with fewer undesired phases.

36 MATERIALS SCIENCE↗

Flexible Copper Metal Circuits via Desktop Laser Printed Masks

A novel process is demonstrated that produces patterns of electrically conductive copper on a flexible polyimide film substrate using standard desktop laser printed toner and near room temperature aqueous chemistry. The laser toner acts as a mask to selectively block the ion exchange self-metallization (IESM) reduction reaction that forms nanoscale silver or palladium coatings at the polyimide surface. The silver or palladium IESM coating is then used as a catalyst for electroless deposition of copper. Under appropriate conditions, the copper is deposited selectively on top of the catalyst layer. The resulting copper layer has a measured sheet resistance as low as 0.3 Ohms/sq. Electrical isolation was measured between copper traces spaced as close as 300 microns, and high conductivity was measured along traces with widths as low as 200 microns. The minimum pattern size appears to be limited primarily by the resolution of the laser toner pattern, as the IESM metal layer was observed to follow the contours of individual toner particles. Here, the process avoids the use of high temperature, vacuum, and organic solvents and is thus suitable for very low cost prototyping or distributed manufacturing of simple electronic devices.

36 MATERIALS SCIENCE↗

Dissolution zone model of the oxide structure in additively manufactured dispersion-strengthened alloys

The structural evolution of oxides in dispersion-strengthened superalloys during laser-powder bed fusion is considered in detail. Alloy chemistry and process parameter effects on oxide structure are assessed through a parameter study on the model alloy Ni-20Cr, doped with varying concentrations of Y 2 O 3 and Al. Small angle neutron scattering measurements of the dispersoid size distribution show the dispersoid size increases with higher laser power, slower scan speed, and increasing Y 2 O 3 and Al content. Complementary electron microscopy measurements reveal reactions between Y 2 O 3 and Al, even in nanoscale dispersoids, and the presence of micron-scale oxide slag inclusions in select specimens. A scaling analysis of mass and momentum transport within the melt pool, presented here, establishes that diffusional structural evolution mechanisms dominate for nanoscale dispersoids, while fluid forces and advection become significant for larger slag inclusions. These findings are developed into a theory of dispersoid structural evolution, integrating quantitative models of diffusional processes – dispersoid dissolution, nucleation, growth, coarsening – with a reduced order model of time-temperature trajectories of fluid parcels within the melt pool. Calculations of the dispersoid size in single-pass melting reveal a zone in the center of the melt track in which the oxide feedstock fully dissolves. Within this zone the final Y 2 O 3 size is independent of feedstock size and determined by nucleation and growth kinetics. If the dissolution zones of adjacent melt tracks overlap sufficiently with each other to dissolve large oxides, formed during printing or present in the powder feedstock, then the dispersoid structure throughout the build volume is homogeneous and matches that from a single pass within the dissolution zone. Gaps between adjacent dissolution zones result in oxide accumulation into larger slag inclusions. Predictions of final dispersoid size and slag formation using this dissolution zone model match the present experimental data and explain process-structure linkages speculated in the open literature.

36 MATERIALS SCIENCE↗