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At least 667 records · Page 37

A Web 2.0 and OGC Standards Enabled Sensor Web Architecture for Global Earth Observing System of Systems

This paper will describe the progress of a 3 year research award from the NASA Earth Science Technology Office (ESTO) that began October 1, 2006, in response to a NASA Announcement of Research Opportunity on the topic of sensor webs. The key goal of this research is to prototype an interoperable sensor architecture that will enable interoperability between a heterogeneous set of space-based, Unmanned Aerial System (UAS)-based and ground based sensors. Among the key capabilities being pursued is the ability to automatically discover and task the sensors via the Internet and to automatically discover and assemble the necessary science processing algorithms into workflows in order to transform the sensor data into valuable science products. Our first set of sensor web demonstrations will prototype science products useful in managing wildfires and will use such assets as the Earth Observing 1 spacecraft, managed out of NASA/GSFC, a UASbased instrument, managed out of Ames and some automated ground weather stations, managed by the Forest Service. Also, we are collaborating with some of the other ESTO awardees to expand this demonstration and create synergy between our research efforts. Finally, we are making use of Open Geospatial Consortium (OGC) Sensor Web Enablement (SWE) suite of standards and some Web 2.0 capabilities to Beverage emerging technologies and standards. This research will demonstrate and validate a path for rapid, low cost sensor integration, which is not tied to a particular system, and thus be able to absorb new assets in an easily evolvable, coordinated manner. This in turn will help to facilitate the United States contribution to the Global Earth Observation System of Systems (GEOSS), as agreed by the U.S. and 60 other countries at the third Earth Observation Summit held in February of 2005.

Mandl, Daniel↗

Fabrication of Lanthanum Telluride 14-1-11 Zintl High-Temperature Thermoelectric Couple

The development of more efficient thermoelectric couple technology capable of operating with high-grade heat sources up to 1,275 K is key to improving the performance of radioisotope thermoelectric generators. Lanthanum telluride La3-xTe4 and 14-1-11 Zintls (Yb14MnSb11) have been identified as very promising materials. The fabrication of advanced high-temperature thermoelectric couples requires the joining of several dissimilar materials, typically including a number of diffusion bonding and brazing steps, to achieve a device capable of operating at elevated temperatures across a large temperature differential (up to 900 K). A thermoelectric couple typically comprises a heat collector/ exchanger, metallic interconnects on both hot and cold sides, n-type and ptype conductivity thermoelectric elements, and cold-side hardware to connect to the cold-side heat rejection and provide electrical connections. Differences in the physical, mechanical, and chemical properties of the materials that make up the thermoelectric couple, especially differences in the coefficients of thermal expansion (CTE), result in undesirable interfacial stresses that can lead to mechanical failure of the device. The problem is further complicated by the fact that the thermoelectric materials under consideration have large CTE values, are brittle, and cracks can propagate through them with minimal resistance. The inherent challenge of bonding brittle, high-thermal-expansion thermoelectric materials to a hot shoe material that is thick enough to carry the requisite electrical current was overcome. A critical advantage over prior art is that this device was constructed using all diffusion bonds and a minimum number of assembly steps. The fabrication process and the materials used are described in the following steps: (1) Applying a thin refractory metal foil to both sides of lanthanum telluride. To fabricate the n-type leg of the advanced thermoelectric couple, the pre-synthesized lanthanum telluride coupon was diffusion bonded to the metal foil using a thin adhesion layer. (2) Repeating a similar process for the 14-1-11 Zintl p-type leg of the advanced thermoelectric couple. (3) Bonding thick CTE-matched metal plates on the metallized lanthanum telluride and Yb14MnSb11 to form the hot and cold sides of the thermoelectric couple. The calculated conversion efficiency of such an advanced couple would be about 10.5 percent, about 35 percent better than heritage radioisotope thermoelectric technology that relies on Si-Ge alloys. In addition, unlike Si-Ge alloys, these materials can be combined with many other thermoelectric materials optimized for operation at lower temperatures to achieve conversion efficiency in excess of 15 percent (a factor of 2 increase over heritage technology).

Ravi, Vilupanur A.↗

Reliability of Sn/Pb and Lead-Free (SnAgCu) Solders of Surface Mounted Miniaturized Passive Components for Extreme Temperature (-185 C to +125 C) Space Missions

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability or future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185oC to +125oC) covers military specifications (-55oC to +100oC), extreme old Martian (-120oC to +115oC), asteroid Nereus (-180oC to +25oC) and JUNO (-150oC to +120oC) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185oC to +125oC) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

extreme temperatures,↗

Investigation of DMSD Trend in the ISS Water Processor Assembly

The ISS Water Recovery System (WRS) is responsible for providing potable water to the crew, to the Oxygen Generation System (OGS) for oxygen production via electrolysis, to the Waste & Hygiene Compartment (WHC) for flush water, and for experiments on ISS. The WRS includes the Water Processor Assembly (WPA) and the Urine Processor Assembly (UPA). The WPA processes condensate from the cabin air and distillate produced by the UPA. In 2010, an increasing trend in the Total Organic Carbon (TOC) in the potable water was ultimately identified as dimethylsilanediol (DMSD). The increasing trend was ultimately reversed after replacing the WPA's two multifiltration beds. However, the reason for the TOC trend and the subsequent recovery was not understood. A subsequent trend occurred in 2012. This paper summarizes the current understanding of the fate of DMSD in the WPA, how the increasing TOC trend occurred, and the plan for modifying the WPA to prevent recurrence.

Carter, Layne↗

Assessment of Service Life for Regenerative ECLSS Resin Beds

The International Space Station (ISS) Water Processor Assembly (WPA) and Oxygen Generation Assembly (OGA) manage and process water at various levels of cleanliness for multiple purposes. The effluent of theWPA and the influent of the OGA require water at very high levels of purity. The bulk of the water purification that occurs in both systems is performed by consumable activated carbon and ion exchange resin beds. Replacement beds must be available on orbit in order to continue the ISS critical processes of water purification and oxygen generation. Various hurdles exist in order to ensure viable spare resin beds. These include the characteristics of resin beds such as: storage environment, shelf life requirements, microbial growth, and variations in the levels and species of contaminants the beds are required to remove. Careful consideration has been given to match water models, bed capacities and spares traffic models to ensure that spares are always viable. The results of these studies and considerations, in particular, how shelf life requirements affect resin bed life management, are documented in this paper.

Cloud, Dale L.↗

Electrohydrodynamic Printing and Manufacturing

An stable electrohydrodynamic filament is obtained by causing a straight electrohydrodynamic filament formed from a liquid to emerge from a Taylor cone, the filament having a diameter of from 10 nm to 100.mu.m. Such filaments are useful in electrohydrodynamic printing and manufacturing techniques and their application in liquid drop/particle and fiber production, colloidal deployment and assembly, and composite materials processing.

Aksay, Ilhan A.↗

Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space Missions

The purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.

extreme temperatures↗

Probabilistic Survivability Versus Time Modeling

This technical paper documents Kennedy Space Centers Independent Assessment team work completed on three assessments for the Ground Systems Development and Operations (GSDO) Program to assist the Chief Safety and Mission Assurance Officer (CSO) and GSDO management during key programmatic reviews. The assessments provided the GSDO Program with an analysis of how egress time affects the likelihood of astronaut and worker survival during an emergency. For each assessment, the team developed probability distributions for hazard scenarios to address statistical uncertainty, resulting in survivability plots over time. The first assessment developed a mathematical model of probabilistic survivability versus time to reach a safe location using an ideal Emergency Egress System at Launch Complex 39B (LC-39B); the second used the first model to evaluate and compare various egress systems under consideration at LC-39B. The third used a modified LC-39B model to determine if a specific hazard decreased survivability more rapidly than other events during flight hardware processing in Kennedys Vehicle Assembly Building (VAB).Based on the composite survivability versus time graphs from the first two assessments, there was a soft knee in the Figure of Merit graphs at eight minutes (ten minutes after egress ordered). Thus, the graphs illustrated to the decision makers that the final emergency egress design selected should have the capability of transporting the flight crew from the top of LC 39B to a safe location in eight minutes or less. Results for the third assessment were dominated by hazards that were classified as instantaneous in nature (e.g. stacking mishaps) and therefore had no effect on survivability vs time to egress the VAB. VAB emergency scenarios that degraded over time (e.g. fire) produced survivability vs time graphs that were line with aerospace industry norms.

Joyner, James J., Sr.↗

Orion European Service Module (ESM) Development, Integration and Qualification Status

ESA and the European Industry are supplying the European Service Module for Orion. An overview of the system and subsystem configuration of the Orion European Service Module (ESM) as designed and built for the EM-1 mission is provided as well as an outline of its development, assembly, integration and verification process performed by ESA and NASA in coordination with their respective Industrial prime contractors, Airbus Defence and Space and Lockheed Martin.

Berthe, Philippe↗

Blind to Chemistry: Molecular Contaminant Films We Could Be Missing During Visual Inspections and the Potential Impact to System Performance

Throughout the assembly, integration and test process, molecular contamination levels of space mission hardware are monitored to meet system performance requirements. Qualitatively, reflective surfaces and witness mirrors are continuously inspected for the visible presence of molecular contaminant films. Quantitatively, periodic reflectance measurements of witness mirrors indicate changes of mirror reflectivity over time due to the accumulation of molecular contaminant films. However, both methods only consider the presence of a contaminant film and not the molecular composition. Additionally, there is a risk that hardware may appear to be “visibly clean” even with a molecular contaminant film present on critical surfaces. To address these issues, experiments were performed to quantify the maximum molecular contaminant film that could be missed in visual inspections on witness mirrors with five different contaminants present. The corresponding changes in mirror reflectivity were modeled using the program STACK to determine the impact to space mission hardware performance. The results of this study not only show the criticality in considering the chemical make-up of molecular contaminant films on system performance, but also the need to recognize and understand the limitations of traditional visual inspection techniques on detecting molecular contaminant films.

Seasly, Elaine↗

Evaluation of Preliminary Buffet Forcing Function Development based on Wind-Tunnel Tests of Geometrically-similar Models

The current state-of-the-art for launch vehicle buffet load estimation involves wind tunnel testing of highly instrumented rigid models and data processing of experimental unsteady pressure measurements to estimate the fluctuating aerodynamic loads. The model and instrumentation requirements to accomplish this type of testing are significant. The rigid model, in particular, must be built with relatively high geometric fidelity to approximate similar aerodynamic phenomena that will occur during the full-scale vehicle flight. Due to this requirement, several iterative wind tunnel tests are often required during the design maturation of the vehicle. For preliminary buffet load estimation, however, data from previous launch vehicle wind tunnel tests of geometrically similar models can be used to provide initial buffet environment estimates before a high geometric fidelity wind tunnel test has been conducted. In this paper, two components of this preliminary buffet estimation process are described: (1) assembly of buffet forcing functions from multiple data sources and (2) scaling of these buffet forcing functions to geometrically-similar components of a target vehicle configuration. The impacts of these estimation methods on the full-vehicle buffet forcing functions, including their longitudinal distribution along the vehicle, frequency-content at individual stations, and station-to-station coherence, are investigated. Considerations for using these methods to extrapolate wind tunnel data to geometrically similar models are also discussed.

Patrick S Heaney↗

Growth as an Alternative Approach to the Construction of Extra-Terrestrial Habitats

A critical component of human space exploration and eventual settlement is the ability to construct habitats while minimizing payload mass launched from Earth. To respond to this challenge, we have proposed the use of fungal bio-composites for ‘growing’ extra-terrestrial structures, directly at the destination, significantly lowering the mass of structural materials transported from Earth and minimizing the need for high mass robotic operations and infrastructure preparations. Throughout human history, the construction of habits has used biologically produced materials, from bone and skins to wood and limestone. Traditionally, the materials are used only after they die. Currently, the idea of working with living biological organisms, and the phenomenon of growth itself, is increasing in interest both, in architecture and space applications. Here we describe the use of mycelium-based composites as an alternative, biological approach for constructing regenerative and adaptive extraterrestrial habitats, a continuation of our research program initiated under the auspices of the ‘Myco-architecture Off Planet’ NASA NIAC Team. These composites, which are fire-resistant, insulating, do not consist of volatile organic compounds from petrochemical products and can be used independently or in conjunction with regolith, could employ the living biological growth in a controlled environment, for the process of material fabrication, assembly, maintenance, and repair, providing structures resilient to extra-terrestrial hazards. The paper will outline the potential and challenges of using bio-composites for space applications and will present how these might be addressed, in order to make this biological approach feasible, providing new, growing materials for design habitats on long-duration missions.

Monika Brandić Lipińska↗

Influence of Coating Method on the Performance of Roll-to-Roll Coated PEM Fuel Cell Catalyst Layers

As production of fuel cell vehicles and power systems increases there is a need to understand the process science of fuel cell manufacturing. Industrial production of polymer electrolyte membrane fuel cell (PEMFC) electrodes will rely on continuous roll-to-roll (R2R) coating methods to meet the rates needed for mass production. There are a variety of coating methods that could be used to coat catalyst layers. The different physics of each method may result in different morphologies and performance. Here we present the results of a study comparing fuel cell catalyst layers coated using two R2R coating methods: slot-die and gravure. These two methods were selected because the physics of applying the liquid to the substrate is very different between the two cases. Pt/C catalysts layers were coated directly onto carbon-fiber gas diffusion media to create gas diffusion electrodes (GDEs), without the use of a decal transfer process. These GDEs were assembled into membrane electrode assemblies (MEAs) by hot pressing to Nafion membranes. In situ performance and other electrochemical diagnostics were used to determine the influence of coating method on catalyst layer electrochemical properties. Electron microscopy was utilized to understand the influence of coating method on electrode morphology and its influence on electrochemical properties. We also explored the influence of solvent ratio to understand the potential coupling between ink formulation and coating methodology.

DIRECT ENERGY CONVERSION,MATERIALS SCIENCE↗

Dynamic Modeling of Process Technologies for Closed-Loop Water Recovery Systems

Detailed chemical process simulations are a useful tool in designing and optimizing complex systems and architectures for human life support. Dynamic and steady-state models of these systems help contrast the interactions of various operating parameters and hardware designs, which become extremely useful in trade-study analyses. NASA s Exploration Life Support technology development project recently made use of such models to compliment a series of tests on different waste water distillation systems. This paper presents dynamic simulations of chemical process for primary processor technologies including: the Cascade Distillation System (CDS), the Vapor Compression Distillation (VCD) system, the Wiped-Film Rotating Disk (WFRD), and post-distillation water polishing processes such as the Volatiles Removal Assembly (VRA) that were developed using the Aspen Custom Modeler and Aspen Plus process simulation tools. The results expand upon previous work for water recovery technology models and emphasize dynamic process modeling and results. The paper discusses system design, modeling details, and model results for each technology and presents some comparisons between the model results and available test data. Following these initial comparisons, some general conclusions and forward work are discussed.

Allada, Rama Kumar↗

Conductive Adhesives for Metallization of Interdigitated Back Contact Solar Cells

The metallization and interconnection of Si solar cells to form a module is usually a multi-step process: cells are metallized individually, soldered into strings, and subsequently assembled into a module. Furthermore, the metallization process for individual cells must be compatible with the doped surfaces being contacted, which creates additional challenges when moving from diffused junctions to heterojunctions and/or passivated contact structures. To mitigate these problems and streamline module manufacturing for the case of interdigitated back contact (IBC) cell modules, we developed an approach wherein unmetallized IBC cells are bonded directly to a circuitized backsheet using a conductive adhesive (CA) that only conducts out-of-plane. The metal/CA/silicon stack is bonded by hot-pressing at 100-200 degrees C.For a CA consisting of ethylene vinyl acetate (EVA) filled with Ag-coated spheres or indium powder we find that contact resistivities in the range of 1-10 Wcm 2 are obtained, regardless of which conductive filler and which hot pressing parameters are used. XPS revealed that about 1-2 nm EVA residue bonds to the Si in these samples, suggesting the formation of an insulating barrier that is responsible for the high contact resistance. Using indium powder alone, improved contact resistivities <0.6 Wcm 2 , high shunt resistances, and an implied open-circuit voltage loss below 10 mV were obtained. Furthermore, a cost estimate is presented, indicating that substantial cost savings of up to $10/m 2 , or about $0.05/W DC , are possible through CA-based IBC module manufacturing.

14 SOLAR ENERGY↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Ghaffarian, Reza↗

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

MLF↗